半导体工艺简介53877ppt课件

1,集成电路制造工艺简介生产工厂简介,国外某集成电路工厂外景,2,FabTwowascompletedJanuary2,1996andisaStateoftheArtfacility.This2,200squarefootfacilitywasconstructedusingallthelatestmaterialsandtechnologies.Inthissetofcleanroomswechangetheair390timesperhour,ifyoudothemathwithULPAfiltrationthisisaClassOnefacility.WehavehadittestedanditdoesmeetClassOneparameters(withoutanypeopleworkinginit).Sincewearenotmakingmicroprocessorshereandwedontwanttowearspacesuits,werunitasaclass10fab.EventhoughitconsistentlyrunswellbelowClassTen.,1级净化厂房/10级净化厂房,3,HereintheFabTwoPhotolithographyareaweseeoneofour200mm0.35micronI-LineSteppers.thissteppercanimageandalignboth6&8inchwafers.,投影式光刻机,4,AnotherviewofoneoftheFabTwoPhotolithographyareas.,投影式光刻机,5,Hereweseeatechnicianloading300mmwafersintotheSemiTool.Thewafersareina13waferTefloncassetteco-designedbyProcessSpecialtiesandSemiToolin1995.Againthesearetheworldsfirst300mmwetprocesscassettes(thatcanbespinrinsedried).,硅片清洗装置,6,AswelookinthiswindowweseetheWorldsFirsttrue300mmproductionfurnace.Ourdevelopmentanddesignofthistoolbeganin1992,itwasinstalledinDecemberof1995andbecamefullyoperationalinJanuaryof1996.,12英寸氧化扩散炉,7,Herewecanseetheloadingof300mmwafersontothePaddle.,12英寸氧化扩散炉装片工序,8,ProcessSpecialtieshasdevelopedtheworldsfirstproduction300mmNitridesystem!Webeganprocessing300mmLPCVDSiliconNitrideinMayof1997.,12英寸氧化扩散炉取片工序（已生长Si3N4）,9,2,500additionalsquarefeetofStateoftheArtClassOneCleanroomiscurrentlyprocessingwafers!Withincreased300mm&200mmprocessingcapabilitiesincludingmorePVDMetalization,300mmWetprocessing/Cleaningcapabilitiesandfullwafer300mm0.35umPhotolithography,allinaClassOneenviroment.,PVD,10,CurrentlyourPS300AandPS300Bdiffusiontoolsarecapableofrunningboth200mm&300mmwafers.Wecanevenprocessthetwosizesinthesamefurnaceloadwithoutsufferinganyuniformityproblems!(ThermalOxideOnly),12英寸和8英寸氧化扩散炉,11,AccuracyinmetrologyisneveranissueatProcessSpecialties.Weusethemostadvancedroboticlaserellipsometersandothercalibratedtoolsforprecisionthinfilm,resistivity,CDandstepheightmeasurement.IncludingournewNanometrics8300fullwafer300mmthinfilmmeasurementandmappingtool.WealsouseoutsidelaboratoriesandourexcellentworkingrelationshipswithourMetrologytoolcustomers,foradditionalcorrelationandcalibration.,检测工序,12,OneoftwoSEMLabslocatedinourfacility.InthisoneweareusingafieldemissiontoolforeverythingfromlookingatphotoresistprofilesandmeasuringCDstodoublecheckingmetaldepositionthicknesses.Atthehelm,anotheroneofourprocessengineersyoumayhavespokenwithMarkHinkle.,扫描电镜SEM检测工序,13,HerewearelookingattheIncomingmaterialdispositionracks,库房,14,AboveyouarelookingatacoupleofviewsofthefacilitiesonthewestsideofFabOne.Hereyoucanseeoneofour18.5Meg/OhmDIwatersystemsandoneoffour10,000CFMairsystemsfeedingthisfab(leftpicture),aswellasoneofourwasteairscrubberunits(rightpicture).Bothareinsidethebuildingfo