教程osram文件pfmea范本p-fmea

1、潜在过程失效模式及分析（过程FMEA）Potent i alFail ure ModeandEffectsysi s( P- FMEA)FMEA:FMEA Number页码:Page第页共 24 页项 目 名 称: Part Name / Description过程责任部门:Pros Responsibility Department关 键 日 期:Key DateOFOsarm T8 编 制 者:Prepared byFMEA日期:FMEA Date用途:LED 照明灯2011-2-1712-Feb-2011User APQP 小组 Core Team:过程功能ProsFunction潜在失

2、效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行预防过程控制 Current preventive Pro s Controls现行探测过程控制 Current Pros Controls Detection探测度（D）Detect风险顺序数 R.P.N.建议措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施执

3、行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.进料/货仓收料(确认接收物料,规格和数量正确)Materialing（confirm the QTY/Parts Number)部品和名称错误不能保证正常生产5/供应商来料混装2供应商评价确认部品和名称与送货单是否相符220无Parts number and name was wrongCant ensure produce5/Package mixed from vendor side2Assess vendorCheck if submit parts number

4、 as the indenture220N/A送货单上的数量与实物不符不能保证生产数量5/供应商来料少数2供应商评价确认实物与送货单上的数量是否相符220无ing number is difference with indentureCant ensure productty5/Shortage from vendor side2Assess vendorCheck if submit partsty as the indenture220N/A包装破损部品损坏4/包装材料差;在或搬运期间没保存好2供应商评价包装规范目视来料包装是否完好216无Packing damagedComponents

5、 damaged4/1.Packing is worst 2.Not be protected withransport and place2Repuest the vendor assessing specification for packingCheck the outer packing216N/AIQC来料检查 (部品规格,外观符合BOM和客户图纸 )IQC inginspect(parts spec. and appearance and size etc.)散热件刮花外观不良,客户投诉4/包装方法不当,材质差.2列入IQC检查基准书.IQC受入检查装配前100%目视检查.324无

6、Heat sink scratchethe surfaceAppearance defect,user complain4/Package unapt or materials worst2Write this item in IQC Work Instruction1.IQC inspect 2.100% checked before assembly324N/A散热件有毛刺外观不良4/模具损坏或调试不当2IQC检查基准书中追加此项目.IQC受入检查装配前100%目视检查.324无过程功能ProsFunction潜在失效模式 Potential Failure Mode潜在失效Potenti

7、al Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行预防过程控制 Current preventive Pro s Controls现行探测过程控制 Current Pros Controls Detection探测度（D）Detect风险顺序数 R.P.N.建议措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施执行结果Action resultsRequirement采取的措Taken

8、严重度 SEV频度 OCC探测度 DETR.P.N.Some burrs with Heat sinkAppearance defect4/Mould is bad,or setting unapt2Write this item in IQC Work Instruction1.IQC inspect 2.100% checked before assembly324N/A五金件尺寸差异不能装配8供应商模具损坏,变形,或者生产时工艺参数设定不当 Setting up unfit parameters at thers produce line,or the mould ofrdamaged3

9、CTQ尺寸列入IQC测量基准书.Key-size(CTQ) recorded in IQC WIIQC受入检查装配前100%目视检查 (CTQ尺寸参考客供图纸)1.IQC inspect 2.100% checked before assembly* CTQ control porefer to parts drawing3721.供应商严格按照CTQ尺寸进行管 控,2.IQC对 供应商进行监察,每月进行评价. 1.Vendor must be managedt submit the key- poasCTQrequired. 2.Audit and assess vendor periodi

10、c.IQC/befor C- sle已将OSM提供的图纸中的 CTQ尺寸给供应商82348Handware size over spec.Cant assemble8电线尺寸差异不能装配/爬电距离不够8Wire size over spec.Cant assemble/safety ies8塑胶件尺寸差异不能装配8Plastic size over spec.Cant assemble8灯座PIN变形量规通不过、爬电距离不够8包装方法不当,材质差.3IQC检查基准书中追加此项目.IQC受入检查装配前100%目视检查.372供应商严格按照CTQ尺寸进行管 控,IQC对供应商进行监察,每月进行评价

11、.IQC/C-sle前已将OSM提供的图纸中的CTQ尺寸给供应商，供应商采用 JIG100%检查确认82232Lbase deform/whorl less/glass breakGauge test NG/safety ies8Package unapt or materials worst3Write items in IQC WI1.IQC inspect 2.100% checked before assembly372Vendor must controlt submit the key- poas CTQ required. Audit and assess vendor peri

12、odic.IQC/befor C- sleRequest supr to 100% check with the gauge.82232过程功能ProsFunction潜在失效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行预防过程控制 Current preventive Pro s Controls现行探测过程控制 Current Pros Controls D

13、etection探测度（D）Detect风险顺序数 R.P.N.建议措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施执行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.包装材料颜色差异4/包材来料不良2IQC检查基准书中追加此项目.对照色卡进行检查.IQC受入检查装配前100%目视检查.432无Different color for PackingEnd user complain4/e defect21.Write in IQC WI 2.Base on the

14、 color sle to check1.IQC inspect 2.100% checked before package432N/A包装材质与仕样书不符不能保护产品4/供应错材料;2IQC检查基准书中追加此项目.IQC对照样品检查.432无Packing didnt submit the spec.Product cant be protected4/Vendor use wrong materials2Write in IQC WIBase on the sle to check432N/A部品损坏不能装配5/包装材料差;在或搬运期间没保存好2供应商评价包装规范对来料外观进行检查330无

15、Parts damagedCant assemble5/1.Packing is bad 2.Protection badness at transporion and place2Repuest the vendor assessing specification for packingIQC sle check330N/ALED Bin 混整灯的亮度色温差异7/供应商来料混.2检查员使用扫描系统确认用扫描系统核对检查342无LED BixedBrightness and color Temp. differential of whole l7/Mixed fromr2Use the sca

16、ncer system to controlUse the scancer system to check,and then detect.342N/A生产物料配送Kitting没有按先进先出管控材料过期影响产品品质5/入仓材料标识不明确2入仓前在物料盘上贴条形码贴纸进行区分管理每月对物料进行盘点IQC定期对库存品进行330无t observe FIFOOver the use phase and affect quality5/Marker unclear and place mixed2Attached bar code to define and controlMake an inven

17、tory of all material every monthIQC do sle check periodic330N/A过程功能ProsFunction潜在失效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行预防过程控制 Current preventive Pro s Controls现行探测过程控制 Current Pros Controls Detect

18、ion探测度（D）Detect风险顺序数 R.P.N.建议措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施执行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.温湿度材料氧化5/未对保管条件进行管控2在仓库中挂温湿度计进行;使用空调系统确认温湿度计实际值并进行;220无Temperature and humidity over the spec.Material oxidize5/t control the condition.21.Use meter to con

19、trol 2.Adjusting by air- conditionDo the record and check every day220N/A捺印&装基板&上板框（捺印 LED BIN 与贴装物品一致,PCB贴装位置正确;基板和板框装入方向正确） Input PCB boardLED BIN捺印错误或漏捺印LED用错或贴装后无法追溯8捺印不清楚2制作捺印解说WI及捺印对照表班长每天早上用WI对操作员进行教育,不定期348Stis wrong or loss stLED Bixed8stunclear and miss st2make WI for st Teach operator.Ope

20、rator be teached and check random248贴板错误印刷机不印刷或印刷乱5/贴板方法不清楚2作成贴板WI,明确贴板方法班长每天早上用WI对操作员进行教育,不定期330无Put wrongitionSoldaste can not be pr5/method of put PCB on holder is unclear2Define the method in WIOperator teach and check random330N/A基板装反 PCB install the wrong direction设备不能正确识别Fixture didnt identif

21、y5/操作员装反2WI中明确基板装入板框方向班长每天早上用WI对操作员进行教育,不定期330无5/Operator mistake2Show the direction in WIOperator teach and check random330N/A过程功能ProsFunction潜在失效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行预防过程控制 Curren

22、t preventive Pro s Controls现行探测过程控制 Current Pros Controls Detection探测度（D）Detect风险顺序数 R.P.N.建议措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施执行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.5/板框安装方向未说明2WI中对板框安装方向进行说明班长每天早上用WI对操作员进行教育,不定期330无5/t show the direction at the PCB casing

23、2Show the direction in WIOperator teach and check random330N/A锡膏印刷 (锡膏印刷位置、面积正确且用量均匀)Soldr (location and volume fit)印锡过厚、过薄Soldasteheightover spec.元件贴装后多锡或少锡No solder or more sloder after mounting5刮刀磨损或压力不符3定期更换刮刀，安装前进行确认。气压在设备日常保养表中，制造/成型条件确认表中确认； 3.WI中体现锡膏印刷厚度1.生产或更换型号生产时首件要做锡膏厚度测试；2依钢网操作指导进行确认；3.

24、定期保养钢网4.追加手动清洁刮刀345无Scrr abraded or press over spec.Change the scrr perioheck before using.Press check base on.Spec of soldaste height wrote in WI1.Soldaste height test every change line 2.Check base on WI 3.Maahe stencil mask periodic4.Added manual clean for crr345N/A1.印刷速度快，2.补充锡膏量3WI中规定刮刀印刷速度；规定锡

25、膏一次加锡量为约250g，制造成型条件表中确认设定一次供给锡膏可印刷的块数345无Pred speed over spec.soldaste unfull3Specification recorded at WIThe rules of adding paste is 250g every times.1.Do record at 2.Setup machine warning when soldaste unfull345N/A/钢网清洁不干净3设定每4H手动清洁钢网一回SMT钢网、刮刀清洁表345无/Stencil mask dirtyManual clean Stencil mask o

26、nce per 4HDo record345N/A过程功能ProsFunction潜在失效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行预防过程控制 Current preventive Pro s Controls现行探测过程控制 Current Pros Controls Detection探测度（D）Detect风险顺序数 R.P.N.建议措施mended

27、Action(s)完成日期Reponsibilit y& CompleteDate措施执行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.锡膏搅拌不充分3按照锡膏管理基准书作业在锡膏使用管理表记录345无过程功能ProsFunction潜在失效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行

28、预防过程控制 Current preventive Pro s Controls现行探测过程控制 Current Pros Controls Detection探测度（D）Detect风险顺序数 R.P.N.建议措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施执行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.soldaste mixed unfull3Control Base on WIDo record345N/A锡膏在钢网上放置时间过长3W/I中规定锡膏未使

29、用时在钢网上放置时间发生异常时及时处理确认345无Soldaste keng on thestencil over limit3Show time Spec.of solder paste stay at stencil in WIhandleime when bursting345N/A印锡漏印、偏位 No solder paste,solder paste shift元件贴装欠品，偏位，竖立 Parts missing, shifting,upright5钢网孔堵塞3设定每4H手动清洁钢网一回锡膏检查机对印刷状态进行检查345无Hole jammed3Manual clean Stenci

30、l mask once per 4H3X Visual Inspection345N/A基板偏位3调整最适合基板宽度的轨道锡膏检查机对印刷状态进行检查345无PCB shift3Adjust track3X Visual Inspection345N/A锡膏规格用错降低产品功能.5/操作员取用错误3WI中体现锡膏规格型号填写锡膏使用管理表345无Type of solder paste is mistakeFunction lower5/Operator choose wrong3Show Type Name at WIDo record345N/A锡膏印刷位置错误零件无法贴装导至元件欠品5/

31、钢网未标识，使用错误程序选用错位;3在程序一览表中体现钢网，钢网进行管理标示选用钢网时用程序管理一览表进行核对，制作钢网一览表345无prlocation is wrongParts cant mount5/1.stencil mask choosed wrong 2.Program choosed wrong31.show number of stencil mask at 2.Stencil mask marked and managedChecked base on345N/A锡膏检查(锡膏印刷位置、面积正确)Soldaste quality未检查出印刷锡膏偏位，少锡，漏零件无法贴装导至

32、元件欠品，裂锡，焊接不良5/锡膏检查机程序设定21.制作锡膏印刷样品，生产前对程序进行确认； 2.W/I中体现锡膏印刷面积基准及使用样品对检查程序进行确认填写锡膏印刷样品测试 表及印刷状况确认表330无过程功能ProsFunction潜在失效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行预防过程控制 Current preventive Pro s Control

33、s现行探测过程控制 Current Pros Controls Detection探测度（D）Detect风险顺序数 R.P.N.建议措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施执行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.inspect(locat ion,volume etc.)Defect cant detect such as shift and no pasteParts solder defect after mounting5/Fixtur

34、e program made insufficient21.Make sle to confirm. 2.Show Spec.at WI , check software base onsle.Do record330N/A过程功能ProsFunction潜在失效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行预防过程控制 Current preventive Pr

35、o s Controls现行探测过程控制 Current Pros Controls Detection探测度（D）Detect风险顺序数 R.P.N.建议措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施执行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.自动贴片(元件贴装位置及极性正确)SMT pick up(parts right,direction right etc.)元件漏贴装、错件、极性错产品无功能或性能不良No function8/元件贴装程序设置错

36、误；2工程技术T依元件座标作成实装程序.元件规格及元件位置按照BOM设定上料站位.对照程序管理一览表进行程序选用每台产品进行AOI、ICT测试及PQC目视检查。232无Parts missing,wrong parts,wrong direction8/Program set up wrong21.Make program base on parts specification 2.Mount the parts per BOM1 confirm the program type per program list 2.inspect by AOI/ICT/PQC232N/A偏位、破损8/吸嘴不

37、良 ；吸嘴高度设定不合理4定期对吸嘴进行保养；制作程序时选用正确物料规格及现物测量程序确认264制作吸嘴SMT3月底已购入吸嘴82232shift,damaged8/1.Nozzadness 2.Nozzle height set up illogical4Nozzle maain periodic.confirm pros of make programConfirme program264order spel NOZZLE for LED mountingSMTEnd of Mar.(C-sle)Use spel NOZZLE for LEDmounting82232错料7/作业员上料错误

38、.3作业员上料时拿排位表及BOM核对物料.首件确认每次换线或新型号生产时由制造部、品管部及制造技术T进行首件确认;作业员一个换料完成后 OK后再进行下一个物料更换操作。363无Wrong parts7/Operator put wrong parts3Checked base on BOM and Sion List.Do FA1.Do FA 2.Operator confirm one by one,and do record363N/ALED Bin 混用整灯的亮度色温差异8/作业员上料错误.3作业员上料时目视确认每次换线或新型号生产时由制造部、品管部及制造技术T进行首件确认;作业员一个换

39、料完成后 OK后再进行下一个物料更换操作。372当SMT自动贴片时，一卷 LED少于18颗时停止使用该卷，进行换 料，确保同一 R的LED使用在同一个灯管里SMT/PD3月底针对LED BIN的管理做成管理流程，全员培训，施行。82232过程功能ProsFunction潜在失效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行预防过程控制 Current preven

40、tive Pro s Controls现行探测过程控制 Current Pros Controls Detection探测度（D）Detect风险顺序数 R.P.N.建议措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施执行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.LED BixedBrightness and color differential of whole l8/Operator put wrong parts3Use the scancer sys

41、tem to control1.Do FA by PD/QA/ME 2.Operator confirm one by one,and do record372when the LEDs qty in one roll lessn 18pcs,stop this roll,change a new roll to mountingSMT/PDEnd of Mar.(C-sle)Control following LED BINcontrol pro s chart.82232LED贴装散热不好,产品寿命短8/元件贴装高度设定错误3测量高度,根据实际高度修正程序.贴装首件确认372使用吸嘴吸取L

42、ED部品SMT/3月底已购入吸嘴82232LED mounting shift or floatHeat dispersed difficult, llife lower8/Nozzle height set up illogical3Modify program according to actual sizeDo FA372Order the spel nozzle for mounting LEDSMT/End of Mar.Use the spel nozzle for mounting LED82232过回流焊(回流炉条件符合)Reflow( Submit temperature p

43、rofile the required )锡不充分融化产品无功能或性能不良No function7焊接温度设定过低;回流炉传送速度过快3在W/I中注明回流炉条件;设备条件在制造成型条件表中体现.1.生产前有炉温测试板测试回流炉参数 2.炉温曲线由以上确认签名363无solder non- wetting71.Temperature set up lower 2.Transport fast31.Show Profile STD at WI 2.Show the equipment index at the 1.Measuring once produce 2.Manager check rec

44、ords and sign363N/A基板变形、烧焦、破损PCB bending damage5焊接温度设定过高;回流炉传送速度过慢3在W/I中注明回流炉条件;设备条件在制造成型条件表中体现.1.生产前有炉温测试板测试回流炉参数,炉温曲线由以上确认签名345无过程功能ProsFunction潜在失效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行预防过程控制 Cur

45、rent preventive Pro s Controls现行探测过程控制 Current Pros Controls Detection探测度（D）Detect风险顺序数 R.P.N.建议措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施执行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.51.Temperature set up high 2.Transport slow31.Show Profile STD at WI 2.Show the equipmen

46、t index at the 1.Measuring once produce 2.Manager check records and sign345N/A6/送风冷却失败3技术检查设备并填写设备点检表由工程技术T每二小时对炉温变化进行点检确认;每次换线生产或新型号生产时做炉温测试并执行首件检查确认焊锡品质354无6/Cooling tooling failure3checked by eng.,and then do record1.Checked by engineer once/2H 2.Measuring once change line or new start354N/A元件偏移裂

47、开产品无功能或性能下降6/回流炉温度设定不适当识别精度下降3开始作业时，确认回流炉的加热器温度设定，传送带速度设定.对设备进行定期保养可通过PQC;AOI及FCT均可检查此现象354无Parts shift and damagedNo function6/1.Temperature profile setting up over Spec.2.Identify preci lower3Check reflow temperture and transporion speed before startPeriodic maahe equipmentsDetect by AOI,PQC,ICT,F

48、CT354N/A锡珠影响产品性能或异响5/钢网清洁不干净3设定每4H手动清洁钢网一回锡膏检查机对印刷状态进行检查345无Solder ballShort and noise when the solder ball drop5/Stencil mask dirty3Manual cleaning of stencil mask once per 4H3X Visual Inspection345N/AAOI检查(检查所有外观不良产品)AOI inspect (visual check)元件极性反、规格错误,反贴等不良无法检出 Cant check out the defect不良流出Defec

49、t pass down6/技术员编辑AOI测试程序时不正确2技术员依AOI操作办法及该型号BOM设定程序建立相同型号的 OK&NG样板进行检验确认336无6/Program have bug2Eng.edit program base on BOM and Operate GuideMake OK/NG sle to check336N/A过程功能ProsFunction潜在失效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mech

50、anism(s) of Failure频度（O）Occur现行预防过程控制 Current preventive Pro s Controls现行探测过程控制 Current Pros Controls Detection探测度（D）Detect风险顺序数 R.P.N.建议措施mended Action(s)完成日期Reponsibilit y& CompleteDate措施执行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.6/技术员测试程序2依AOI作业指示书进行程序选定每次换型号测试时技术员用相同型号OK &NG

51、样品进行验证确认336无6/Program choosed wrong2Set up program base onOk/NG sle check once change m336N/APCB分板 PCB Cutting基板破损功能不良,影响品质7/分板方法不正确.3制作分板治具,WI中明确分板方法及顺序首件确认分板后每片确认分板质量363无PCB damagedNo function7/method of cut PCB is wrong3order JIG for cut PCB,mentioned method in WI.Do buy-offOne by one check after

52、 cutting363N/ALED摆放LED表面刮花7/产品无周转工具2制作周转吸塑PQC全检228无No safeguard for LED PCBScratch on LED surface7/No device to transport and place2Plan some tray to transportInspection by PQC228N/AICT测试(对实装基板元件规格值,开短路进行检查)ICT testing(for drive PCB)测试错误产品无功能或性能不良7/ICT测试程式选择错误;作业员误判.31.制作ICT测试程序一览表,由技术员选择调试; 2.对作业员进

53、行技能培训,合格后颁发上岗合格证.生产前使用OK&NG样品检验设备;定期对技能操作者进行考核评估.363无Test faultyNo function7/program choosed wrongoperator judge wrong31.Make a list of program,for Eng. Referance. 2.Trahe worker to qualify1.use Ok/NG sle to check once change line2.Assessworkeriodic.363N/A等不良不能被检出产品无功能或性能不良5/ICT测试治具设计弊端.3ICT程序分析,列出不

54、能测试元件和位置.PQC对不能测试位置重点确认.345无过程功能ProsFunction潜在失效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行预防过程控制 Current preventive Pro s Controls现行探测过程控制 Current Pros Controls Detection探测度（D）Detect风险顺序数 R.P.N.建议措施mend

55、ed Action(s)完成日期Reponsibilit y& CompleteDate措施执行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.Defect such as bridge,short cant detectNo function5/Some bugshe design of ICT fixture31.Modify ICT software, 2.Make a parts list of cant detectPQpel inspect for ICT cant detect345N/A过程功能Pros

56、Function潜在失效模式 Potential Failure Mode潜在失效Potential Effect(s) of Failure严重度（s）SEV分类Class潜在失效起因/机理 Potential Effect(s) Mechanism(s) of Failure频度（O）Occur现行预防过程控制 Current preventive Pro s Controls现行探测过程控制 Current Pros Controls Detection探测度（D）Detect风险顺序数 R.P.N.建议措施mended Action(s)完成日期Reponsibilit y& Comp

57、leteDate措施执行结果Action resultsRequirement采取的措Taken严重度 SEV频度 OCC探测度 DETR.P.N.LED PCBA防湿油涂布Applydproof solvent around LED防湿油涂布量错误元件吸湿，功能降低8涂布作业方法不明确3W/I明确指示出防湿油的涂布量定期对技能操作者进行考核评估.首件确认/PQC巡检372one by one check when C-sle and fix on method3月底 End of Mar.已购入专用点胶机82232Apply quantum is wrongFunction lower8ap

58、ply method unclear3mentioned apply quantum in WI1.Skills on a regular basis for the operator to carry out the assessment examination. 2.Do FA /QA audit372Use fixture to apply.82232LED表面及LENS上粘有防湿油影响LED发光8涂布作业方法不明确31、W/I明确指示出防湿油的涂布量定期对技能操作者进行考核评估.首件确认/PQC巡检372增加紫光灯外观检查82232dproof slovent tounch LED s

59、urfaceAffect LED Lums.8apply method unclear3mentioned apply quantum in WI1.Skills on a regular basis for the operator to carry out the assessment examination. 2.Do FA /QA audit72Use UV l to check82232元件面及防湿油PQC检查 PQC inspect漏检或检测不到影响产品质量7/检查方法错误或不标准；目视判断;检查技能.3W/I中明确检查内容,顺序和方法；检查时用放大镜&紫光灯辅助全数确认;岗前培训

60、检查员,提高检查技能班长定期；指导员工按照W/I指示作业;定期对技能操作者进行考核评估.363无skipFunction lower7/Operator mistake3mentioned method in WIUse tool(purple l) to check 3.Operator teached1.Monitor audit 2.Periodic assess worker.363N/A修理(正确修理不良内容) Repair换错料产品性能不良,影响品质6/修理员换料时未确认上错料.3作成修理手顺及修理W/I,指导修理作业.修理OK后作记号和填写修理票多重检查进行确认354无Use t