单片机 外文翻译 外文文献 英文文献rom的单片机

外文翻译外文原文METHODOFMANUFACTURINGASINGLECHIPSEMICONDUCTORINTEGRATEDCIRCUITDEVICEINCLUDINGAMASKROMINASHORTTIMETHISAPPLICATIONISBASEDUPONANDCLAIMSTHEBENEFITOFPRIORITYFROMJAPANESEPATENTAPPLICATIONNO2006207797,FILEDONJUL31,2006,THEDISCLOSUREOFWHICHISINCORPORATEDHEREINITSENTIRETYBYREFERENCEBACKGROUNDOFTHEINVENTIONTHISINVENTIONRELATESTOAMETHODOFMANUFACTURINGASINGLECHIPSEMICONDUCTORINTEGRATEDCIRCUITDEVICEAMICROCONTROLLERANDAMETHODOFDEBUGGINGAPROGRAMOFTHESINGLECHIPSEMICONDUCTORINTEGRATEDCIRCUITDEVICEASWELLKNOWINTHEART,AMICROCOMPUTERISDEFINEDBYAMINIATURIZEDELECTRONICCOMPUTERCONSTITUTEDBYAMICROPROCESSORTHEMICROPROCESSORISAPROCESSORWHEREINACENTRALPROCESSINGUNITCPUOFTHECOMPUTERISINTEGRATEDONONEORFEWLARGESCALEINTEGRATEDCIRCUITSLSISTHEMICROCOMPUTERNORMALLYCOMPRISESTHECPU,ANINPUT/OUTPUTDEVICE,ANDAMAINMEMORYDEVICETHEMAINMEMORYDEVICECOMPRISESARANDOMACCESSMEMORYRAMANDAREADONLYMEMORYROMANINPUT/OUTPUTCONTROLLSIISUSEDASACONNECTINGCIRCUITPORTIONFORTHEINPUT/OUTPUTDEVICEASINGLECHIPMICROCOMPUTERISAMICROCOMPUTERWHERETHECPU,THERAM,THEROM,ANDTHEINPUT/OUTPUTLSIAREMOUNTEDINAONECHIPTHESINGLECHIPMICROCOMPUTERISCALLEDAONECHIPMICROCOMPUTERAPROGRAMISREADFROMANOUTSIDEOFACHIPOFTHEMICROPROCESSORWHILETHEPROGRAMISPRELIMINARILYINSTALLEDINTHEINSIDEINTHECHIPOFTHESIGNALCHIPMICROCOMPUTERTHEMICROPROCESSORISCAPABLEOFCHANGINGPROCESSINGCONTENTSBYRENEWINGTHEPROGRAMOFTHEOUTSIDEWHILEITISALMOSTIMPOSSIBLEFORTHESINGLECHIPMICROCOMPUTERTOCHANGEPROCESSINGCONTENTSBYAUSERBECAUSETHEPROGRAMISALREADYINSTALLEDINTHEINSIDEINTHECHIPTHEREOFHEREIN,THEPROGRAMISPRELIMINARILYSTOREDINTHEROMINADDITION,ASWELLKNOWINTHEART,READONLYMEMORIESROMSAREBROADLYDIVIDEDINTOMASKROMSWHEREINWIRINGOFCONTENTSISCARRIEDOUTATAMANUFACTURINGPROCESSINASEMICONDUCTORMAKERANDPROGRAMMABLEROMSPROMSWHEREAUSERCANELECTRICALLYWRITEWITHTHEPROGRAMTHEREINTHEMASKROMSCANBEMANUFACTUREDATTHELOWESTPRICEAMONGTHESEMICONDUCTORMEMORIESINPRINCIPLETHEREFORE,PRODUCTSHAVINGALARGEMEMORYCAPACITYAREMANUFACTUREDASTHEMASKROMSONTHEOTHERHAND,THEPROGRAMMABLEROMSHAVEFEATURESWHEREINTHEWRITINGOFTHEPROGRAMCANCARRYOUTBYAUSERATHANDTHEPROGRAMMABLEROMSARECLASSIFIEDINTOEPROMINANARROWSENSEWHEREINTHEUSERCANPROGRAMONLYONCE,ERASABLEANDPROGRAMMABLEROMSEPROMSWHICHCANBEELECTRICALLYPROGRAMMEDANDCANBEERASEDBYULTRAVIOLETLIGHTORTHELIKE,ANDELECTRICALLYERASABLEPROGRAMMABLEROMSEEPROMSINTHEEPROM,THEUSERCANPROGRAMANDALLOFDATACANBEERASEDBYIRRADIATINGITWITHULTRAVIOLETLIGHTTOBEENABLETOREWRITETHEREININASMUCHASAGLASSWINDOWFORERASINGBYULTRAVIOLETLIGHTISREQUIREDINTHEEPROM,THEEPROMISCOMMONLYCONTAINEDINACERAMICPACKAGETHEREISAONETIMEPROGRAMMABLEROMOTPASTHEEPROMINANARROWSENSETHEOPTCOMPRISESASEMICONDUCTORCHIPEMBEDDEDTHEREINTHATISSIMILARTOTHATOFTHEEPROMBUTTHEOTPCANNOTBEERASEDBYULTRAVIOLETLIGHTBECAUSETHEOTPCOMPRISESAPACKAGEWITHNOWINDOWBYUSINGANORDINARYEPROMPROGRAMMER,THEUSERCANPROGRAMINFORMATIONTOEACHMEMORYCELLINTHEOTPONLYONCETHEOTPHASACOSTWHICHISHIGHERTHANTHATOFTHEMASTROMANDWHICHISLOWERTHANTHATOFTHEEPROMTHEREISAFLASHEEPROMASAKINDOFTHEEEROMSTHEFLASHEEPROMISALSOCALLEDAFLASHMEMORYWHICHCANELECTRICALLYERASEALLOFBITCONTENTSWHICHMAYERASEEVERYBLOCKTOREWRITECONTENTSTHEREINAMONGTHEPROGRAMMABLEREADONLYMEMORIESPROMSSUCHASINGLECHIPMICROCOMPUTERISMOUNTEDINANORDINARYELECTRICCALCULATOR,APRINTER,AKEYBOARD,AMICROPROCESSORCONTROLLEDAUTOMATICELECTRICRICECOOKER,AMICROPROCESSORCONTROLLEDCAMERA,ANENGINECONTROLLERFORANAUTOMOBILE,ANSOONINASMUCHASTHESINGLECHIPMICROCOMPUTERMAINLYOFTENCONTROLSOPERATIONSOFITSEQUIPMENTWITHITINSTALLEDINTHEEQUIPMENT,THESINGLECHIPMICROCOMPUTERMAYBECALLEDAMICROCONTROLLERINADDITION,THEMICROCONTROLLERISAKINDOFTHESINGLECHIPSEMICONDUCTORINTEGRATEDCIRCUITDEVICESINORDERTOEFFECTIVELYCARRYOUTDEVELOPMENTOFTHEEQUIPMENTANELECTRONICDEVICEINWHICHSUCHASINGLECHIPMICROCOMPUTERMICROCONTROLLERISINSTALLED,VARIOUSDEVELOPMENTSYSTEMSDEVELOPMENTTOOLSAREDELIVEREDBYSEMICONDUCTORMAKERSORDEVELOPMENTTOOLMAKERSINASMUCHASTHESINGLECHIPMICROCOMPUTERMICROCONTROLLERCOMPRISESHARDWAREANDSOFTWAREWHICHARECLOSELYRELATEDTOEACHOTHERANDHASASHORTTIMEPERIODOFDEVELOPMENT,DEBUGOFTHESOFTWAREANDCHECKINGOFTHEHARDWAREMUSTBESIMULTANEOUSLYCARRIEDOUTTHATIS,DEVELOPMENTOFTHEHARDWAREANDTHESOFTWAREMUSTOFTENCARRIEDOUTCONCURRENTLYINTHISEVENT,THEDEBUGOFTHESOFTWAREISREQUIREDWITHAYETTOBECOMPLETEDHARDWARETHEREISANEMULATORASONEOFDEBUGTOOLSDEVELOPMENTTOOLSHEREIN,THEEMULATORISADEVICEORACOMPUTERPROGRAMFORIMITATING,BYUSINGASYSTEM,ANOTHERSYSTEMWITHTHEHELPOFTHEEMULATOR,VERIFICATIONOFFUNCTIONALOPERATIONSOFTHEEQUIPMENTELECTRONICDEVICEINSTALLEDWITHTHESOFTWAREISCARRIEDOUTEMULATORSAREDIVIDEDINTOANINCIRCUITEMULATORICEWHICHISUSEDWITHITDIRECTLYCONNECTEDTOTHEEQUIPMENTTHEELECTRONICDEVICEUNDERDEVELOPMENTANDASOFTWAREEMULATORUSINGALOGICSIMULATORTHATIS,THEINCIRCUITEMULATORISADEVELOPMENTTOOLFORSUPPORTINGTHEVERIFICATIONOFTHEFUNCTIONALOPERATIONSOFTHEEQUIPMENTELECTRONICDEVICEBYDIRECTLYCONNECTINGITTOTHEEQUIPMENTELECTRONICDEVICEMOUNTINGAPROGRAMCONTROLLEDMICROCONTROLLERUNDERDEVELOPMENTUSUALLY,DEVELOPMENTOFTHEHARDWAREOFTHEMICROCONTROLLERISCARRIEDOUTBYTHESEMICONDUCTORMAKERSIDEWHILEDEVELOPMENTOFTHESOFTWAREOFTHEMICROCONTROLLERISCARRIEDOUTBYTHEUSERSIDETHATIS,DEVELOPMENTOFTHEMICROCONTROLLERISCARRIEDOUTBYCOOPERATIVEWORKINGOFTHESEMICONDUCTORMAKERANDTHEUSERNOW,THEDESCRIPTIONWILLPROCEEDTOACONVENTIONALMETHODOFMANUFACTURINGOFAMICROCONTROLLERHEREIN,THEDESCRIPTIONWILLBEDIRECTEDTOTHEMETHODOFMANUFACTURING,ASANULTIMATEPRODUCT,AMICROCONTROLLERCOMPRISINGAMASKROMINWHICHANULTIMATEPROGRAMISSTORED0013FIRSTOFALL,BETWEENTHESEMICONDUCTORMAKERANDTHEUSER,INVESTIGATIONOFSPECIFICATIONSOFTHEMICROCONTROLLERTHESINGLECHIPSEMICONDUCTORINTEGRATEDCIRCUITDEVICETOBEMANUFACTUREDISCARRIEDOUTHEREIN,THEULTIMATEMICROCONTROLLERTOBEMANUFACTUREDCOMPRISESACPU,ANRAM,AMASKROM,ANDANINPUT/OUTPUTCONTROLLSIWHICHAREINCORPORATEDINTOAONECHIPINADDITION,THECPU,THERAM,THEMASKROM,ANDTHEINPUT/OUTPUTCONTROLLSIAREMUTUALLYCONNECTEDTOEACHOTHERVIAANINTERNALBUSTHEINTERNALBUSCOMPRISESANADDRESSBUSANDADATABUSTHESEMICONDUCTORMAKERPROVIDESTHEUSERWITHTHEEMULATORTHESOFTWAREEMULATORANDTHEINCIRCUITEMULATORASTHEENVELOPMENTTOOLWHILETHEUSERDEVELOPS,BYUSINGTHEEMULATOR,SOFTWAREAPROGRAMTOBESTOREDINTHEABOVEMENTIONEDMASKROMSUBSEQUENTLY,THESEMICONDUCTORMAKERDESIGNSAPRODUCTINOTPVERSIONANDTHEUSERCARRIESOUTDEBUGOFTHEPROGRAMUSINGTHESOFTWAREEMULATORHEREIN,THEPRODUCTINOTPVERSIONAPROVISIONALMICROCONTROLLERTOBEDESIGNEDCOMPRISESACPU,ANRAM,THEOTP,ANDANINPUT/OUTPUTCONTROLLSIWHICHAREINCORPORATEDINTOAONECHIPINOTHERWORDS,THEPROVISIONALMICROCONTROLLERISSIMILARINSTRUCTURETOTHEULTIMATEMICROCONTROLLEREXCEPTTHATTHEOTPISUSEDINLIEUOFTHEMASKROMHOWEVER,ANYPROGRAMISNOTSTOREDINTHEOTPANDSTORINGOFTHEPROGRAMTOTHEOTPISCARRIEDOUTBYTHEUSERSIDEINTHEMANNERWHICHWILLLATERBEDESCRIBEDTHEPROVISIONALMICROCONTROLLERISSEALEDINASEMICONDUCTORPACKAGEONTHEOTHERHAND,CARRIEDOUTBYTHEUSER,DEBUGOFTHEPROGRAMUSINGTHESOFTWAREEMULATORISCARRIEDOUTWITHTHEHARDWAREPUTINTOAYETTOBECOMPLETEDSTATETHESEMICONDUCTORMAKERPROVIDESTHEUSERWITHAPLURALITYOFTHEPROVISIONALMICROCONTROLLERSWHICHARESIMILARINSTRUCTURETOONEANOTHERTHEUSERSTORES,BYUSINGTHEEPROMPROGRAMMERWRITER,APROVISIONALPROGRAMWHICHISAPROGRAMDEBUGGEDBYUSINGTHESOFTWAREEMULATORINTHEOTPINONESELECTEDFROMTHEPLURALITYOFTHEPROVISIONALMICROCONTROLLERS,MOUNTSTHESELECTEDPROVISIONALMICROCONTROLLERINQUESTIONINANEQUIPMENTATARGETBOARD,ANDCARRIESOUTATESTOFTHEPROVISIONALPROGRAMTHATIS,BYUSINGTHEABOVEMENTIONEDINCIRCUITEMULATOR,THEUSERCARRIESOUTVERIFICATIONOFFUNCTIONALOPERATIONSOFTHEEQUIPMENTTARGETBOARDINTHEMANNERWHICHISDESCRIBEDABOVE,THEOTPISAPROMINWHICHINFORMATIONCANBEWRITTENONLYONCEACCORDINGLY,IFANYCORRECTIONPLACEERRORISFOUNDOUTINTHEPROVISIONALPROGRAMBYTHETEST,THEUSERSTORESACORRECTEDPROVISIONALPROGRAMINANOTHERPROVISIONALMICROCONTROLLER,ANDCARRIESOUTRETESTANDRECORRECTIONOFTHECORRECTEDPROVISIONALPROGRAMTHATIS,THETESTANDTHECORRECTIONTHERETESTANDTHERECORRECTIONOFTHEPROVISIONALPROGRAMISREPEATEDLYCARRIEDOUTBYREPEATINGOPERATIONSOFTHETESTANDTHECORRECTIONTHERETESTANDTHERECORRECTIONFORTHEPROVISIONALPROGRAM,ANULTIMATEPROGRAMISDETERMINEDBYTHEUSERSIDEONTHEOTHERHAND,AFTERTHEPROVISIONALCONTROLLERSAREPROVIDEDTOTHEUSER,THESEMICONDUCTORMAKERSUBSEQUENTLYCARRIESOUTDESIGNOFAPRODUCEINMASKROMVERSIONHEREIN,THEPRODUCTINMASKROMVERSIONANACTUALMICROCONTROLLERTOBEMOUNTEDINTHEEQUIPMENTTOBEDESIGNEDCOMPRISESACPU,ANROM,THEMASKROM,ANDANINPUT/OUTPUTCONTROLLSIWHICHAREINCORPORATEDINAONECHIPHOWEVER,ATTHISTIMEINSTANCE,THEULTIMATEPROGRAMHASYETTOBEWRITTENINTHEMASKROMOFTHEACTUALMICROCONTROLLER0018THEUSERSENDSPROVIDESTHEABOVEMENTIONEDDETERMINEDULTIMATEPROGRAMTOTHESEMICONDUCTORMAKERTHESEMICONDUCTORMAKERSTORES,USINGIONIMPLANTATION,THEULTIMATEPROGRAMINTHEMASKROMOFTHEACTUALMICROCONTROLLER,THEREBYAMICROCONTROLLERASTHEULTIMATEPRODUCTISMANUFACTUREDINADDITION,THEMICROCONTROLLERMANUFACTUREDINTHEMANNERWHICHISDESCRIBEDABOVEISSEALEDINASEMICONDUCTORPACKAGEANDISPRODUCEDINLARGEQUANTITYAND,ULTIMATEMICROCONTROLLERSPRODUCEDINLARGEQUANTITYAREPROVIDEDTOTHEUSER0019THEUSERMOUNTSTHEULTIMATEMICROCONTROLLERSINTHERESPECTIVEEQUIPMENTSELECTRONICDEVICES,THEREBYTHEEQUIPMENTSAREPRODUCEDINLARGEQUANTITYALTHOUGHTHEABOVEMENTIONEDMICROCONTROLLERCOMPRISESONESEMICONDUCTORCHIP,USPATNO7,199,469ORUSPATNO7,199,469B2ISSUEDTOISHIDAETALDISCLOSESASEMICONDUCTORDEVICEAMICROCONTROLLERHAVINGSTACKEDTWOSEMICONDUCTORCHIPSSEALEDWITHARESINSEALMEMBERASTHESEMICONDUCTORDEVICE,ASEMICONDUCTORDEVICECALLEDAMULTICHIPPACKAGEMCPTYPEISKNOWNALTHOUGHONESHAVINGVARIOUSSTRUCTURESAREDEVELOPEDANDMANUFACTUREDINTHEMCPTYPESEMICONDUCTORDEVICES,THEMCPTYPESEMICONDUCTORDEVICECOMPRISINGTHESTACKEDTWOSEMICONDUCTORDEVICESSEALEDWITHTHERESINSEALMEMBERBECOMESMOSTWIDESPREADISHIDAETALDISCLOSESTHESEMICONDUCTORDEVICEWHEREINACHIPFORAMICROCOMPUTERAFIRSTSEMICONDUCTORCHIPANDACHIPFOREEPROMASECONDSEMICONDUCTORCHIPAREINCORPORATEDINAPACKAGETHATIS,ISHIDAETALDISCLOSESTHESEMICONDUCTORDEVICEWHEREINTHECHIPFOREEPROMTHESECONDSEMICONDUCTORCHIPISSTACKEDONTHECHIPFORTHEMICROCOMPUTERTHEFIRSTSEMICONDUCTORCHIPANDTHETWOCHIPSARESEALEDWITHTHERESINSEALMEMBERTHECHIPFORTHEMICROCOMPUTERCOMPRISESAPROCESSORUNITCPU,ANROMUNIT,ANRAMUNIT,ATIMERUNIT,ANA/DCONVERSIONUNIT,ASERIALCOMMUNICATIONINTERFACEUNIT,ADATAINPUT/OUTPUTCIRCUITUNIT,ANDSOONWHICHAREMOUNTEDONTHESAMEBOARDTHOSEUNITSAREMUTUALLYCONNECTEDTHROUGHADATABUSANDANADDRESSBUSTHEPROCESSORUNITMAINLYCOMPRISESACENTRALPROCESSINGPORTION,ACONTROLCIRCUITPORTION,ANARITHMETICCIRCUITPORTION,ANDSOONTHECHIPFORTHEMICROCOMPUTERHAVINGSUCHASTRUCTUREISOPERATEDBYAPROGRAMONTHEOTHERHAND,THECHIPFORTHEEEPROMCOMPRISESASERIALCOMMUNICATIONINTERFACEUNIT,ANONVOLATILESTORAGEUNIT,ANDSOONWHICHAREMOUNTEDONTHESAMEBOARDACCORDINGTOISHIDAETAL,ELECTRICALCONNECTIONBETWEENTHEFIRSTSEMICONDUCTORCHIPANDTHESECONDSEMICONDUCTORCHIPISCARRIEDOUTBYINTERNALLEADSAMONGLEADSDISPOSEDAROUNDTHEFIRSTSEMICONDUCTORCHIPANDTWOBONDINGWIRES0021INADDITION,UNITEDSTATESPATENTAPPLICATIONPUBLICATIONNO2002/0027281A1ORUS2002/0027281A1DISCLOSESAMULTICHIPPACKAGEASEMICONDUCTORDEVICEWHICHISCAPABLEOFCONTROLLINGARISEINTEMPERATURE,WHICHOCCURSINSIDEAPACKAGEDUETOHEATSELFHEATINGRADIATEDFROMASEMICONDUCTORCHIPACCORDINGTOUS2002/0027281A1,THEMULTICHIPPACKAGECONSTRUCTINGAMICROCONTROLLERCOMPRISESALOWERSEMICONDUCTORCHIPONWHICHTHEMICROCONTROLLERINCLUDINGAMASKROMISFORMEDANDANUPPERSEMICONDUCTORCHIPINCLUDINGFLASHMEMORYMOUNTEDONTHELOWERSEMICONDUCTORCHIPINASMUCHASNOTRANSISTORISFORMEDONTHELOWERSEMICONDUCTORCHIPUNDERTHEUPPERSEMICONDUCTORCHIP,ITISPOSSIBLETONEGLECTTHESELFHEATINGINTHISAREAINADDITION,US2002/0027281A1DISCLOSESANEMBODIMENTWHEREINTRANSISTORSHAVINGAMASKROMFUNCTIONAREFORMEDONTHELOWERSEMICONDUCTORCHIPATAMOUNTINGAREAASUBSTANTIALLYCENTRALAREAFORTHEUPPERSEMICONDUCTORCHIPANDTHEUPPERSEMICONDUCTORCHIPTHEFLASHMEMORYISMOUNTEDONTHEMOUNTINGAREAINTHISEVENT,THEMASKROMFUNCTIONINTHELOWERSEMICONDUCTORCHIPISDISCARDEDINTHEABOVEMENTIONEDCONVENTIONALMETHODOFMANUFACTURINGTHEMICROCONTROLLER,THESEMICONDUCTORMAKERMUSTCARRYOUTDESIGNOFTWOKINDSOFPRODUCTS,NAMELY,DESIGNOFAPRODUCTOFTHEOTPVERSIONANDDESIGNOFAPRODUCTOFTHEMASKROMVERSIONASARESULT,THECONVENTIONALMETHODISDISADVANTAGEOUSINTHATITTAKESVERYMUCHTIMEEGONEYEARORONEANDHALFYEARSTODEVELOPTHEMICROCONTROLLERASTHEULTIMATEPRODUCTINADDITION,THEPRODUCTOFTHEOTPVERSIONANDTHEPRODUCTOFTHEMASKROMVERSIONAREAPINFORPINEQUIVALENTINAPACKAGESTATEANDCANBESUBSTITUTEDBYEACHOTHERHOWEVER,THEPRODUCTOFTHEOTPVERSIONANDTHEPRODUCTOFTHEMASKROMVERSIONAREDIFFERENTFROMEACHOTHERASSEMICONDUCTORCHIPSANDCANNOTBECOMPATIBLEINCHARACTERISTICSINABUNDANCETHATIS,WHENTHEPRODUCTOFTHEMASKROMVERSIONISREPLACEDWITHTHEPRODUCTOFTHEOTPWHICHISCOMPLETEDWITHEVALUATION,THEREARECASESWHEREAMALFUNCTIONSUCHASNOOPERATIONOCCURS译文在短时间内制造集成在电路器件中含有掩膜ROM的单片机的方法此应用程序是基于在2006年7月31日从日本申请的专利号2006207797中，提交了关于披露注册在这里的完整参考，拥有优先索赔利益的权利。，背景说明本发明涉及到一种制造单芯片半导体集成电路器件（微控制器）的方法和关于这种单芯片半导体集成电路装置调试程序的方法。众所周知，在工艺方面，微机的定义是由微型电子计算机所构成的微处理器。微处理器是一个或几个大规模集成电路集成在一个中央处理单元（CPU）上而构成的一个处理器（LSIS）。微处理器通常由CPU，输入/输出装置，主要存储器装置组成。主要存储器装置包括随机存取存储器（RAM）和只读存储器（ROM）。处理器LSI的输入/输出控制用来作为连接电路部分的输入/输出端口。单芯片微处理器是中央处理单元CPU，RAM存储器，ROM存储器，以及LSI的输入/输出都安装在同一芯片上的一个微处理器。单芯片微处理器也被称为单片机。在开始准备将程序安装在单片机的信号芯片里面时，程序是由微处理器外部读入单片机的。在外部更新程序指令下，微处理器有改变处理内容的权限，但是由用户修改单片机处理的内容几乎是不可能的，因为该程序已经安装在单片机晶片内。程序在初始已被储存在ROM存储器中。此外，工艺方面，只读存储器（只读存储器）在广义上被定义为掩膜只读存储器，其中接线的内容是由半导体制造商在可编程只读存储器制造过程中定义的，这样，用户能够电可擦除式地编写程式。原则上，在半导体记忆器件之中可以制造最低价格的掩膜只读存储器。然而，作为掩膜只读存储器，产品要有一个大的记忆容量的制造。在另一方面，根据可编程只读存储器的特点，其中程序的书写可以由用户来执行。狭义上讲，可编程只读存储器被定义为电可编程只读存储器EPROM，对这种存储器用户只能进行一次编程。可擦除可编程只读存储器（EPROMS）不仅可以电动编写程序，而且可以由紫外光或类似紫外光擦除程序。在EPROM中，用户可以编程或者在紫外线光照射下将所有的数据擦除，以使数据能够重写。EPROM需要一个作为紫外光可擦除的玻璃窗口，这样的EPROM通常是陶瓷封装而成。这是对可编程ROM存储器作为狭义EPROM的时候而言的。OTP中包含了一个类似EPROM的半导体芯片，但OTP不能由紫外线光擦除，因为OTP中没有封装紫外光照射擦除的玻璃窗口。通过使用一个普通的EPROM程序员，用户可以对每个存储单元编写信息，不过，在OTP中只能进行一次编写。OTP的费用高于ROM但是比EPROM的要低。另外，闪光存储器是EEPROM的一种。闪存EEPROM也被称为闪速存储器，能够电擦除所有的位内容（可擦除每块）以重写新内容，其中有可编程只读存储器（PROMS）。这样的单片机是安装在一个普通的电动计算器，印表机，键盘，微处理器控制的自动（电动）电饭煲，微处理器控制的摄像头，汽车的发动机控制器等等上的。因为单片机通常主要是设备安装上控制设备的管理员，因此单片机可称为微控制器。而且，该微控制器是一种单片集成的半导体电路器件。为了有效地进行设备（电子设备）的开发，在设备中安装了这种单片机（微控制器），而各种开发系统（开发工具）是由半导体制造商或开发工具制造商提供的。因为单片机（微控制器）组成的软件和硬件密切相关，一个短的开发时期内，软件调试和硬件检查必须同时进行。也就是说，开发单片机的硬件和软件必须经常交错进行。在此种情况下，软件的调试是被要求在硬体尚未完成之前进行的。有一个模拟器作为软件调试工具（开发工具）。在这里，作为使用的另外一个系统，模拟器是为仿真的装置或计算机程序。借助模拟器，由软件对所安装设备（电子设备）的功能进行核查。模拟器分为在电路模拟器（ICE）和软件仿真器使用的逻辑模拟器，电路模拟器直接连接到开发的设备（电子设备）下。也就是说，电路模拟器是一个支持核查设备（电子设备）功能的开发工具，在开发时安装程序微控制器直接连接设备（电子设备）。通常，微控制器硬件的开发是半导体制造商一方所进行的，而微控制器软件的开发由用户方完成。也就是说，微控制器的开发是由所有半导体制造商和用户合作进行的工作。下面将介绍制造微控制器的常规的方法。在这里，制造方法由说明指导，作为一个终端产品，微控制器组成了掩膜ROM，在其中一个初始程序被储存。首先，在半导体制造商和用户之间，检查微控制器（单片机半导体集成电路装置）的规格是在产品制造时进行的。最终微控制器制造包括一个CPU，内存，掩膜ROM，LSI的输入/输出控制，这些单元被镶嵌在同一个芯片上。此外，该CPU，RAM存储器，掩膜ROM存储器，LSI的输入/输出控制被相互连接到其他每根内部总线上。内部总线包括地址总线和数据总线。半导体制造商为用户提供模拟器（软件模拟器和电路模拟器）以其作为包络工具，使用模拟器用户将开发的软件（程序）储存在上面提到的掩膜ROM存储器中。此后，在OTP版本中由半导体制造商设计产品，用户使用软件模拟器进行程序的调试。如此，OTP版本（临时微控制器）的产品在设计上包括一个CPU，数据存储器，以及LSI的一个输入/输出控制都被嵌入在同一个芯片上。换而言之，临时微控制器是类似的结构，以终端微控制器OTP来代替的掩膜ROM。但是，在OTP中不能储存任何程序，OTP程序的储存是以用户一方的方式进行操作，这种方式稍后会加以说明。临时微控制器是被密封的半导体封装。另一方面，调试程序由用户使用软件模拟器进行，这一工作是在硬件投入尚未完成时开始的。半导体制造商为用户提供多元化的临时微控制器，他们同另一个微处理器之间有相同的结构。用户将临时程序（使用软件模拟器调试程序）存储在一个从多元化的临时微控制器中选定的OTP上，再将选定的临时单片机安装在应用设备（目标板）上，并对临时程序进行试运行。到此，用上面提到的电路仿真器，用户可以对应用设备（目标板）的功能进行核查。这样的方式在上文已有所述，OTP是一个掩膜PROM，其中的数据只可以编写一次。因此，如果任何需要校正的地方（错误）在临时程序测试时被发现，用户要将更正的临时程序存储在在另