ASM-自动焊线机器介绍Au-wire-bonding-process演示

Section9.3

BasicAuWireBondProcess7/26/20261ContentsBasicIntroductionGoldWireBonderBondingSequenceMaterial&ToolsBondQuality7/26/20262BasicIntroductionUnderstandanICPackageICManufacturingFlowWireBondingIntroduction7/26/20263Cross-sectionofanICPackageDieGoldWireLeadFrame7/26/20264WaferGrindingDieBondingWaferSawToasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacement

SingulationPackingICManufacturingFlowDejunkTrimSolderPlatingSolderPlatingForming/SingulationTrim/Forming

BGASURFACEMOUNTPKGTHROUGHHOLEPKG7/26/20265GoldWireBondingDiePadLeadGoldwireBallBond(1stBond)WedgeBond(2ndBond)7/26/20266WedgeBonding7/26/20267WhattechniqueisusedinGoldWireBonding?7/26/20268WireBondingTechniquesTherearethreebasicwirebondingtechniques:Thermosonicbonding:utilizestemperature,ultrasonicandlowimpactforce,andball/wedgemethods.Ultrasonicbonding:utilizesultrasonicandlowimpactforce,andthewedgemethodonly.Thermocompressionbonding:utilizestemperatureandhighimpactforce,andthewedgemethodonly.7/26/20269ThermocompressionvsThermosonicThermocompressionweldingusuallyrequiresinterfacialtemperatureoftheorderof>300°C.Thistemperaturecandamagesomedieattachplastics,packagingmaterials,andlaminates,aswellassomesensitivechips.Thermosonicwelding,theinterfacetemperaturecanbemuchlower,typicallybetween100to150°C,whichavoidssuchproblems.Theultrasonicenergyhelpsdispersecontaminatesduringtheearlypartofthebondingcycleandhelpscompletetheweldincombinationwiththethermalenergy.7/26/202610AdvantagesofThermosonicMetallurgicaljoiningismorereliablethanconductiveparticlesandadhesivejoining.Processcycletimecanbereducedfromseveralminutestolessthan10seconds.Lowermanufacturingcostperunit.7/26/202611Wirebonding

OperatingTemperatureWireMaterialsPadMaterialsNoteThermo-compression300-500°CAuAl,AuHighpressure,noultrasonicenergyUltrasonic25°CAu,AlAl,AuLowpressureinultrasonicenergyThermosonic100-240°CAu,CuAl,AuLowpressureinultrasonicenergyComparisonofDifferentWireBondingTechniques7/26/202612WhataretheimportantparametersinGoldWireBonding?7/26/202613BondingParametersThermosonicBondingPressure(Force)Amplify&Frequency(Power–138KHz)WeldingTime(BondTime)WeldingTemperature(Heater)

HighPower3.2WmaxLowPower1.6WmaxUltra-LowPower0.8WmaxPower-mWVib.-umPower-mWVib.-umPower-mWVib.-um32003.2116002.268001.597/26/202614SiO2Si

BondingPrincipleAlPressure(Force)Vibration(Power)ContaminationMoistureAl2O3GlassHeat7/26/202615NexttoGoldWireBonder7/26/202616GoldWireBonderMachineRoadmapUnderstandIndividualPartMachineSpecificationBondingTemperature7/26/202617ASMGoldWireBonderRoadmapMachineModel(ATS)AB308

AB309

AB309A

AB339

AB339Eagle

Eagle60

Eagle60AP

Harrier

TwinEagle

HummingBird

Eagle50??7/26/202618ASMGoldWireBonderMachineModel(ATS)DescriptionEagle60-00ICApplicationsEagle60-01TO-92Eagle60-02Opto(BentLeadframe)ApplicationsEagle60-03VerticalLEDorOptoApplicationsEagle60-08Power&HybridDeviceApplicationsEagle60-09Power&HybridDeviceApplications7/26/202619MatchingEagle60APEagle60-03HummningBirdHarrierTwinEagle.....ACEDB7/26/202620Eagle60AP

MachineIntroduction7/26/202621Eagle60vsEagle60AP

Eagle60Eagle60APFinepitch35μm.30μm.Speed60+ms.<60ms.BondheadDigitalbondheadNewbondheadwith8~10%fasterBondPlacementAccuracy±3μm@3sigma±2.5μm@3sigmaLoopTypesStandardloopingdatabaseAdditionalEscargot,Flex,BellloopOptics

ProgrammableBallFormationMonitoringStandard8xfasterCapacitancenon-stickdetectionStandard10xfaster7/26/202622LowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith0.4micronperencoderstepFastcontactdetectionSuppressedForcevibration&FastForceresponseFastresponsevoicecoilwireclampBondHeadASSY7/26/202623XYTableLinearMotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-3um@3sigmaResolutionof0.2umperencoderstep7/26/202624W/HASSY7/26/202625BondingSystemBondingMethod

Thermosonic(TS)BQMMode

Multi-modewithprogrammableBQMBdWireSize 15.2umupto76.2um(Au,Cu)WireLength 0.6to8mmBondingAccuracy +/-2.5um@3sigmaBondingArea 54mmX65mm(LFWidth72mm) 54mmX(137-LFWidth)mmBondingSpeed +60msfor2mmWire(Qloop)BondForceRange 1~400gramLoopType

Q-Auto,Square&PentaLoopHeightRange

3~16milXYResolution

0.2umZResolution

0.4umFinePitchCapability

30umpitch@0.6milwireNo.ofBondingWires

upto3000ProgramStorage

1000programsonHardDiskTransducerSystem 138KHZEagle60APMachineSpecifications(1)7/26/202626VisionSystemPatternRecognitionTime

60ms/pointPatternRecognitionAccuracy

0.37umLeadLocatorDetection

12ms/leadMinimumLeadPitch 80umPostBondInspection

1st,2ndBondandWire TracingDepthofField

3.5X(320um) 8X(100um)FacilitiesSinglePhase110VAC(optional100/120/200/210/220/230/240VACFloorSpacing

720mm(width)X 820mm(length)X 1600mm(height)

Eagle60APMachineSpecifications(2)7/26/202627MaterialHandlingSystemIndexerResolution

1umLeadframePositionAccuracy

2milApplicableLeadframe

W=23~90mm@bondingareainY=65mmL=140~295mmT=0.1~0.8mmApplicableMagazine

W=16~100mm(Maximum) L=140~295mm H=180mm(Maximum)MagazinePitch

2.4~10mm(0.09”~0.39“)DeviceChangeover

<4minutes(withinsameLFtype)PackageChangeover

<5minutes(betweenLFtype)NumberofBufferMagazine

3(max.435mm)Eagle60APMachineSpecifications(3)7/26/202628SPCCapabilityMTBF:168HoursMTBA:2HoursMTTA:1MinuteMTTR:30MinutesOthersAbletolinkuptoformInlineSystem(IDEALine)CompatibletoOLP(OfflineProgrammingSoftware)PowerFailureProtectionEagle60APMachineSpecifications(4)7/26/202629TheWireBondTemperature

Material Preheat Bondsite CUL/F 200+/-10 200+/-10 ALL/F 210+/-10 230+/-10 BGA 150+/-10 160+/-10 TFBGA 150+/-10 160+/-10 LBGA 150+/-10 160+/-10NotIncludeDedicateLine7/26/202630NexttoBondingSequence7/26/202631BondingSequence7/26/202632PadLeadBondingSequenceWireClampCapillaryGoldWireFreeAirBall7/26/202633PadLeadMovefromResetPositionFirst,wireclampopenSecond,bondheadmovedownto1stbondpositionThird,FABiscapturedatthechamfer7/26/202634Approachto1stBondSearchHeightPadLeadSearchHeight7/26/202635Goingto1stBondPositionSearchSpeed1SearchTol.1PadLead7/26/202636SearchSpeed1SearchTol.1PadLeadGoingto1stBondPosition7/26/202637SearchSpeed1SearchTol.1PadLeadGoingto1stBondPosition7/26/202638SearchSpeed1SearchTol.1PadLeadGoingto1stBondPosition7/26/202639TouchDownSearchSpeed1SearchTol.1PadLead7/26/202640ImpactForcePadLeadFormationof1stBond7/26/202641heatPressureUltraSonicVibrationPadLeadFormationof1stBond(ContactPhase)7/26/202642heatPressureUltraSonicVibrationPadLeadFormationof1stBond(BondPhase)7/26/202643CapillaryrisestoReverseHeightPositionPadLead7/26/202644PadLeadCapillaryrisestoReverseHeightPosition7/26/202645PadLeadCapillaryrisestoReverseHeightPosition7/26/202646PadLeadCapillaryrisestoReverseHeightPosition7/26/202647PadLeadCapillaryrisestoReverseHeightPosition7/26/202648RHPadLeadCapillaryrisestoReverseHeightPosition7/26/202649GoingtoReverseDistancePositionRD(ReverseDistance)PadLead7/26/202650FormationofaLoopPadLead7/26/202651PadLeadFormationofaLoop7/26/202652CalculatedWireLengthWireClampClosePadLeadGoingtoLoopTop7/26/202653CalculatedWireLengthPadLead7/26/202654SearchDelayTrajectoryPadLead7/26/202655PadLeadTrajectoryAtthismoment,starttocheck1stbondstickdetection7/26/202656PadLeadTrajectory7/26/202657PadLeadTrajectory7/26/202658PadLeadTrajectory7/26/202659PadLeadTrajectory7/26/202660PadLeadTrajectory7/26/202661PadLeadTrajectory7/26/202662PadLeadTrajectory7/26/202663PadLeadTrajectory7/26/202664PadLeadTrajectory7/26/2026652ndSearchHeightApproachto2ndSearchHeightPadLead7/26/202666SearchSpeed2SearchTol2PadLeadGoingto2ndBondPosition7/26/202667SearchSpeed2SearchTol2PadLeadGoingto2ndBondPosition7/26/202668PadLeadheatFormationof2ndBond7/26/202669heatPadLeadFormationof2ndBond(ContactPhase)7/26/202670heatheatPadLeadFormationof2ndBond(BondPhase)7/26/202671TailLengthPadLead7/26/202672TailLengthPadLead7/26/202673TailLengthPadLead7/26/202674TaillengthTailLengthPadLead7/26/202675DisconnectionoftheTailPadLeadAtthismoment,starttocheck2ndbondstickdetection7/26/202676PadLeadDisconnectionoftheTail7/26/202677PadLeadDisconnectionoftheTail7/26/202678FormationofaNewFreeAirBallPadLeadApply5000Vtogeneratethesparktomeltthegoldwire7/26/202679PadLeadFormationofaNewFreeAirBall&BacktoResetPosition7/26/202680ChipInter-connectionUsingWireBonding7/26/202681NexttoMaterial&Tools7/26/202682Material&ToolsLeadFrameCapillaryGoldWireWindowClamp&TopPlate7/26/202683LeadFrame(1)7/26/202684LeadFrame(2)7/26/202685Capillary(1)CapillaryManufacturer(SPT,GAISER,PECO,TOTO…)CapillaryData(Tip,Hole,CD,CA,FA&OR,IC)7/26/202686Capillary(2)Capillariesaretypically1/16"(.0625"/1.587mm)indiameterand.437"(11.10mm)inlength.

7/26/202687HowToDesignYourCapillaryCapillary(3)TIP

PadPitchx1.3~TIPHole

Wirediameter+40%10%CD

Padsize/open/1stBallCD+0.4~0.6=1stBondBallsizeFA&OR

Padpitch(um) FA >100 0,4 ~90/100 4,8,11 <90 11,15ICtype

looptype7/26/202688Capillary(4)WireDiameter(mil)RecommendedHole(mil)MinRecommendedHole(mil)2.03.02.41.52.21.81.31.81.51.21.71.41.11.61.31.01.51.20.91.21.10.81.00.950.70.90.857/26/202689Capillary(5)MatteFinishenlargesEffectiveFaceandcreatesbetterfrictionwiththegoldwireduringbondformation.PolishFinishprovidessmooth2ndbondandprolongsthecapillarylifespanduetoreducecontaminationaccumulationrate.7/26/202690

CapillaryParameterswhichAffecttheBondingProcess

LoopingFeedholeInnerChamferOuterRadiusandFaceAngle7/26/202691

CapillaryParameterswhichAffecttheBondingProcessSmallerORSharperEdgeLikelihoodofCracksBiggerORReducesCracksReducesEffectiveFaceIncreaseFACompensateSmallerTipAreaHigherCrossSection7/26/202692

CapillaryCondition7/26/202693GoldWireGoldWireManufacturer(MKE,MEM,Nippon,SUMITOMO,TANAKA….

)GoldWireData(WireDiameter,Type,EL,TS)7/26/202694PropertiesofVariousWireTypesPropertyCuAuAlAgElectricConductivity(%IACS)103.173.464.5108.4ThermalConductivity(W/mK)398.0317.9243.0428.0ThermalExpansionCoeff(mm/mK)16.514.223.619.0TensileElasticModulus(GPa)1157862717/26/202695GoldWire(ApplicationofWireType)7/26/202696GoldWire(FreeAirBall)Thediameterofthefree-airballrangesfor1.5times(forsmallballultra-finepitchapplication)to2.5times(forlargeballnon-finepitchapplication)ofwirediameter(WD).

7/26/202697GoldWire(HeatAffectedZone)Sourcefrom:MKElectron7/26/202698GoldWire(ElectricalResistance)Sourcefrom:MKElectron7/26/202699WindowClamp&TopPlate7/26/2026100WindowClampDimension(1)7/26/2026101WindowClampDimension(2)7/26/2026102TopPlateDimension(1)7/26/2026103TopPlateDimension(2)7/26/2026104NexttoBondQuality7/26/2026105BondQuality7/26/2026106BasicRequirementforSuccessfulWireBondingCleaningProperTemperatureSettingProperForceSettingProperPowerSettingProperClampingProperTooling7/26/2026107CleaningMethodsThemetallizationmustbefreeoforganicandinorganiccontamination.Forexample,fingerprintoilonthebondingareareducesthereliabilityoftheinterconnection.Plasmacleaningiseffectiveforremovingepoxybleed-out,whichiscausedbyoutgassing.Gasestypicallyusedinplasmascanincludecombinationsofargon,nitrogen,hydrogen,oxygen,andotherlesscommongases

UVozonecleaningemitssignificantamountsofradiation(wavelengths1848Aand2537A)toremoveorganiccontaminants.7/26/2026108ProperTemperatureSettingThermosonicbonding–100

C~150

C.Ultrasonicbonding–25

Corambienttemperature.Thermocompressionbonding–300

C~500

C.7/26/2026109ProperPowerSetting7/26/2026110ProperClampingMakesuretheunitisproperlyclampedintheworkholder,asitiscriticalthatnomovementtakesplace.Youcanverifythisbynudgingtheobjectwithtweezers.Ifmovementtakesplace,theunitmustbesecuredduringhighspeedbonding.7/26/2026111ProperToolingMakesurethetool(thecapillary)isinfunctionalcondition.Thepropertoolselectionisessentialforconsistentwirebonding.7/26/2026112BasicMeasurementProcessstabilityismeasuredaccordingtothefollowingperformancespecifications:FreeAirBalldiameter(min,max,std,Cpk)Balldiameter&height(min,max,std,Cpk)Loopheight&shape(min,max,std,Cpk)Ballshearforce&Strength(min,Cpk)Wirepullforce(min,Cpk)Ballplacementaccuracy(min,Cpk)Confirmationrun(stability,numberofassists,visualinspection,UPH)Capillarydimensionstolerances(SPECs,effectonprocess,lifetime)Overallprocessfeasibility(cost,demand,timetomarket)7/26/2026113BondPadOpen&BondPadPitchUnit:umorMilBPO:

InternaldimensionofthepadinXandYaxisBPP:

DistanceofthepadcentertotheothernearbypadcenterBondPadPitchBondPadOpenBondPadOpen7/26/2026114BallSizeBallThicknessBallSizeBallSize&BallThicknessUnit:um,Mil

MeasureMagnification:50XBallThicknessCalculateFormula:

60umBPP:WD=50%

60umBPP:WD=40%~50%BallSize=PadSize–6umBondPadPitchWireDiameter7/26/2026115LoopHeightUnit:um,Mil

MeasureMagnification:20XLoopHeight線長7/26/2026116NeckPull WirePull StitchPullDieLead1/3ofwirelengthGoldwire7/26/20261177/26/2026118GradeBrokenatReasonQuality1BallLiftBadprocessPoor2BallNeckH.A.Z.Good3WireDependsonconditionVerygood4WeldWelddeformationGood5StitchLiftBadprocessPoor7/26/2026119Goodwedgesizecangiveoutstrong2ndbondAfterstitchpull,thewedgestillremainonlead(2ndbond)7/26/2026120Unit:gramorg/mil²Inter-metallic(Coverageshouldhavemorethan75%,ShearStrength＞6.0g/mil²)SHEARSTRENGTH＝BallShear/Area(g/mil²)BallShear=x;BallSize=y;Area=π(y/2)²x/π(y/2)²=zg/mil²7/26/2026121Inter-metallicatGoldBallPoorcoverage(34%)Goodcoverage(>75%)7/26/2026122Inter-metallicLayerThicknessX=Kt1/2WhereXistheinter-metalliclayerthickness,tisthetimeandKistherateconstantwhichiscalculatedbyfollowing:

K=Ce-E/KT

WhereCistherateconstant,eistheactivationenergy,KistheBoltzmanconstant,andTisthetemperatureinabsolutescale.7/26/2026123CBallbondSpecimenclampShearing

ramWireBondshoulderInterfacialcontact

ballbondweldareaBondingpadh(A)UnshearedCLCBallbondCLSpecimenclampBondingpadFullballattachedtowire-exceptforregions

ofintermetallicvoidingBallseparatedatbondingpad-Ballinterface-residualintermetallic(andsometimesportionofunalloyedballandmetal)onpadinbondinteractionarea(D)Ballbond-bondingpadinterfaceseparation(typicalAutoAl)CSpecimenclampShearingramWireMinorfragmentofball

attachedtowireBondingpadCLBallshearedtoohigh

(offline,etc.)onlya

portionofshoulderand

balltopremovedInterfacialcontact

ballbondweldarea(B)Wire(balltopand/orside)shearCBallbondCLSpecimenclampShearing

ramBondingpadMajorportionofballattachedtowireInterfacialcontact-

ballbondweldareaintact(C)Belowcenterlineshear,ballshearedthrough(typicallyAutoAu)CBallbondCLSpecimenclampBondingpadPadmetallizationseparatesfrom

underlyingsurfaceResidualpadonballball-padinterface

remainsintact(E)BondpadliftsSpecimenclampCBallbondCLBondingpadBondingpadlifts,takingportionofunderlyingsubstratematerialwithit(F)CrateringResidualpadandsubstrateattached

toball,ball-padinterfaceremains

intactShearFailureModes7/26/2026124NormalCondition7/26/2026125MaterialProblem7/26/2026126WithBallWirePadSizeMissingBallWireBrokenBondingBallInspectionBallDetection7/26/2026127BallSizePadCenterBallCenterBallPlacement(X,Y)BallOffPadBondingBallInspection(cont.)BallMeasurement7/26/2026128

Peeling1stBondFail(1)PossibleCauses:PowertoomuchBaseForcenotenoughAlpadnotfullycuredorcontaminationbetweenAlandoxidelayer7/26/2026129

BallLift1stBondFail(2)BallLiftBallLiftWithPadPeelingPossibleCauses:BasePowernotenoughMaterialproblem7/26/20261301stBondFail(3)NeckCrackPossibleCauses:RDtoohighRHtoolowWrong/overusedcapillaryWireClampgaptoosmallWireproblemEFOCurrenttoolarge7/26/2026131OffCenterBallPossibleCauses:TailLengthtoolongWireorWirePathcontaminationEFOBoxorcableconnectionproblemAirTensionerflowtoolow1stBondFail(4)OffCenterBall(GolfBall)7/26/20261321stBondFail(5)SmashBallPossibleCauses:TailLengthtooshortWireorE-torchcontaminationTipoftaillengthswingawayfromE-torchSmashBall7/26/20261331stBondFail(6)MissingBallPossibleCauses:TailLengthtooshortFireLeveltoolowortoohighE-torchtipdirty2ndBondPower/Force/SearchSpeedtoohigh7/26/2026134WithWeldWireCapillaryMarkMissingWeldBrokenWedgeLeadSufficientWedgeWidth&LengthSecureToolImpressionNoFishTailNoDamage/BrokenWedgeBondingWeldInspectionWeldDetection7/26/2026135BrokenWedgePossibleCauses:2ndBondPower/ForcetoohighLeadclampingnotenough2ndBondFail(1)BrokenWedge7/26/2026136PossibleCauses:Leadfloatingorcontamination2ndbondtime,