SMT常用部分英文技术术语-辅料部分

1、1,产品名称SMT常用局部英文技术术语-辅料局部Lead-Free 无铅Material 材料No-residue 低残留No-clean免清洗Solder Paste 锡膏Solder Bar 锡条Solder Wire 锡线Solder Perform预成型锡料Solder Sphere球形锡料Flux助焊齐ijCleaner清洗剂Thinner稀释剂Surface Mount Adhesive 外表贴装胶Underfill/Underfiller 底部填充胶 /填料Encapsulant/ Sealant 密封齐U /胶Adhesive胶/粘合剂Instant Adhesive 速凝胶B

2、onder邦定胶/黑胶Abrasive研磨剂Silicone 硅脂i / iiAccelerator促进剂,加速剂Saponifier皂化齐1JCoating涂料,覆料Activator活化剂,活性剂Inhibitor阻缓剂Thermally Conductive Adhesive 导热胶Thermally Conductive Silicone 导热硅月旨Electrically Conductive Silicone 导电硅胶2,客户产品名称&客户部门及各部门员工职称液晶显示器 LCD (Liquid Crystal Display发光二极管 LED (Light Emitting

3、 Diode)电阻 resistance电阻器resistor整流器rectifier电容 capacitance电容器 capacitor/capacitator电感 inductance电感器 inductor/inducer变压器 transformer蓄电池 storage battery继电器 electrical relay2 / 11充电器 charger/ battery charger电源 power/ power supply集成电路 IC (Integrated Circuit)电路板 circuit board不间断电源 UPS (Uninterruptable Pow

4、er Supply)连接器connector操作指导书 /工艺文件 operation guide/ process paper设计文件 Design Document技术标准 technical standard3,产品测试工程Density/Specific Gravity 比重Colour颜色Odor气味Solid Content/ Percentage non volatile 固体含量Halide Content卤化物含量Flash Point 闪点Acid Number/Value 酸值(酸价)Viscosity粘度值Foaming test起泡试验Physical state/

5、Appearance 物理状态PH Value酸碱度3 / 11Boiling Point 沸点Melting Point 熔点Upper Explosion Limits in air 空气中爆炸上限Lower Explosion Limits in air 空气中爆炸下限Solubility in water 水溶解度Dynamic Viscosity 动态粘度值Required Thinner使用稀释剂/配套稀释剂Water Content 含水量Vapor Pressure 蒸汽压力Evaporation Rate挥发率/挥发速度Drying Point 干点TLV (Threshol

6、d Limit Value)临界值,极限值TLV of Solvent容许吸入量Glass Transition Temperature 玻璃化温度Coefficient of Thermal Conductivity 导热系数Tensile Strength抗拉伸强度Shear Strength抗剪切强度Powder Mesh Size/Shape粉末(颗粒)尺寸/形状Metal Content金属含量Copper Mirror铜镜测试Silver Chromate铭酸银测试4 / 11SIR Surface Insulation Resistance 外表绝缘阻抗Volume Resist

7、ance 体积电阻率Hardness 硬度Dielectri Constant 介电常数dielectric loss 介电损耗dielectric loss angle tangent 介电损耗角正切water absorbing capacity 吸水率grain size/particle size 颗粒大小分布rate of expansion 扩展率shrinkage factor 收缩率adhesion strength/bonding strength 粘接强度linear expansion coefficient 线性膨胀系数degree of liberation 游离度c

8、oefficient of thermal conductivity 导热系数Corrosion腐蚀测试Ductility factor延展性系数Thixotropy 触变性Thixotropy index触变性指数linear coefficient of thermal expansion 线性热膨胀系数Elasticity Coefficient 弹性系数Creep Strength抗蠕变强度5 / 11Whisk Test锡须发生测试或其它金属须4,助焊剂单位&包装&标签单位Oz 盎司Ounce, 1Oz=28.35xxg/gm 克gramC 摄氏度Celsius, 1

9、C = Tx1.8+32=33.8 F F 华氏度Fahrenheit, 1 °F = T-32 /1.8=-17.2CL 升/公升Litre, Liter, 1L=0.2199xx 英,=0.2641 力口仑美,液Pound/Lb.磅1 磅=0.4536 千克Gal.加仑Gallon, 1Gal 英=4.5461 升,1Gal xx=3.7854升标签Shelf Life贮存寿命Working Life工作寿命6 / 11Lot No.批号Net/Net Weight 净重Exp. Date有效期至Mfg. Date制造日期5,品质治理专业术语QC (quality control

10、)品质治理(员)SQC (Statistical Quality Control)统计品质治理TQC (Total Quality Control)全面品质治理AQL (Acceptable Quality Level允许水准,可接受品质等级QA (Quality Audit)品质稽核QE (Quality Engineering)质量工程IPQC(In Process Quality Control 制程检验FQC (Final Quality Control)最终检验,线上检验OQC (Outgoing Quality Control)出货检验SIP (Standard Inspectio

11、n Procedure 检验标准MQM (Modern Quality Management)(日本)现代品质治理体系(比 ISO9001 严格)QCC (Quality Control Circle)Check Sheet6,其他工程被欧盟禁止的有害物质Lead 铅 Pb7 / 11Cadmium 镉 CdMercury 汞/水银 HgHexavalent Chromium 六价铭 Cr+ 6PBB (Polybrominated biphenyls)澳化联苯PBDE(Polybrominated biphenyl ether)澳化联苯醍常见金属中英文名tin xxSnlead 铅 Pbsi

12、lver 专艮 Agcopper 铜 Cubismuth 韧 Bizinc 锌 Znnickel 银 Niantimony 镶 Sbaluminum 铝 AlCadmium 镉 Cdferrum 铁 Fechromium 铭 Crarsenic 碑 Asxx名称及缩写Japan xx8 / 11Taiwan xxTaiwan District 台湾地区Hongkong xxU.S.A (United States of America)美国U.S (United States)美国South Korea xx 品管圈核查表,审查表U.K (United Kingdom)英国,联合王国Italy

13、 xxWEEE- (Waste From Electrical And Electronic Equipment欧盟?关于报废电子电器设备指令?(简称：WEEEJ旨令)ROHS- (The Use Of Certain Hazardous Substances In Electrical And Electronic Equipment)欧盟?关于在电子电气设备中限制使用某些有害物质指令?(简 称：ROHSf旨令)ISO (International Organization for Standardization)国际标准化 组织Rework/Reworking 返修CAS xx(t学文摘EMSOEMOSP9 / 11ENIGIMAgIMSnSAC (Sn/Ag/Cu)MSDS (Material Safety Data SheetPreheat ZoneSoak ZoneRamp to ReflowReflow ZoneCooling ZoneReflow