PCB电路板术语

1、PCB Jargon (PCB专业术语)AAbsorption 吸收、吸入Accelerated Test (Aging) 加速试验、加速老化Accelerator 加速剂、速化剂Accept/Acceptance 允收Acceptable Quality Level (AQL ) 允收品质水准Accuracy 准确度ACF : Adhesive copper foil有胶铜箔Activator活化剂、添加剂比称为ActivatorActive parts ( Devices )主动零件，指积体电路或电晶体Addition Agent 添加剂Additive Process 加成法、分全加成、

2、半加成及部份加成Adhesion 附著力Adhesive胶类或接著剂Aging老化Air Knife 风刀Ambient Temperature环境温度Ampere 安培Amp-Hour 安培小时Annular Ring 孔环Anode阳极Anode Bag 阳极带ANSI: American National Standard Institute美国标准协会Anti-Forming Agent 消泡剂AOI: Automatic Optical Inspection自动光学检验Aperture 开 口APQP: Advanced Product Quality PlanArray排列、阵列A

3、rtwork 底片ASIC: Application Specific Integrated Circuit特定用途的积体电路器Aspect Ratio 纵横比、板厚与孔径之比值Assembly 装配、组装ATE: Automatic Testing Equipment自动电测设备AVL: Approved Vender List合格供应商BBack Light ( Back Lighting ) 背光法Back-UP 垫板Backpanels/ Backplanes 背板、支持板，厚度较厚，Ball Grid Array ( BGA ) 球脚车列(封装)Barrel孔壁Base Materi

4、al 基材Batch批(同时间发料某一数量的板子)Bevelling 切斜边Binder黏结剂Black oxide 黑氧化层，另有棕氧化( Brown Oxide )Blind Via Hole 盲导孔Blister局部性分层或起泡Blockout封网，网板之空网处以水溶胶涂满Blow Hole 吹孔，PTH孔壁有破洞(void)所造成Boiler (Water Tube Boiler/ Fire Tube Boiler)BOM: Bill of Material 用料表Bond Strength 结合强度Bonding Sheet(Layer)接合片、接著层，指 PPBonding Wir

5、e 结合线，IC之晶片与PCB之引线Bow板弯Break-away Panel可断开板或者说 Break Away TabBreak Point 出像点、影像点Break-Out破出(钻孔破出开成断环情形)Bridging搭桥、桥接Brightener 光泽剂Brush Plating 刷镀BTU/British Thermal Unit 英制热量单位Bump突块Buried Via Hole 埋导孔Burn-in高温加速老化试验Burning 烧焦Burr毛头Buy-off 认可CCAD: Computer Aided Design电脑辅助设计CAM: Computer Aided Manu

6、facturing电脑辅助制造CAT: Computer Aided Testing电脑辅助测试Capacitance 电容Carbide碳化物、碳化鸨钻头CAR: Corrective Action Report 改善报告Carbon Treatment活性碳处理Card卡板Carrier 载体Cartridge 滤芯Cathode 阴极CCL: Copper Clad Laminates 铜箔基板Ceramics 陶瓷Certificate 证明书CFC 氟氯碳化物 Chloro-Fluoro-CarbonChamfer倒角、去掉直角Characteristic Impedance 特性阻

7、抗Cheek list 检察清单Chip晶粒、晶片Chip On Board晶片黏著板Clean Room 无尘室(Class 100)Cleanliness 清洁度Clearance 余隙、余环COB (Chip on Board )晶片在板上直接组装COC (Certificate of Compliance )出货合格书COF ( Chip on Flexible PCB )COG (Chip glass )Coefficient of Thermal Expansion热膨胀系数(CTE )Cold Solder Joint 冷焊点Component Hole 零件孔Component

8、 Side 组件面、零件面Conditioning 整孔Conductivity 导电度Connector 连接器Continuity Test 连通性试验Copper Foil铜箔、铜皮Copper Ball 铜球Corner Crack 镀通孔转角断角Cp: Capability of Process 制程能力指数Crack裂痕Crazing白斑(基板外观上的缺点)Crosstalk杂讯、串讯Cure/Curing 硬化、热化Current Density ( C.D.)电流密度(1 ASD=9.1 ASF )Curtain Coating 液涂法 DDatum基准点Deburring 去

9、毛头Defect不良缺点Degreasing 脱月旨Delamination 分层、爆板Dent凹陷、缓和均匀的下陷Desmearing 除胶渣Developer 显像液Deviation 偏差Device 电子元件Dewetting 缩锡异物、杂质DFM: Design for Manufacturing/Dirty foreign MaterialsDie冲模Dielectric 介质Dielectric Constant 介质常数Dimensional Stability尺度安定性DIP ( Dual Inline Package ) 双排脚封装体Direct Plating 直接电镀D

10、I Water 纯水(De-Ionize Water) DOE/Design of Experiment实验计划法DPPM ( Defect Parts Per Million ) Drilling 钻孑L Drill Bit 钻针 Dry Film 干膜 Dummy假镀EECN: Engineering Change Notice工程变更通知Elongation 延伸性EMI 电磁干扰 Electromagnetic InterferenceENIG: Electroless Nickel Immersion Gold化馍浸金Entek有机护铜处理Entry Material 盖板E.T/E

11、lectric Test 电测、电气测试Epoxy Resin 环氧树脂ESD: Electro-Static Discharge 静电流量Etching 蚀刻Etchback 加蚀Etch Factor 蚀刻函数Etching Resist抗蚀阻剂Expose Copper 漏铜Exposure 曝光Eyelet 挪钉 RivetFFAAR (First Article Approval Report )Failure故障、损坏Fault缺陷、瑕疵FCC/Federal Communication Commission美国联邦通讯委员会Fiber Exposure 玻织显露Fiducial

12、Mark 基准记号、光学点Film底片Filter过滤器Fine Line 细线Finger 手指Finishing制成品在外观上的最后处理First Article试产的首件或首批小量产品First Pass-Yield 初检良品率Fixture 夹具、治具 (Rig and Fixture)Flame Resistant 耐燃性(分 HB、VO、V1 及 V2 等四级)Flux助焊剂Foil Burr铜箔毛边Foot Pint (Land Pattern ) 脚垫Foreign Material 外来物、异物FR4/Flame Resistant Laminates耐燃性积层板材Frequ

13、ency 频率GGauge 量规Gel Time胶化时间Gerber Data/Gerber File 格搏档案Glass Fiber 玻璃纤维Glass Fiber Protrusion玻纤突出Glass Transition Temperature/Tg玻璃态转化温度Golden Board 测试用标准板Grid标准格Ground Plane 接地层 Guide Pin 导针 HHaloing白圈、白边(在钻孔、开槽等机械动作一旦过猛时将造成内部树脂之破碎或微小分层裂开的现象) Hardener硬化剂 Hardness 硬度 Heat Dissipation 散热 Hertz ( Hz)赫

14、芝HEPA/High Efficiency Particulate Air Filter高效空气尘粒过滤机Hipot Test 高压电测 High Potential Test Hit 擎Holding Time 停区时间Hole Block 孔塞Hole Breakout 孔位破出，简称 BreakoutHole counter 数孔机Hole Density 孔数密度Hole Pull Strength孔壁强度Hole Void 破洞Hot Air Levelling 喷锡 HASL/HALTHE(High Temperature Elongation)高温延伸性II.C.Socket积体

15、电路插座Image Transfer 影像转移IMC: Inter-metallic compound介面合金共化物Immersion Plating 浸镀Impedance 阻抗In-Circuit Testing 组装板电测，ICTIndexing Hole 基准孔Infrared(IR) 红外线Ink油墨Inner Layer 内层Input/Output 输入、输出Insert/Insertion 插接、插装 Insulation Resistance绝缘电阻Integrated Circuit (IC)积体电路器Interconnection 互连 Intermatallic Com

16、pound(IMC)介面合金共化物Internal Stress 内应力 Ion Cleanliness 离子清洁度 Ionic Contamination 离子污染 IPC: The Institute for Interconnecting and Packaging Electronic Circuits美国印刷电路板协会ISO: International Organization for Standardization国际标准组织Isolation 隔离性 J JPCA/Japan Print Circuit Association日本印刷电路工业会Just-In-Time(JIT)

17、适时供应KKeyboard 键盘Kraft Paper 牛皮纸LLaminate(s) 基板、积层板Laminator 压膜机Land孔环焊垫、独立点Landless Hole 无环通孔Laser Direct Imaging/LDI 雷射直接成像Laser Photoplotter 雷射曝光机、绘图机Lay Out 布线、布局 (configuration, general arrangement)Lay Up叠合Lead Frame 脚架Lead引脚、接脚Legend 文字标记Levelling 整平Light Intensity 光强度LMW: License Manufacturing

18、 Warehouse 保税厂Lot Size 批量LRR(Lot Reject Rate) MMajor Defect 严重缺点、主要缺点Marking 标t己Mask阻剂Mass Lamination 大型压板MCM/Multi-Chip Module 多晶片模组Measling 白点Membrane Switch薄膜开关Microctching 微蚀Microsectioning微切片法Migration 迁移Mil 英丝 0.001 inmisregistration 对不准、对不准度MLB/Multi-Layer Board 多层板Modem调变及解调器、数据机Modification

19、 修改、改变Module模组Mother Board 主机板NNail Head 钉头N.C.数值控制(Numerical Control )Negative 负片Negative etch-back 反回蚀Nick 缺口Node节点Nodule 瘤Non-Conformance不合格品Non-flammable 非燃性Non-wetting 不沾锡Normal Distribution常态分配NPI ： New project introduction)NRE Charge-Non-Recurring Engineering Charge不会重收的工程费用OOhm欧姆Omega Meter

20、离子污染检测仪Open Circuits 断线Optical Density 光密度Optical Inspection光学检验Organic Solderability Preservatives(OSP)有机保焊剂Outgassing 出气、吹气Output产出、输出Overflow 溢流Oxidation 氧化Ozone Depletion臭氧层耗损PPackaging 封装、购装Packing 包装Pad配圈、孔环焊垫Panel Plating 全板镀铜Passive Parts 被动零件，如电阻、电容Past 膏(锡膏 Solder Paste )Pattern Plating线路电

21、镀PCB/Printed Circuit Board 印刷电路板Peel Strength 抗撕强度Peripheral周边附属设备Phototool底片(一般指偶氮棕片Diazo Film )Pin Grid Array(PGA)矩阵式针脚封装Pinhole 针孔Pin接脚、插梢、插针Pink Ring 粉红圈Pits凹点(小面积下陷)Pitch脚距、垫距、线距Plasma电浆Plated through Hole/PTH 镀通孔Plug插脚、塞孔Polarization 分极、极化Polyimide(PI)聚亚酸胺Popcorn Effect 爆米花效应Post Cure 疏孔度试验Pow

22、er Plane 后续硬化、后烤Power Supply 电源层PPM/Parts Per Million百万分之几Preheat 预热Prepreg胶片、树脂片Press Plate 压合钢板Press-Fit Contact挤入式接触Printing 印刷Probe探针Profile轮廓、部面图、升温曲线图积线Punch横切、冲床 QQIT(Quality improvement Team) 品质改善小组 Qualified Products List合格产品(供应者)名单R Radiometer 辐射计、光度计 Radius尺角、半径 Reference Dimension参考尺度、参考

23、尺寸Reflow Soldering重熔焊接、熔焊Registration 对准度 Reject剔退、拒收 Reliability可靠度、信赖度 Repair修理 Resin Content 胶含量、树脂含量 Resin Flow胶流量、树脂流量 Resist阻剂、阻膜 Resistor电阻器、电阻 Resolution 解像、解像度、解析度 Resolving Power 解析力、解像力(分辨力) Rework(ing) 重工、再加工 Ring套环 Roller Cutter混切机(俗称锯板机) Roller Coating 滚动涂布法 Routing切外型、捞外型 RRM: Revolut

24、ions per Minute 转速(每分钟) Run-out偏转、绕转、累积距差 S SCAR(Supplier CA Request)供应商改善报告SCM: Supply chain Management供应商管理系统Scratch舌1J痕 Screen Printing网版印刷Scrubber磨刷机、磨刷器 Selective Plating 选择性电镀SEM/Scanning Electron Microscope扫瞄式电子显微镜Semi-Conductor 半导体Shearing 剪、裁切Short短路SIR(Surface Insulation Resistance) 表面绝缘电阻

25、Side Wall 侧壁Sigma(Standard Deviation) 标准差Signal讯号Silicon 矽Silk Screen 网版印刷、丝网印刷Skin Effect集肤效应Skip Printing 漏印Slot槽孔Smear胶渣SMT/Surface Mount Technology表面黏装技术Solder焊锡Solderability 焊锡性Solder Ball 锡球Solder Bridging 锡桥Solder Bump 焊锡凸块Solder Dam 锡堤(IC脚间的防焊)Solder Levelling 喷锡、热风整平Solder Mask(S/M)绿漆、防焊膜So

26、lder Paste 锡膏Solder Plug 锡塞、锡柱Solder Pot 锡炉Solder Side 焊锡面Soldering Fluid/Soldering Oil 助焊液、护焊汕Solid Content 固体含量SOP(Standard Operation Procedure) 标准作业程序Spacing 间品巨SPC/Statistical Process Control 统计制程管制Specific Gravity SG 比重Specification(Spec)规范、规格Specimen 样品、试样Spindle 钻轴Spray Coating 喷著涂装Stencil版膜、

27、网版Storage condition 储存条件Stress Relief 消除应力Substrate 底材Surface Insulation Resistance(SIR)表面绝缘电阻Surface Tenting 表面张力Surface-Mount Device表面黏装零件Swelling Agents/Sweller膨胀齐 USWR(Special Working Request)试产前之 特殊工作要求”TTab接点、金手指Tape撕胶带试验Teflon铁氟龙Temperature Profile温度曲线Template 模板Tensile Strength 抗拉强度Tenting 盖

28、孔法Terminal 端子Thermal Stress 热应力Thermal Shock 热冲击Thin Copper Foil 薄铜箔Then film Technology薄膜技术Throwing Power 分布力Tolerance 公差Touch Up检修(简单的工具在手操作下即可进行的小规范的检修，称之 Touch Up或Rewok有些类似)Trace线路、导线Traceability追溯性、可溯性Transistor 电晶体Transmission Line 传输线Twist板翘、板扭UUL 保险业试验 Underwriters Laboratories/INCUltra Viol

29、et Curing(UV Curing)紫外线硬化Ultrasonic Cleaning 超音波清洗Undercut/Undercutting 侧蚀Universal Tester 万用型电测机VVacuum Lamination 真空压合Vacuum Packing 真空包装Viscosity黏滞度、黏度Vision Systems 视觉系统Visual Examination(Inspection) 目视检查Voltage 电压WWafer晶圆Warp/Warpage 板弯Warp and Twist 板弯翘Washer垫圈Waste Treatment 废弃处理Water Absorption 吸水性Water Break 水膜破散、水破Watermark 水印Wave Soldering 波焊Weave Exposure织纹显露Weave Texture 织纹隐现Welding 熔接Wet Process 湿式制程Wetting