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1 ProcessModule說明 A 下料 CutLamination a 1裁板 SheetsCutting a 2原物料發料 Panel ShearmaterialtoSize B 鑽孔 Drilling b 1內鑽 InnerLayerDrilling b 2一次孔 OuterLayerDrilling b 3二次孔 2ndDrilling b 4雷射鑽孔 LaserDrilling LaserAblation b 5盲 埋 孔鑽孔 Blind BuriedHoleDrilling C 乾膜製程 PhotoProcess D F c 1前處理 Pretreatment c 2壓膜 DryFilmLamination c 3曝光 Exposure c 4顯影 Developing c 5蝕銅 Etching c 6去膜 Stripping c 7初檢 Touch up c 8化學前處理 化學研磨 ChemicalMilling c 9選擇性浸金壓膜 SelectiveGoldDryFilmLamination c 10顯影 Developing c 11去膜 Stripping D 壓合Laminationd 1黑化 BlackOxideTreatment d 2微蝕 Microetching Developing Etching Stripping DES 2 d 3鉚釘組合 eyelet d 4疊板 Layup d 5壓合 Lamination d 6後處理 PostTreatment d 7黑氧化 BlackOxideRemoval d 8銑靶 spotface d 9去溢膠 resinflushremoval E 減銅 CopperReduction e 1薄化銅 CopperReduction F 電鍍 HorizontalElectrolyticPlating f 1水平電鍍 HorizontalElectro Plating PanelPlating f 2錫鉛電鍍 Tin LeadPlating PatternPlating f 3低於1mil Lessthan1milThickness f 4高於1mil Morethan1milThickness f 5砂帶研磨 BeltSanding f 6剝錫鉛 Tin LeadStripping f 7微切片 Microsection G 塞孔 PlugHole g 1印刷 InkPrint g 2預烤 Precure g 3表面刷磨 Scrub g 4後烘烤 Postcure H 防焊 綠漆 SolderMask h 1C面印刷 PrintingTopSide h 2S面印刷 PrintingBottomSide h 3靜電噴塗 SprayCoating h 4前處理 Pretreatment h 5預烤 Precure h 6曝光 Exposure h 7顯影 Develop h 8後烘烤 Postcure 3 h 9UV烘烤 UVCure h 10文字印刷 PrintingofLegend h 11噴砂 Pumice WetBlasting h 12印可剝離防焊 PeelableSolderMask I 鍍金Goldplatingi 1金手指鍍鎳金 GoldFinger i 2電鍍軟金 SoftNi AuPlating i 3浸鎳金 ImmersionNi Au ElectrolessNi Au J 噴錫 HotAirSolderLeveling j 1水平噴錫 HorizontalHotAirSolderLeveling j 2垂直噴錫 VerticalHotAirSolderLeveling j 3超級焊錫 SuperSolder j 4 印焊錫突點 SolderBump K 成型 Profile Form k 1撈型 N CRouting Milling k 2模具沖 Punch k 3板面清洗烘烤 Cleaning Backing k 4V型槽 V Cut V Scoring k 5金手指斜邊 BevelingofG F L 短斷路測試 ElectricalTesting Continuity InsulationTesting l 1AOI光學檢查 AOIInspection l 2VRS目檢 Verified Repaired l 3汎用型治具測試 UniversalTester l 4專用治具測試 DedicatedTester l 5飛針測試 FlyingProbe M 終檢 FinalVisualInspection m 1壓板翹 WarpageRemove m 2X OUT印刷 X OutMarking m 3包裝及出貨 Packing shipping 4 m 4目檢 VisualInspection m 5清洗及烘烤 FinalClean Baking m 6護銅劑 ENTEKCu 106A OSP m 7離子殘餘量測試 IonicContaminationTest CleanlinessTest m 8冷熱衝擊試驗 ThermalcyclingTesting m 9焊錫性試驗 SolderabilityTesting N 雷射鑽孔 LaserAblation N 1雷射鑽Tooling孔 LaserablationToolingHole N 2雷射曝光對位孔 LaserAblationRegistrationHole N 3雷射Mask製作 LaserMask N 4雷射鑽孔 LaserAblation N 5AOI檢查及VRS AOIInspection Verified Repaired N 6BlaserAOI afterDesmearandMicroetching N 7除膠渣 Desmear N 8微蝕 Microetching 5 A W artwork 底片Ablation燒溶 laser 切除abrade粗化abrasionresistance耐磨性absorptionabsorptionACC accept 允收acceleratedcorrosiontest加速腐蝕acceleratedtest加速試驗acceleration速化反應accelerator加速劑acceptable允收activator活化液activeworkinprocess實際在製品adhesion附著力adhesivemethod黏著法airinclusion氣泡airknife風刀amorphouschange不定形的改變amount總量amylnitrite硝基戊烷analyzer分析儀anneal回火annularring環狀墊圈 孔環anodeslime sludge 陽極泥anodizing陽極處理AOI automaticopticalinspection 自動光學檢測applicabledocuments引用之文件AQLsampling允收水準抽樣aqueousphotoresist液態光阻aspectratio縱橫比 厚寬比 Asreceived到貨時 6 backlighting背光back up墊板bankedworkinprocess預留在製品basematerial基材baselineperformance基準績效batch批betabackscattering貝他射線照射法beveling切斜邊 斜邊biaxialdeformation二方向之變形black oxide黑化blankcontroller空白對照組 7 blankpanel空板blanking挖空blip彈開blister氣泡 起泡blistering氣泡blowhole吹孔board thicknesserror板厚錯誤bondingplies黏結層bow bowing板彎breakout從平環內破出bridging搭橋 橋接BTO BuildToOrder 接單生產burning燒焦burr毛邊 毛頭 camcorder一體型攝錄放機carbide碳化物carlsonpin定位梢carrier載運劑catalyzing催化catholicsputtering陰極濺射法caulplate隔板 鋼板calibrationsystemrequirements校驗系統之各種要求centerbeammethod中心光束法centralprojection集中式投射線certification認證chamfer倒角 金手指 chamfering切斜邊 倒角characteristicimpedance特性阻抗chargetransferoverpotential電量傳遞過電壓chase網框checkboard棋盤chelator蟹和劑chemicalbond化學鍵chemicalvapordeposition化學蒸著鍍circumferentialvoid圓周性之孔破cladmetal包夾金屬cleanroom無塵室clearance間隙coat鍍外表coatingerror防焊覆蓋錯誤 8 coefficientofthermalexpansion CTE 熱澎脹系數coldsolderjoint冷焊點cold weld金屬粉末冷焊color顏色colorerror顏色錯誤compensation補償competitiveperformance競爭力績效complexsalt錯化物complexor錯化物componenthole零件孔componentside零件面concentric同心conformance密貼性consumerproducts消費性產品contactresistance接觸電阻continuousperformance連續發揮效能contractservice協力廠controlledsplit均裂式conventionalflow亂流方式conventionaltensiletest傳統張力測試法conversioncoating轉化層convex突出coordinatelist資料清單coppercladedlaminates CCL 銅箔基板copperexposure線路露銅coppermirror鏡銅copperpad銅箔圓配copperresidue coppersplash 銅渣corrosionratenumbering腐蝕速率計數系統corrosionresistance抗蝕性coulombslaw庫倫定律countersink喇叭孔coupon試樣couponlocation試樣點coveringpower遮蓋力CPU中央處理器crack破裂 裂痕crazing裂痕 白斑crosslinking交聯聚合 9 crosstalk呼應作用crosslinking交聯crystalcollection結晶收集curing聚合體currentefficiency電流效率cut outs挖空cutting裁板cyanide氰化物cyclesoflearning學習循環cycle timereduction交期縮短datecode週期deburring去毛頭dedicated專用型degradation退變delamination分層dent pinhole凹陷 針孔departmentofdefense國防部designation字碼簡示法de smear除膠渣developing顯影dewetting縮錫dewettingtime縮錫時間dimensionerror外形尺寸錯誤dielectricconstant介質常數difficulty困難度difunctional雙功能dimension尺寸dimensionstability尺寸安定性dimensionalstability尺度安定性dimensionandtolerance尺寸與公差dirtyhole孔內異物discolorhole孔黑 孔灰 氧化discoloration變色disposableeyeletmethod消耗性鉚釘法distortionfactor尺寸變形函數doubleside雙面板 10 downtime停機時間drill鑽孔drillbit鑽頭drillfacet鑽尖切萷面drillpointerpointerdrilledblankboard已鑽孔之裸板drilling鑽孔dryfilm乾膜ductility延展性economyofscale經濟規模edgespacing板邊空地edge boardcontact goldfinger 金手指efficiency能量效率electrictest電測electricaltesting電測 測試electrochemicalmachineECM電化學加工法electrochemicalreactor電化學反應器electroforming電鑄electrolessplate化學銅electroless deposition無電鍍electropolishing電解拋光electrorefining電解精鍊electrowinning電解萃取ellipticalset橢圓形embrittlement脆性entitlementperformance可達成績效entrapment電鍍夾雜物epoxy環氧樹酯equipotential電位線errordatafile異常情形etchrate蝕銅速率etchant蝕刻液Etch back回蝕evaluationprogram評估用程式exposure曝光externalpinmethod外部插梢法eyelethole鉚釘孔Eyeleting鉚眼fabric網布failure故障 11 fastresponse快速回應fault瑕庛 缺陷fiberexposure纖維顯露fiberprotrusion纖維突出fiducialmark光學點 基準記號filler填充料film底片filtration過濾finishedboard成品fixing固著fixture電測夾具 治具 flakingoff粹離flammabilityrating燃性等級flare喇叭形孔flatcable併排電纜feedbackloop回饋循環first in first out FIFO 先進先出flexiblemanufacturingsystem FMS 彈性製造系統flux助焊劑foildistortion銅層變形fold空泡foreigninclude異物foreignmaterial基材內異物freeradicalchainpolymerization自由基連鎖聚合fullyadditive加成法fullyannealedtype徹底回火軔化之類形function函數fundamentalandbasic基本fungusresistance抗黴性funnelflange喇叭形摺翼galvanized加法尼化製程gap鑽尖分開gaugelength有效長度geltime膠化時間generalresistink一般阻劑油墨general通論generalindustrial一般性 電子 工業級geometricalleveling幾何平整glasstransitiontemperature Tg 玻璃態轉換溫度 12 Gold金goldfinger金手指goldplating鍍金goldenboard標準板gouges刷磨凹溝gouging挖破grainboundary金屬晶體之四邊green綠色grip夾頭groundplane接地層groundplaneclearance接地空環hackers駭客HAL hotairleveling 噴錫haloing白邊 白圈hardener硬化劑hardness硬度hepafilter空氣濾清器highperformanceindustrial高性能 電子 工業級highreliability高可靠度highresolution高解析度hightemperatureelongation HTE 高溫延展性銅箔hightemperatureepoxy HTE 高溫樹酯hit擊holecounter數孔機holediameter孔徑holediametererror孔徑錯誤holelocation孔位holenumber孔數holewallquality孔壁品質hook外弧hotdip熱浸法hullcell哈氏槽hybrid混成積體電路hydrogenbonding氫鍵hydrolysis水解hydrometallurgy濕法冶金法imageanalysissystem影像分析系統imagetransfer影像轉移immersiongold浸金 化鎳金 13 immersionplating浸鍍法impedance阻抗infraredreflow紅外線重熔inhibitor熱聚合抑制劑injectionmold射模ink油墨innerlayer佈局leadscrew牽引螺絲leakage漏電learningcurve學習曲線legend文字標記leveling平整 14 levellingadditive平整劑levellingpower平整力lifesupport維繫生命limitingcurrent極限電流linespace線距linewidth線寬linearvariabledifferentialtransformer LVDL 線性可變差動轉換器liquid液狀 態 liquidcrystalresins液晶樹脂liquidphotoimageablesolderresistink液態感光防焊油墨liquidphotoresistink液態光阻劑油墨lotsize批量lowercarrier底部承載板mechanicalplating機祴鍍法machinescrub刷磨清潔法macrothrowingpower巨分佈力margin鑽頭刃帶marketshare市場佔有率markingerror文字錯誤maskedleveling儰裝平整masslamination大型壓板masstransfer質量傳送效應masstransferoverpotential質量傳遞過電壓masstransportation質傳masterdrawing主圖 藍圖materialusefactor材料使用率mealing泡點 白點memory記憶裝置meniscographsolderabilitymeasurement新月型焊錫效果microetch微蝕microetching微蝕microfocus微焦距microfocussystem微焦距系統microprofile微表面microsectioning微切片法microthrowingpower微分佈力migration遷移mini tensiletester迷你拉力測試儀misholelocation孔位錯誤 15 misregistration焊錫面與零件面對位偏差misregsitration對不準moistureandinsulationresistancetest濕氣與絕緣電阻試驗moldedcircuitboard MCB 模製電路板monoethanalamine單乙醇氨monohydratestate水化物monomer單分子膜 單體mousebite鋸齒 蝕刻缺口msec毫秒mufflefurnace高溫焚火爐multichip超大IC型 多晶片模組 mylar保護膜nailhead釘頭NCdrill數位鑽孔機negativeetchback反回蝕negativefilm負片negativerakeangle負摳耙角network迴路 網路neutralization中和nick缺口nickel鎳nodule銅瘤 瘤粒noflowresin不流樹脂noise雜訊nominal標示nominaldimension標定長度nominalgeltime標示膠性時間nominalresincontent標示膠含量nominalresinflow標示膠流量nominalscaledflowthickness標示比例流量厚度OAequip辦公室自動化設備obsolescencefactor報廢因素OEM原設備製造商offset list補償數據清單ohmmeter歐姆計open斷路opencircuits斷路openshorttesting斷短路測試 16 opening開口originalartwork A W 原稿底片Others其它outgrowth增出overdesign牛刀殺雞overlap鑽尖重疊overlayentry蓋板overpotential過電壓oxidation氧化oxidetreatment黑化處理oxidedcytochrome氧化性之細包色素oxygenevolution氧氣發生反應packedbed充填床式pad錫墊 圓配padcopperexposurepad露銅panel小型板面 母板panelplating一次銅電鍍parasitic寄生的partno 料號patternplating二次銅電鍍PCB printcircuitboard 印刷電路板pcs片peelstrength抗撕強度peelingoff剝離 剝落 performancespecification性能規範permittivity透電率perspectivesonexperience經驗透視PET聚酯photodiodedetector發光二極體偵測器photoinitiator感光啟始劑photoresist光阻phototool光具 指工作底片 piece子板面pincetonappliedresearch腐蝕測定儀pinkring粉紅圈pit凹點 17 pitch腳距planar平面plating電鍍platingexposure下鍍層露出pluggauge插規plughole孔塞PNL panel 排板polar polarinteraction極性之間的吸力polyester聚酯類polyglycols聚乙二醇polyimide聚亞醯氨poorbevelling磨邊加工引起突起 剝離poordrill孔形不良poorHAL噴錫不良poormarking字體不良poorpad錫墊不良poorprinted印刷偏差poorsolderability焊錫性不良poortouch up補線不良positioncontrolsystem位置控制系統positiverakeangle正摳耙角powercurvemodel幕次曲線模式practice工藝慣例preferred良好prematuretearing提前撕裂prepolymer預聚合物prepreg膠片pre process front end 製前press壓床presscycle壓合週期primarycurrentdistribution一次電流分佈primary主要productlifetimes生命週期productprocess製程promoter促進劑protocal初步資料prussicacid普魯士酸PTF basedprocess厚膜糊法 18 PTH platingthoughhole 導通孔pullaway拉開pumice浮石粉pumicescrub噴砂清潔法pyrometallurgy火燒法冶鍊QC qualitycontrol 品管QFP quadflatpack 扁方型封裝體qualificationinspection資格審查檢驗qualificationtesting資格檢定qualityclassification品質等級quantitative計量式測試rack掛架radiometer能量劑rakeangle摳耙角RAM RandomAccessMemory隨機存取記憶體realtime關鍵時刻recessedtraceprocess凹槽線路法recoverytank回收槽reduction還原re eninforcement強化refraction折光率reinforcementstyle補強材料的型式registermark對位用標記registrationhole對位孔registrationpattern長方形銅地REJ reject 退貨 拒收rejectable拒收releaseagent脫模劑reliefangle浮離角remark備註repair修理resincontent樹脂含量 膠含量 resinflow膠流量resinflowpercentage樹脂流量之百分率resinrecession樹脂下陷resinsmear膠渣resiststrippers剝乾膜劑 19 resistornetwork排列電阻resolution解像度returnonassets資產報酬率reversibility可逆性rework重工rosin天然松香rotatingcylinder旋轉圓柱形roughtness孔壁粗糙 粗慥routing切外形 成型routingbit銑刀runout偏轉S Lonhole孔內沾文字S M soldermask S L防焊文字S M soldermask 防焊S Merror防焊種類錯誤S Monhole孔內綠漆saltspraytest鹽水噴霧試驗samplingsize抽樣數scope範圍scored刻痕scoring樞槽 刮線scrap廢框scratches刮傷screenprinting網版印刷scum透明殘膜sealing封孔處理secondary次要semi additive半加成法sensitize敏化sensitizer敏化液separator鋼隔板sequentiallamination漸成式壓法serratededges毛邊shatter破碎 20 short短路shunt分路silanetreatment矽烷處理siliconecouplingagent矽烷偶合劑silkscreen文字印刷simulator模擬器singleaxis單軸sizing底片之伸縮補償skip漏印skipprinting跳印 漏印sliver絲條slot開槽slotting開槽SMD surfacemountdevice 表面黏著元件smear膠渣SMT surfacemounttechnology 表面黏著技術sodiumcarbonatemonohydrate結晶水碳酸鈉softtooling軟性工具solder焊錫 錫鉛solderbridge錫橋solderbump錫突solderfloat漂錫soldermaskadhesion綠漆附著力solderonG F金手指沾錫solderontrace線路沾錫solderplug錫塞solderside焊錫面solderability焊錫性solidcarbide實質碳化物spacing間距spacingnonenough間距不足SPC StatisticalProcessControl 統計生管specification規範specialconsiderations特別考慮spincoating旋轉塗佈spindle鑽軸spiralcontractometer螺旋收縮儀spotface銑靶spraycoating噴塗 21 Squeegee刮刀stackingstructure疊板結構stamping沖壓standardhydrauliclamination標準液壓法standardizing標準化starvation缺膠steptablet格片數stockoption認股選擇權strain應度strength強度stressmeter應力計subtractive減除法surfaceconvex表面突起surfaceexamination表面檢查surfaceinsulationresistance SIR 表面絕緣電阻surfacemount表面黏著方式surfacero

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