SMT新锡膏评估实例

1、solder paste evaluation,2,solder paste evaluation,3,solder paste evaluation,samples,solder paste evaluation,printability print parameters: test pattern: stencil: 0.12mm thickness special pad pattern: width 3.0mm printer: mpm125 length 20mm print speed: 45mm/sec distance 0.5-2.0mm separation speed: 2

2、.5m/sec,printability,viscosity,slump,thickness,solderability,x-ray,cross section,pull and push,content,score: 5-perfect, 4-good, 3-basic, 2-poor, 1-unallowable,solder paste evaluation,viscosity test parameters: equipment: malcom pcu 205 test temperature: 25 revolution: 10rpm mix time: 5min,printabil

3、ity,viscosity,slump,thickness,solderability,x-ray,cross section,pull and push,content,all the results are out of spec except aim nc259, but the viscosity can be adjusted based on the product requirement,solder paste evaluation,slump print parameters: test pattern: stencil: 0.12mm thickness special p

4、ad pattern: width 3.0mm printer: mpm125 length 20mm print speed: 45mm/sec distance 0.5-2.0mm test method: to check the solder paste shape printed on board after several minutes if exist slump or chip change,printability,viscosity,slump,thickness,solderability,x-ray,cross section,pull and push,conten

5、t,all the solder paste can keep the shape after several minutes without slump,solder paste evaluation,thickness test method: equipment: 2d laser thickness tester pcb no: 13610761x pad pattern: terminal test quantity: 5point per pcb, continuous 5pcs per type,printability,viscosity,slump,thickness,sol

6、derability,x-ray,cross section,pull and push,content,relatively speaking, ef305,ef105 and nc259 are nearly same as nc254, tongfang and huaqing are worse in thickness stability,solder paste evaluation,solderability test method: equipment: 2d laser thickness tester pcb no: 13610761x pad pattern: termi

7、nal test quantity: 5point per pcb, continuous 5pcs per type,printability,viscosity,slump,thickness,solderability,x-ray,cross section,pull and push,content,solder paste evaluation,thickness test method: equipment: 2d laser thickness tester pcb no: 13610761x pad pattern: terminal test quantity: 5point

8、 per pcb, continuous 5pcs per type,printability,viscosity,slump,thickness,solderability,x-ray,cross section,pull and push,content,compare the process capacity of thickness, ef305, huaqing and nc259 have more better performance,solder paste evaluation,solderability test method: check the solder joint

9、s after reflow soldering. pcba no:13647427x reflow profile: based on the material spec by deferent different type of solder paste,printability,viscosity,slump,thickness,solderability,x-ray,cross section,pull and push,content,solder paste evaluation,solderability test method: check the solder joints

10、after reflow soldering. pcba no:13647427x reflow profile: based on the material spec by deferent different type of solder paste,printability,viscosity,slump,thickness,solderability,x-ray,cross section,pull and push,content,after reflow soldering, the solder will extend to terminal body more easily w

11、hen using huaqing and ef305 than others type,solder paste evaluation,process verification conclusion after the first step verification in process flow, the score of each solder paste list as below,printability,viscosity,slump,thickness,solderability,x-ray,cross section,pull and push,content,accordin

12、g to the results of the process verification, we will choose nc259, ef305 and ef105 to further test for reliability,solder paste evaluation,x-ray equipment: xidat dage xd6500 magnification: excess of 2800x energy: 100kv/1.0w,printability,viscosity,slump,thickness,solderability,x-ray,cross section,pu

13、ll and push,content,there are no obvious difference exist between the four type of solder paste, the voids in the solder joints are all in spec(below 25,solder paste evaluation,cross section polishing machine: allied high tech sbt-900-1919 sem equipment: jeol jsm6380-lv pumping speed: 13 min pcba no

14、: 13610761x cross section position: teminal,printability,viscosity,slump,thickness,solderability,x-ray,cross section,pull and push,content,there are no obvious crack or voids exist between the four type of solder paste based on the cross section test,solder paste evaluation,pull and push test equipm

15、ent: rhesca str-1000 pcba no: 13610761x test position: terminal, relay, resistor, doide,printability,viscosity,slump,thickness,solderability,x-ray,cross section,pull and push,content,solder paste evaluation,cross section equipment: rhesca str-1000 pcba no: 13610761x test position: terminal, relay, r

16、esistor, doide,printability,viscosity,slump,thickness,solderability,x-ray,cross section,pull and push,content,there are no obvious difference exist between the four type of solder paste, and also meet the pull and push requirement,solder paste evaluation,conclusions according to the process verification and reliability test, aim nc259, inventec ef305 and ef105 all have better performance, so these three type of solder paste could well