SMT高级工程师教案

SMT高级工程白币教案

6

SMT洌谶

ATE工程肺鹰注意及举倩事项：

1.常拿到R/DCADFILES畤，看青在A-TEST醇入畴分析卷亥被旗情式之TESTABILITY

2.在B-TEST厚入ATE旗情式畤，愿注意版本建更之零件，规格；址分析下列资料：

名耦数量

A.PCBCADFILES(NEWVER)1

B.BOM1

C.ARTWORK1

D.CIRCUIT1

E.BEARBOARD1-2

F.FUNCTIONM/B2-3

3.B-TEST彳度提出TESTABILITY幸艮告.

A.列出A-TEST&B-TEST之巽差

B.列出那些零件须加洌器式黑占及注意事项

C.列出治具要求之注意事项

D.列出LAYOUTTESTPAD及洌器式嚏十之规格及注意事项

E.其它R/Dt^言十须附合治具程式控制之要求

ATE工程肺鹰注意及举倩事项：

1.R/D在LAYOUT日寺之^黑占至少要有一旗情式黑占（TESTPAD）

2.路途的每一旗情式黑占（TESTPAD），距至少75MIL以上

3.手插零件不需加旗情式黑占，但如果是CONNECTOR很密之零件祝需要加旗情式黑占.

4.CHIP除了空脚外，其绘各脚均需加旗情式黑占.

5.如果是罩面之被旗愕式日寺，旗情式黑占要均匀分怖於旗0式板.

6.如果是曼面之被旗情式日寺、浪情式黑占儒量LAYOUT在焊友易面.

7.旗情式黑占附近之零件高度鹰小於0.255IN（9腹i品而定）

8.旗情式黑占周1S0.018IN内不可有旗情式或零件

9.PCB0.125IN内不可有浪仁式黑占

10.旗情式黑占到另一旗情式黑占不可小於0.083IN

.125°

PCBDEIGES

.125°.125°

——►

.125°

T

MINIMUNDESIRABLETESTPADPOSITIONONG

11.所有醇通孔及氟孔必须京青PCB麻1做MASK以防旗帽式日寺漏氟

12.定位孔之定位嚏十之尺寸^差在+-.002IN

13.定位孔直彳坐大於0.012IN

14.定位孔之内壁不可吃安易

15.治具之定位孔要用CNC^孔

16.测就黑占不可被被名亲漆盖住（测就前用放大^检查）

林旗情式零件CHIP,CONNECTOR言十重黑占**

17.板遏至旗帽式黑占名勺0.125IN不可有旗情式黑占.

PCBOARD

APROBETIP

///~IIISOLDERRESIST

.035'

(.09mm)

Solderpad

19.厚通孔之中心^距要150mil以上

20.各旗帽式黑占必须吃售易，但遏,幺彖不可被、幺亲漆MASK

21.如考量功能旗情式日寺，要在CONNECTOR最暹虞加旗帽式黑占

22.VCC黑占至少5黑占,GND黑占至少10黑占

以上卷治具部份

23.MIC或CHIP之控制位址、糠（如RESET，ENABLE…）不可直接接到VCC或GROUND上

4.7K

NEORCL

24.旗情式谩器须先除频或加JUMPER控制

25.MPOWER-ONRESET在^言十，要有隔离隹之言殳if

VCC

RESET

VCC

VCC

4.7K

14

OSC

23WvWOUT

26.封振谩器如有控制ENABLE.DISABLE之羟品旗情式曾更穗,否即须加除频重路或善用JUMP亦是一

值1好方法

27.WIC或CHIP之OPTION空脚要LAYOUT旗情式黑占

28.BGA零件背面之PCB不可LAYOUT零件

冽J't式t^/指的功能及国隔

ATE■、幺且装板功能混憎式

■自勤^整

ICTBIC元件功能

-CPattern

-ICBoundarySocan

ICT■短路^路

■元件值

■IC保^二才亟it

-ATE:AutomaticTestEquipment-ICT:In-CircuitTester

-MDA:Manufacture!ngDefectAnalyzer

旗帽式步骤

■短路^路■、幺且装板功能洌情式

■元件值■自勤^整

■IC保^二年亟it

■IC元件功能

-ICPattern

-ICBoundaryScan

裂造不良分伟

低中

裂造不良分伟及旗情式成本

旗馆式^^的市埸

洌招式功能羟品^格

■IC元件能■GenRad100K美金以上

-Pattern■TERADYNE

-BoundartScan■HP

■、幺且装板功能■TR-518F50K美金以上

■自勤^整

■短路^路■TESCO50K美金以上

■元件■OKANON

■IC保^二才亟it■TR-51

洌技式治具

■罩面旗馆式治具

■曼面洌住式治具

■真空洌口式治具

■In-Line旗帽式治具

■屋合式洌住式治具

治具裂作的考^因素

■高品^的洌情式金十

■正硅逗撵旗情式剑

■正硅逗撵旗憎式黑占

■加装"溥板"(GuidingPlate)

SMT裂造不良冏题未来趣势

^路

]□□□□□》

短路

漏件件

V口□口

功能不良

V口口口口

元件不良V口口口口口

元件反插V口口口□口口

低中

SMT羟品洌技式未来趣势

^路]口匚口口口口〉

、幺且装板功能

]□□□□□>

短路

元件值

ic保^二才亟醴

ICPatternV口□口

低中

AOIEQUIPMENT

(AUTOOPTICALINSPECTION)

PerformancestandardsinSM

Manufacturingkeeprisi

ScreenPickandElectricalSystem

Reflow

printingassemblyor

placetest

shipment

Single-sideSMTassemblyprocess

ProcessElectricalininspection

creasingboarddens

■Lncre胞ed/tost,

and\fi|nerpitchpackag

Qualit

make\ln-circuitfixture

Schediedemands

acceshardertoattai1

■Focuson\proqess

■/Reementtoinspec

monitok-in

efeclassesnot

controltes始bleelectrically

•DrivetoduceReauirementfor

inspectionFast,high-defect-

manpowercoverageinspection

5500-SeriesAOIsystemsfromTeradyneprovide

processmonitoringatanyprocessstep

SMTboardassembly

ElectricalBoardIntegration/

ScreenPick/*huiA

1ReflowOeWaveProcessFunctional

PrintPlaceOad1Packaging

1TestTest

1■1

Pre-waveinspection

■5515Bsystem

■Componentinsertion

■Bottm-sidesolderjointquality

Post-reflowinspection

■5529,5539systems

■Componentplacement

■Solderjointquality,includingJ-leadsandliftedleads

Postplacementinspection

■5529system

■Componentpresenceandalignment

■Componentorientation

Thetypicalpost-reflowSMTprocess

Defectspectrum

AOIandICTareoftenemployedtogetheras

Complementarytools

--一^-

/lowsolder

/Lifteleads\Wrongdevices\

/Unwettedpins/Tombstoned\Misorienteddevice(cap,\

Missingbypasscaps/

devices\diode)\

Skewed/misplaced/

Missingdevices]Deviceprogranmming(flash|

Devices(stillconnected)MisorientedICs1ROM)

Bi11boardeddevices\

Connectorpins/Devicedefects(e.g./

Openpowerorparallei\

\Shorts/cracked,IC/

\pins

/BGAandotherhiddenpins/

Basicdevicefunction^^

+Dosenotrequireafixture^Appliesboardpower

+Easilyusedonpartially+Testscomponentfunction,and

BuiltboardsPossiblyboardfunction

+Directso1dering-process+Cantesthiddenfeatures

feedback

AOIandICTareoftenemplpyedtogetheras

Complementarytools

AOI1CT

AOI旗情式之冏题：米零件翘脚\

樨易少&或易多逸件\

米墓碑效鹰

米零件外觐昇常米裂程不良之冏题

米缺件

米bypass重容米重氟功能^情式（有LIBRARY）

米LAYOUT言十不良

米零件偏移

米短路/*BGA零件及其它稳藏脚位

强争熊各槿外觐材料之零件/

米不须上重及浪情式金十米基本零件之功能装置/

米不须旗僧式治具米须装作治具及加重源

皖式檄槿或檄不重少量建更日寺米能测言式零件之功能特性

容易修改米能多勺测就基板内部及穗藏之冏题

米迅速且即日寺的反鹰裂程冏题

The5539-Seriesfivecameraheaddesugn^

Structuredlightrevealsthecontoursoftheobject

underinspection

Componentbody

,Good

\Solderjoint

\

Inspection

Measuringaverage

Lightintensity

Comerareadslow1ight

Lnthesystem:■VerticalcameraInthewindowareaifthe

■Top1ightingSolderjointisgood

5500-Seriessystemarchitecture

2-4Dinelined

framesrabbers*VGA

Dual68040

CPUs.serial

&narallelI/O

Ethernet

HighaccuracyX-Ytable(0.001”

accuracyover18"x20"boardarea)

3/4HPDCmotors

Warp(29in./smax.tablespeed)

1or5high-speedcameras

Strobe(06',0.7"or1.0"FOV)

Laser*LEDstructuredlightingdome*

Boardunderinspection

Boardstops

Conveyors(SMEMAinterface)

*Patentedtechnology

■Windowtypes

SearchLocatesthebrightspotwithinthewindow(peak

odetectionwithsubpizellization

Presence/AbsenceAverageMeasurestheaverage

mintensityacrossthewindow

Presence/AbsenceVarianceMeasurestheaverage

intensityacrossthewindow

100%Variance

0%Variance

BridgeLooksforacontinuousbrighstripacrossthe

Window,eitherverticallyorhorizontally

Thedefectdetectioncapabilityrequired

Dependsonthedevicepackagingemployed

Quadflatpack

(QFP)orsmal1

OutlineICSOIC

Board

J-leaddevice

Passives

(0603,0402)

ComprehensivevisualorAOIsolderjoint

Inspectionrequiresviewingfromanangle

2.LiftedleadonaQFP

The5539D+AOI(automatedopticalinspection)

SysternsfromTeradyne

5539D+theoryofoperation

Lmageofacircuitboard

■Compleximagetoprocess

■Hardtoextractthekeydata

Windowapproach

■Applysimplecriteriaatcriticalpoints

■Structuredlightinghighlightsdefects

■Automaticallysimplifiesthranalysis

required

0oaUCi■Fastreliable

Inspectionexpamplesusingdifferentcombinations

ofwindowtypesandlighting

便I(5)

ComponentpresenceinspectionSolderjointinspection

PresencewindowPresencewindowsmeasuringvariance

LightingbehindthecameraSidelighting.C'Snakeeyes,,)

(H-)（圈二）

DDP，D

SoldershortinspectionComponent[ocation

Searchwindow

Bridgewindows

LightingbehindthecameraLightingfromabove

Anexampleofusingstructuredlighttoinspectfor

defectsonfine-pitchQFP

Warpcompensation

Boardwarpagecausestheimagetomoveinthefield

ofviewofanang1edearners

Thebuilt-inwarpmeasurementsystemmeasuresthe

warpandautomaticallycompensatesforitduring

inspection

Warpagemeasurementtechnigue^

1.angledstrobedlaser2.thecamerasmeasurethe

shinesabrightlineBoardwarpagebylookingat

acrosstheboardsurfacethepositionoftheline

0A

3.theXYtablemovesthe

camera/lightingheadoverthe

boardsurfacewitht