PCB基板厚度(包括芯板及半固化片)

1、PC眼材厚度规格：0.5mm , 0.7mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 1.6mm, 2.0mm, 2.4mm, 3.2mm, 6.4mmPC眼上铜箔的厚度规格：18um, 25um, 35um, 70um 和 105um常用半固化片规格:型号10802116L2116A2116H15007628L7628A7628H7628M厚mil344.55677.59.38板厚一般分为含铜和不含铜两种厚度.含铜厚度:规格配料结构规格配料结构0.1H/H1M061.1/16 762831/11 X2116H/H7 76280.H/12X10801.2/27 76282H/

2、H1 X150641/17 7628T/T1 X7628H/H7 76282/21M062/27 76282/21 X15061.1/18 7628H/21 X76285H/H8 76280.1/12X2116T/T8 76283H/12X21161.2/28 7628H/H1080+2116+108061/18 7628T/T1080+2116+1080H/H8 76282/21080+2116+10802/28 76280.1/11080+7628+10801.4H/H2X762871/19 7628T/T2X7628H/H9 76280.52/22X76281.82/29 76281/1

3、7628+1080+76281/19 7628H/H7628+1080+7628H/H9 76280.62/27628+1080+76281.92/29 76281/13X76281/110 7628H/H3X7628H/H10 76280.72/23X76282.02/210 76281/12116+2 X7628+21161/110 7628H/H1080+3 X7628+1080H/H11 76280.82/21080+3 X7628+10802.1/111 76281/14X76282H/H12 7628H/H4X76282.32/212 76280.92/24X76281/112 7

4、6281/12 X7628+1080+2 X7628H/H12 7628H/H2 X7628+2116+2 X76282.42/212 76281.02/22 X7628+2116+2 X76281/113 76281/15X7628H/H13 7628H/H5X76282.52/213 76281.12/25X76281/113 76281/15X7628H/H13 7628H/H6X76283.02/216 76281.22/26X76281/116 76281/16X7628H/H16 7628H/H6X76283.1/117 762822/217 7628.不含铜厚度厚度mil厚度mm

5、配料结构备注20.0501 M06不含2OZ铜箔30.0750.076主：1 X1080 次:1 X1086不含2OZ铜箔厚度mil厚度mm配料结构备注40.100.102主：1 X2116 次:1 X3313 或 2X106 或 1 X2113 或 1 2313 或 1080+10650.127主：1 X2116 次:2 X108060.1500.152主：1 X1506 次:2 X108070.178主：1 X7628 次：1080+211680.2000.203主：1 X7628 次:2 X2116 或 2 211390.2280.2302X2116100.250.2542X211611

6、0.280主：1080+2116+1080 次:2 2165120.3000.305主:2 X1506 次:2116+1080+2116130.33主：1080+7628+1080 次:2 X1506140.3560.362X7628150.382X7628160.4060.41主:2 X7628 次:3 X2116170.43主：7628+1080+7628 次:2 X7628180.4570.467628+1080+7628190.487628+2116+7628200.5080.51主：7628+2116+7628 次:7628+2 X080+7628 或 37628210.533X76

7、28220.563X7628230.583X7628240.600.61主:3 X7628 次:2116+2 7628+2116250.64主:3 X7628 次:2116+2 7628+2116260.661080+37628+1080270.691080+37628+1080280.710.711主:4 X7628 次:4 X7628300.764X7628310.790.804X7628友情备注：1 foot = 12 inch = 304.8 mm linch = 25.4 mm1 mil=0.0254 mm1 inch=1000 mil1OZ=28.375g1 OZ铜箔其真正厚度为

8、1.38mil或35 dm、芯板、半固化片规格1 .生益芯板常见规格：0.1mm （含铜厚）0.2mm5.120.3mm9.060.4mm12.990.5mm16.930.6mm20.870.7mm24.80.8mm28.740.9mm36.611mm44.491.2mm52.361.5mm56.31.6mm60.242mm75.982.4mm91.732 .半固化片：10803.0mil21164.2mil76287.0mil3 .流胶厚：10802.5mil76286.5mil0.14mm=2*10800.21mm=2*21160.24mm=7628+10800.36mm=2*76280.

9、4mm=2*7628+1080二、常用半固化片在不同铜厚、不同图形厚度变化1. HOZCopper/gn dGnd/gndCopper/sign alGnd/sign alSignal/sig nal76287.37.06.86.76.621164.64.44.24.03.833133.93.83.73.53.310802.82.62.52.42.27628H7.67.37.17.06.92116H4.94.74.54.34.13313H4.14.03.93.73.51018H2.92.72.62.52.37628C7.16.86.66.56.43313C3.73.63.53.23.12. 1

10、OZCopper/gn dGnd/gndCopper/sign alGnd/sign alSignal/sig nal76287.16.86.66.56.421164.54.34.13.93.733133.83.73.63.43.210802.82.62.52.42.27628H7.47.16.96.86.72116H4.84.64.44.24.03313H4.03.93.83.63.41018H2.92.72.62.52.37628C6.96.66.46.36.23313C3.63.53.43.23.03. 2OZCopper/gn dGnd/gndCopper/sign alGnd/sig

11、n alSignal/sig nal76286.86.56.36.16.021164.24.03.83.53.333133.53.43.33.12.810802.62.42.32.11.97628H7.16.86.66.46.32116H4.54.34.13.83.63313H3.73.63.53.33.01018H2.72.52.42.22.07628C6.66.36.15.95.83313C3.33.23.12.92.64. 3OZCopper/gn dGnd/gndCopper/sign alGnd/sign alSignal/sig nal76286.56.26.05.75.62116

12、4.03.83.63.23.033133.33.23.12.82.510802.42.22.11.81.67628H6.86.56.36.05.92116H4.34.13.93.53.33313H3.53.43.33.02.71018H2.52.32.21.91.77628C6.36.05.85.55.43313c3.13.02.92.62.3注：Gnd为65猊上的大铜箔，H为高树脂含量，C为低树脂含量。S0401粘结片压合厚度（100%残铜率）标树脂含量压合厚度压合厚度规於、a m/ 受0 a mMil10671七502.0 此41080L61七712.8 此41080A64七783.1 此

13、41080H68七903.5 此42116L50七1134.4 此62116A52七1204.7 此62116H56七1335.2 此6331355七1004.0 此67628L41七1857.3 此87628A43七1957.7 此87628M46七2108.3 此87628H50七2309.1 此81506A45七1606.3 此81506H49七1756.9 此8S0701粘结片压合厚度（残铜率100%规树脂含量压合厚度a m/ 受0 a m压合厚度Mil10671七512.0 此41080L61七722.8 此41080A64七803.1 此41080H68七923.6 此42116L

14、50七1154.5 此62116A52七1214.8 此62116H56七1355.3 此6331355七1024.0 此67628L41七1887.4 此87628A43七1987.8 此87628M46七2138.4 此87628H50七2359.3 此81506A45七1626.4 此81506H48七1756.9 此8S1000B粘结片压合厚度（残铜率100%规树脂含量压合厚度a m/ 受0 a m压合厚度Mil10671七471.9 此41080L63七712.8 此41080A66七783.1 此41080H68七833.3 此42116L52七1124.4 此62116A55七1214.8 此62116H58七1325.2 此6331355七943.7 此67628L43七1857.3 此87628A46七1987.8 此87628M48七2078.1 此87628H50七2188.6 此81506A45七1515.9 此81506H48七1626.4 此8S0155粘结片压合厚度（100厥铜率）树脂含量压合厚度压合厚度规门、a m/ 受0 a mMil1067