回焊炉温设定演示文稿

回焊炉温度设定演示文稿当前1页，总共20页。优选回焊炉温度设定ppt当前2页，总共20页。Contents爐膛設計Profile四個區間說明融錫狀態PWI高溫影響CTE測溫線埋設爐溫升溫圖型說明速度與爐膛加熱計算模擬当前3页，总共20页。InsideofOven(加熱爐膛內部)HeatingIntheovenUseVitronicsXPM21030当前4页，总共20页。Reflowprofile当前5页，总共20页。Angle-chipforCapacitor当前6页，总共20页。tc1–smallSMDΔT:thesmallerthemass,thehotteritgets!

tc1–mediumSMDtc3–largeSMD当前7页，总共20页。TimeTemp.230°C250°Ctc1–smallSMDtc1–mediumSMDtc3–largeSMD20°C20°CSmallSnAgCuProcessWindowTooHot!TooCold!Peak:230–250°Ctc1–255Ctc2–235°Ctc3–225°C当前8页，总共20页。HighTemperatureProfilesforleadfreereflowsolderingHightemp.reflowprofilesareoftenrecommendedtosolderleadfreeassemblies.Peaktemperaturesupto260°Carewrittenintheliterature.Thisextremehightemperaturesmaydamagecomponents,PCBlaminateandinfluencesolderjointreliabilityandshape.SnPb SnAgCu SnAgCuTmax215°C Tmax235°C Tmax260°CComponent:ChipC1206AgPdBoard:NiAu

Pictures:Zollner,Zandt

LeadFreeReflowProcessConcerns当前9页，总共20页。LeadFreeReflowProcessConcerns:ComponentDamage225ºC250ºCVaporpressureinELCOPictures:PhilipsLFPeak:230°C–250°C??当前10页，总共20页。LeadFreeReflowProcessConcerns:ComponentDamage225ºC255ºCPictures:PhilipsLFPeak:230°C–250°C??当前11页，总共20页。240ºC270ºCDeformationofthermo-plasticcomponentbodiesLeadFreeReflowProcessConcerns:ComponentDamagePictures:JabilLFPeak:230°C–250°C??当前12页，总共20页。LeadFreeReflowProcessConcerns:OpenorNearOpenJointsResultofboardwarpageandcomponentbulgingduetohightemperaturePicture:Philips当前13页，总共20页。Theriskofmicrocracksincreasewiththedistancetothecenter.Ashigherthetemperature,ashighertheexpansionthermalexpansion(CTE)当前14页，总共20页。Highertemperatureincreasesmechanicalstressonsolderjoints当前15页，总共20页。FailuretoproperlymountTCswillresultinanunwantedT!ReflowMachineProfiling–TheMostImportantStep!X??SurfacemeasurementBGAballmeasurement当前16页，总共20页。ClassicalTemperatureProfileofaHotflow2/24Gradients deltaT PCB PBGASpeed:1m/minT=5,8°C!ThermalManagement:FlexibleProfiling–ClassicalSoak(1)HighPlateauTemperaturemaydamagePCBlaminate当前17页，总共20页。ThermalManagement:FlexibleProfiling–ClassicalSoak(2)ClassicalTemperatureProfileofaHotflow2/24Gradients deltaT PCB PBGASpeed:1m/minT=4,5°C!RaisingPreheattempcanreduceT

当前18页，总共20页。LinearTemperatureProfileofaHotflow2/24Gradients deltaT PCB PBGARunningjustalinearprofileonsuchahighsofisticatedmachinemakesnosense!DeltaTcanbereducedbydifferentsetup.T=9,3°C!Speed:1m/minThermalManagement:FlexibleProfiling–StraightLine(1)当前19页，总共20页。LinearTemperatureProfileofaHotflow2/24withflatpeakGradients deltaT PCB PBGASettingupaflatpeakwillre