SMT高级工程师教案

SMT高級工程師教案6SMT測試ATE工程師應注意及準備事項：1.當拿到R/DCADFILES時，請在A-TEST導入時分析該被測試之TESTABILITY2.在B-TEST導入ATE測試時，應注意版本變更之零件，規格；並分析下列資料： 名稱 數量PCBCADFILES(NEWVER)1BOM1ARTWORK1CIRCUIT1BEARBOARD1-2FUNCTIONM/B2-33.B-TEST後提出TESTABILITY報告.列出A-TEST&B-TEST之異差列出那些零件須加測試點及注意事項列出治具规定之注意事項列出LAYOUTTESTPAD及測試針之規格及注意事項其他R/D設計須附合治具程式控制之规定ATE工程師應注意及準備事項：R/D在LAYOUT時之節點至少要有一測試點(TESTPAD)線路途旳每一測試點(TESTPAD)，間距至少75MIL以上手插零件不需加測試點，但假如是CONNECTOR很密之零件視需要加測試點.CHIP除了空腳外，其餘各腳均需加測試點.假如是單面之被測試時，測試點要均勻分佈於測試板.假如是雙面之被測試時，測試點儘量LAYOUT在焊錫面.測試點附近之零件高度應小於0.255IN(視產品而定)測試點周圍0.018IN內不可有測試或零件PCB邊緣0.125IN內不可有測試點10.測試點到另一測試點不可小於0.083IN.125°.125°.125°PCBDEIGES.125°.125°.125°PCBDEIGES.125°.125°0.08272.1mm(82.7mil)MINIMUNDESIRABLETESTPADPOSITIONONG0.08272.1mm(82.7mil)MINIMUNDESIRABLETESTPADPOSITIONONG.035”(0.83MM).035”(0.83MM)11.所有導通孔及氣孔必須請PCB廠做MASK以防測試時漏氣12.定位孔之定位針之尺寸誤差在+-.002IN13.定位孔直徑大於0.012IN14.定位孔之內壁不可吃錫15.治具之定位孔要用CNC鑽孔**測試零件CHIP,CONNECTOR為設計重點**16.測試點不可被被綠漆蓋住(測試前用放大鏡檢查)**測試零件CHIP,CONNECTOR為設計重點**17.板邊至測試點約0.125IN不可有測試點.PCBOARDDATUMPOINTPCBOARDDATUMPOINTTOL±.002(.5mm)TESTPADTOL±.002(.5mm)(.5mm)TOL±.002TOOLINFHOLE18.測試點直徑不小於0.35/0.50in(35mil)，(目前約30mil)Solderpad(.09mm).035’SOLDERRESISTPROBETIPSolderpad(.09mm).035’SOLDERRESISTPROBETIP19.導通孔之中心間距要150mil以上20.各測試點必須吃錫，但邊緣不可被綠漆MASK21.如考量功能測試時，要在CONNECTOR最進處加測試點22.VCC點至少5點，GND點至少10點 以上為治具部份23.對IC或CHIP之控制位址線(如RESET，ENABLE…)不可直接接到VCC或GROUND上4.7KNEORCL4.7KNEORCL24.測試盪器須先除頻或加JUMPER控制10pf10pfVCC25.對POWER-ONRESET在設計，要有隔離之設計VCC4.7K4.7KRESETRESET0.1UF0.1UFVCCVCCVCCVCC414.7K414.7KOUT23OSCRESETOUT23OSCRESET26.對振盪器如有控制ENABLE.DISABLE之產品測試會更穩，否則須加除頻電路或善用JUMP亦是一個好措施27.對IC或CHIP之OPTION空腳要LAYOUT測試點28.BGA零件背面之PCB不可LAYOUT零件■元件值ICT■短路開路-ICBoundarySocan-ICPatternICT■IC元件功能■自動調■元件值ICT■短路開路-ICBoundarySocan-ICPatternICT■IC元件功能■自動調整ATE■組裝板功能測試測試設備旳功能及區隔■IC保護二極體■IC保護二極體■靜態測試■■靜態測試■動態測試-ICT：In-CircuitTester-ATE：AutomaticTestEquipment-ICT：In-CircuitTester-ATE：AutomaticTestEquipment-MDA：ManufactureingDefectAnalyzer-MDA：ManufactureingDefectAnalyzer測試步驟完成動態靜態產品完成動態靜態產品自動調整組裝板功能測試-ICBoundaryScan-ICPatternIC保護二極體IC元件功能元件值短路開路自動調整組裝板功能測試-ICBoundaryScan-ICPatternIC保護二極體IC元件功能元件值短路開路製造不良分佈高中低空板不良元件反插元件不良功能不良漏件/錯件短路/開路高中低空板不良元件反插元件不良功能不良漏件/錯件短路/開路測試成本不良比例高中低空板不良元件反插元件不良功能不良漏件/錯件短路/開路製造不良分佈及測試成本測試成本不良比例高中低空板不良元件反插元件不良功能不良漏件/錯件短路/開路OKANONTR-518TESCON50K美金以上IC保護二極體元件值短路開路50K美金以上TR-518F自動調整組裝板功能HPTERADYNE-BoundartScan-Pattern100K美金以上GenRadIC元件能價格產品測試功能測試設備旳市場OKANONTR-518TESCON50K美金以上IC保護二極體元件值短路開路50K美金以上TR-518F自動調整組裝板功能HPTERADYNE-BoundartScan-Pattern100K美金以上GenRadIC元件能價格產品測試功能測試治具In-Line測試治具壓合式測試治具真空測試治具雙面測試治具單面測試治具In-Line測試治具壓合式測試治具真空測試治具雙面測試治具單面測試治具加裝”導板”(GuidingPlate)加裝”導板”(GuidingPlate)正確選擇測試點正確選擇測試針頭高品質旳測試針SMT製造不良問題未來趨勢開路開路短路短路漏件/錯件漏件/錯件功能不良功能不良元件不良元件不良元件反插元件反插高中低高中低低ICPatternIC保護二極體元件值短路組裝板功能SMT中開路高產品測試未來趨勢低ICPatternIC保護二極體元件值短路組裝板功能中開路高AOIEQUIPMENT(AUTOOPTICALINSPECTION)PerformancestandardsinSMmanpowerinspectionDrivetoreducemonitoringandFocusonprocessScheduledemandsQualityandLncreasedcost,ElectricalininspectionProcessshipmentassemblyorSystemManufacturingkeeprisimanpowerinspectionDrivetoreducemonitoringandFocusonprocessScheduledemandsQualityandLncreasedcost,ElectricalininspectionProcessshipmentassemblyorSystemScreenprintingScreenprintingPickandplaceReflowElectricaltestSingle-sideSMTassemblyprocessandfinerpitchpackagLncreasingboarddensandfinerpitchpackagLncreasingboarddensaccesshardertoattailmakein-circuitfixtureaccesshardertoattailmakein-circuitfixtureRequirementtoinspecRequirementtoinspeccontrolRequirementforFast，high-defect-coverageinspectioncontrolRequirementforFast，high-defect-coverageinspectiontestableelectricallydefectclassesnot5500-SeriesAOIsystemsfromTeradyneprovideprocessmonitoringatanyprocessstepSMTboardassemblySMTboardassemblyLntegration/BoardElectricalThru-Pick/ScreenLntegration/BoardElectricalThru-Pick/ScreenWavePackagingTestFunctionalTestProcessloadholeReflowPlacePrintWavePackagingTestFunctionalTestProcessloadholeReflowPlacePrintPre-waveinspectionPre-waveinspection5515Bsystem5515BsystemBottm-sidesolderjointqualityComponentinsertionBottm-sidesolderjointqualityComponentinsertionPost-reflowinspection5529,5539systemsPost-reflowinspection5529,5539systemsComponentplacementSolderjointquality,includingJ-leadsandliftedleadsSingle-sideSMTassemblyprocessComponentorientationComponentpresenceandalignment5529systemPostplacementinspectionComponentorientationComponentpresenceandalignment5529systemPostplacementinspectionThetypicalpost-reflowSMTprocessDefectspectrumAOIandICTareoftenemployedtogetherasComplementarytoolsICTAOIICTAOIMisorienteddevice(cap,TombstonedLifteleadsUnwettedpinsMisorienteddevice(cap,TombstonedLifteleadsUnwettedpinsDeviceprogranmming(flashMissingdevicesdevicesMissingbypasscapsSkewed/misplacedLowsolderDeviceprogranmming(flashMissingdevicesdevicesMissingbypasscapsSkewed/misplacedLowsolderROM)MisorientedICsBillboardeddevicesDevices(stillconnected)ROM)MisorientedICsBillboardeddevicesDevices(stillconnected)diode)Devicedefects(e.g.cracked,ICWrongdevicesShortsConnectorpinspinsOpenpowerorparalleldiode)Devicedefects(e.g.cracked,ICWrongdevicesShortsConnectorpinspinsOpenpowerorparallelBasicdevicefunctionBGAandotherhiddenpinsBasicdevicefunctionBGAandotherhiddenpins+Dosenotrequireafixture+DosenotrequireafixtureBuiltboards+EasilyusedonpartiallyPossiblyboardfunction+Testscomponentfunction,andBuiltboards+EasilyusedonpartiallyPossiblyboardfunction+Testscomponentfunction,and+Directsoldering-process+Cantesthiddenfeatures+Appliesboardpower+Directsoldering-process+Cantesthiddenfeatures+AppliesboardpowerfeedbackfeedbackAOIandICTareoftenemplpyedtogetheras*不須測試治具*基本零件之功能裝置之零件*BGA零件及其他穩藏腳位*電氣功能測試(有LIBRARY)*製程不良之問題*錯件ICT*缺件*墓碑效應*零件翹腳*短路*LAYOUT設計不良*零件偏移*bypass電容*零件外觀異常*錫少&錫多AOI測試之問題：*不須上電及測試針*靜態各種外觀材料AOIComplementarytools*不須測試治具*基本零件之功能裝置之零件*BGA零件及其他穩藏腳位*電氣功能測試(有LIBRARY)*製程不良之問題*錯件ICT*缺件*墓碑效應*零件翹腳*短路*LAYOUT設計不良*零件偏移*bypass電容*零件外觀異常*錫少&錫多AOI測試之問題：*不須上電及測試針*靜態各種外觀材料AOI*須製作治具及加電源*須製作治具及加電源*能夠測試基板內部及穩藏之問題*能測試零件之功能特性轻易修改*試產機種或機種少许變更時*能夠測試基板內部及穩藏之問題*能測試零件之功能特性轻易修改*試產機種或機種少许變更時*迅速且即時旳反應製程問題*迅速且即時旳反應製程問題The5539-Seriesfivecameraheaddesugn*StructuredlightrevealsthecontoursoftheobjectLightintensityMeasuringaveragelnspectionSolderjointGoodComponentbodyunderinspectionLightintensityMeasuringaveragelnspectionSolderjointGoodComponentbodyVerticalcameraLnthesystem：InthewindowareaiftheComerareadslowlightVerticalcameraLnthesystem：InthewindowareaiftheComerareadslowlightToplightingSolderjointisgoodToplightingSolderjointisgood5500-Seriessystemarchitecture2-4pipelinedframegrabbers*2-4pipelinedframegrabbers*Dual68040CPUs,serial¶llelI/OEthernetVGAHighaccuracyX-Ytable(0.001”HighaccuracyX-Ytable(0.001”accuracyover18”x20”boardarea)3/4HPDCmotors(29in./smax.tablespeed)3/4HPDCmotors(29in./smax.tablespeed)WarpStrobeLaser*WarpStrobeLaser*(0.6”,0.7”or1.0”FOV)1or5high-speedcameras(0.6”,0.7”or1.0”FOV)1or5high-speedcamerasLEDstructuredlightingdome*LEDstructuredlightingdome*BoardunderinspectionBoardunderinspectionBoardstopsBoardstops*PatentedtechnologyConveyors(SMEMAinterface)*PatentedtechnologyConveyors(SMEMAinterface)WindowtypesdetectionwithsubpizellizationLocatesthebrightspotwithinthewindow(peakSearchdetectionwithsubpizellizationLocatesthebrightspotwithinthewindow(peakSearchintensityacrossthewindowMeasurestheaveragePresence/AbsenceAverageintensityacrossthewindowMeasurestheaveragePresence/AbsenceAveragePresence/AbsenceVarianceMeasurestheaveragePresence/AbsenceVarianceMeasurestheaverageintensityacrossthewindowintensityacrossthewindow100%Variance100%Variance0%Variance0%VarianceLooksforacontinuousbrighstripacrosstheBridgeLooksforacontinuousbrighstripacrosstheBridgeWindow,eitherverticallyorhorizontallyWindow,eitherverticallyorhorizontallyThedefectdetectioncapabilityrequiredBoardQuadflatpack(QFP)orsmallOutlineICSOICPassives(0603,0402)BoardQuadflatpack(QFP)orsmallOutlineICSOICPassives(0603,0402)J-leaddeviceBoardBoardComprehensivevisualorAOIsolderjointInspectionrequiresviewingfromananglePartialPartialcoveragedefectcoveragedefectFulldefect1.J-leaddeviceFulldefect1.J-leaddevicecoveragecoverage2.LiftedleadonaQFP2.LiftedleadonaQFPThe5539D+AOI(automatedopticalinspection)SystemsfromTeradyne5539D+theoryofoperationLmageofacircuitboardLmageofacircuitboardCompleximagetoprocessCompleximagetoprocessHardtoextractthekeydataHardtoextractthekeydataWindowapproachWindowapproachStructuredlightinghighlightsdefectsApplysimplecriteriaatcriticalpointsStructuredlightinghighlightsdefectsApplysimplecriteriaatcriticalpointsAutomaticallysimplifiesthranalysisAutomaticallysimplifiesthranalysisFastreliablerequiredFastreliablerequiredInspectionexpamplesusingdifferentcombinationsofwindowtypesandlightingLightingfromaboveSearchwindowComponentlocationLightingbehindthecameraBridgewindowsSoldershortinspection(圖二)Sidelighting.(“Snakeeyes”)SolderjointinspectionPresencewindowsmeasuringvariance(圖一)LightingbehindthecameraPresencewindowLightingfromaboveSearchwindowComponentlocationLightingbehindthecameraBridgewindowsSoldershortinspection(圖二)Sidelighting.(“Snakeeyes”)SolderjointinspectionPresencewindowsmeasuringvariance(圖一)LightingbehindthecameraPresencewindowComponentpresenceinspectionAnexampleofusingstructuredlighttoinspectfor(圖三)aboutthesolderjointsDifficulttomakeajudgementUsedfordefectingsolderbridgesToplightingSolderjointdefectsdefected(圖一)(圖二)LowvarianceinthewindowBadjointsSidelightingHighvarianceinthewindowGoodjointsSidelightingdefectsonfine-pitchQFP(圖三)aboutthesolderjointsDifficulttomakeajudgementUsedfordefectingsolderbridgesToplightingSolderjointdefectsdefected(圖一)(圖二)LowvarianceinthewindowBadjointsSidelightingHighvarianceinthewindowGoodjointsSidelightingWarpcompensationBoardwarpagecausestheimagetomoveinthefieldofviewofanangledcamersThebuilt-inwarpmeasurementsystemmeasuresthewarpandautomaticallycompensatesforitduringinspectionWarpagemeasurementtechnigue*Boardwarpagebylookingat2.thecamerasmeasurethethepositionofthelineacrosstheboardsurfaceshinesabrightline1.angledstrobedlaserBoardwarpagebylookingat2.thecamerasmeasurethethepositionofthelineacrosstheboardsurfaceshinesabrightline1.angledstrobedlaserwarpagethemeasurementoftheboardstrobedonasrequiredtofreezeboardsurfacewiththelinecamera/lightingheadoverthe3.theXYtablemovesthewarpagethemeasurementoftheboardstrobedonasrequiredtofreezeboardsurfacewiththelinecamera/lightingheadoverthe3.theXYtablemovestheProgramminganAOIsystem1.CADoutputforpickandplace2.Creatprogramusing1.CADoutputforpickandplace2.Creatprogramusingpackagestyle,orientation)systems(X,Y,designator,CDES(PCwindows3.1)andprogramstabilityverifydefectcoverage4.PerformanceCurvesComponents)100%missingreflowedboard(i.e.Unpopulated,printed,packagestyle,orientation)systems(X,Y,designator,CDES(PCwindows3.1)andprogramstabilityverifydefectcoverage4.PerformanceCurvesComponents)100%missingreflowedboard(i.e.Unpopulated,printed,PerformanceCurvesareakeytoolforguaranteeingprogramstabilityanddefectcoveragethetargetinspectiontype(e.gforall0603passives)1.lnspectaknowngoodboardandsavethemeasurementreadingsforthetargetinspectiontype(e.gfora