SUSE HPC基础架构解决方案

1、SUSE HPC基础架构解决方案Breadcrumbs2产品概述技术特点产品路线图使用场景成功案例内容3产品概述Why SUSE HPC?到20231年，全球HPC收入预计将超过199.5亿美元大数据与HPC相结合，创造了新的解决方案，为HPC领域增加了许多新的用户/购买者（AI / ML / DL和HPDA是热门的新领域）SUSE在前50名超级计算机（7 RH，9 CentOS）中运行SUSE占领了前100名，CentOS在“小型”超级计算机中获得了份额商业OS份额前500名（在列表中代表100台超级计算机）：SUSE 53，RH 24，burx 17，Ubuntu 61 Hyperion

2、Research, November 20192 Top500 Supercomputer Report, November 2019SUSE HPC 市场地位HPC Top 500 付费操作系统6技术特点SUSE Linux Enterprise High Performance ComputingHPC捆绑包与受支持的HPC软件包超出了操作系统支持Aarch64（Arm）和x86-64许多IHV / ISV / CSP合作伙伴多种产品lifecycle选择性价比高SUSE HPC 项目SUSE Linux for HPC & the HPC moduleSUSE Enterprise St

3、orageSUSE Package HubHPC ContainersArm: the emerging platformHPC in the CloudAccelerator enablementWhy SUSE Linux For HPC?具有企业支持的企业Linux安全事件需要快速响应以解决系统漏洞不只是一个操作系统-包含和支持的HPC软件SLE HPC包括流行的HPC软件，例如Slurm和OpenMPI头节点，计算节点，开发节点的部署模板价格优惠的订阅适用于HPC的SUSE Linux为大型和小型HPC配置定价在HPC中的可靠记录前100个HPC系统中有50运行SUSE Linux或基

4、于SLE的操作系统SUSE Linux HPC Module 简化支持的HPC软件包SUSE通过SUSE Linux Enterprise HPC支持的所有软件包适用于x86和基于Arm的平台SLE HPC 12和SLE HPC 15 MUNGEScaLAPACKgendersSUSE HPC 参考架构12产品路线图SUSE Linux Enterprise High Performance Computing2019202220212020202315 SP112 SP515 SP315 SP2New Product: SUSE Linux Enterprise HPC 15 Multi m

5、ode OS delivery SUSE Linux Enterprise Tailored for HPC workloadsPeriodic HPC module updatesSystem role installation templatesHPC Head NodeHPC Compute NodeHPC Login NodeUpgrade from SLES 12 for HPCCommon Code Base Architecture/platform supportArch64, x86-64Designed for physical deploymentsBase OSLast

6、 service pack for SUSE Linux Enterprise for HPC 12 SP5Consolidation releaseConstant user land (minor version upgrades by need or business case)Reuse kernel from SP4 + very selected hardware innovations (including graphic stack)Periodic HPC module updatesArchitecturesArch64, x86-64Base OSImproved doc

7、umentationImproved Day 1 and Day 2 manageabilityAdditional platform support including new Arm SoCAdditional AI/ML enablementHPC in the Cloud featuresVirtualized Head Node supportKubernetes for HPCEnhanced Containers for HPCAdditional HPC module packagesLive Patching Extension HPC platform specific t

8、uning optimizationPeriodic HPC module updatesArchitecturesArch64, x86-64Base OSContainers for HPCNew kernel version 5.3Slurm updated to 20.02Additional platform support including new Arm SoCSimplified access to proprietary drivers (staged)AI/ML enablement (staged)Additional HPC module packages Perio

9、dic HPC module updatesArchitecturesArch64, x86-64Base OSSUSE and partner selected hardware enablement, including driver updatesTuning for HPCTwice yearly HPC module updatesArchitecturesArch64, x86-64Information is forward looking and subject to change at any time.HPC moduleSUSE Linux Enterprise 15 S

10、P1SUSE Linux Enterprise 12 SP5SUSE Linux Enterprise 15 SP2SUSE Linux Enterprise 15 SP3SUSE Linux Enterprise 1514使用场景Advanced Data AnalyticsHPC/AI use casesBanking/FinanceAutomotive & TransportationRetailRisk modeling in determining aggregate risk in financial portfoliosFraud detection in real time a

11、s millions of transactions are processed between disparate systemsCybercrimeHigh-frequency trading applicationsPricing & regulatory complianceAutomotive modeling and designSelf driving, autonomous vehiclesImage/Facial RecognitionLogistics and mappingImage taggingSpeech recognitionSentiment analysisH

12、ealthcareSecurity & SafetyOil & GasPrecision and personalized medicineOn-demand diagnosis, diagnostic assistance and treatment plansDrug discovery and researchCancer cell detectionRemote surgeriesSmart cities and power gridsSurveillanceImage analysisFacial recognition and detectionOcean explorationS

13、eismic imagingReservoir characterizationSub-surface fault detection 16成功案例台湾前五大半导体厂商排名排名公司名称2017年收入2016年收入同比增减1台湾积极电路制造有限公司9479.38亿8434.97亿12.38%2联发科技2755.11亿2132.55亿29.19%3日月光半导体制造股份有限公司2748.84亿2833.02亿-2.97%4联华电子股份有限公司1478.70亿1448.3亿2.10%5矽品精密工业股份有限公司851.11亿828.39亿2.74%中国台湾半导体行业：台积电 晶圆代工之王目前台湾台积电(

14、TSCM)公司,20000+套操作系统由原来 Redhat 替换为 SUSE 操作系统Electronics Design Automation192018年台积电招聘IC 设计工程师（招募人数 10）Job Description:1. Be responsible for advanced chip implementation flow development, chip PPA boost, and support headquarter advanced technology for EDA router engagement.2. ASIC block-level implemen

15、tation and/or full-chip integration projects.3. Develop IC design methodology.Qualifications:1. MS or PHD in CS,EE related field with experience in APR, physical verification, chip implementation, or CAD algorithm.2. Knowledge of EDA partner (Mentor, Synopsys, Cadence, etc.) tools suite is a plus. E

16、specially Laker /Virtuoso /Calibre3. Expert in ASIC RTL-to-GDS design flow.4. Solid skill sets of Cadence/Synsopsys/Mentor EDA tools.5. Experience with TSMC 40nm technology.6. Experience in implementation signoff.7. Experience in tapeout with multi-million gates count SOC design. 28nm/40nm design ex

17、perience is a plus.8. .03020104SUSE价格成本低于RHEL价格对客户大概30套应用进行测试，sles各方面性能的优于RHEL，关键业务非常稳定性能 / 稳定全球本地支持，响应时间快、定期会议、定期报告、现场服务积极支持综合 价格 性能 支持等优势，因此客户选择了Suse。优 势TSUBAME touted as the “supercomputer for everyone”Predicting traffic congestion or share prices, simulating human organs, or forecasting the weat

18、her“The excellent management that SUSE Linux Enterprise Server provides is one of the key factors behind Tsubame 2.5s success.” Professor Satoshi Matsuoka, Global Scientific Information and Computing Center, Tokyo Institute of TechnologyBright Cluster Manager supports SUSE, enabling customers to deploy, manage and monitor SLES clusters using the familiar Bright interfaceBright Cluster Manager lets users monitor and build clusters of any size that are easy to provis