品质管理英文名词

1、Accuracy准确度Active主动Action评价.处理Activity 活动Add加Addition rule加法运算规那么An alysis Covaria nee 协方差分析An alysis of Varia nee方差分析Appraisal Variati on 评价变差Approved 成认ASQC美国质量学会Attribute计数值Audit审核Automatic database recovery数据库错误自动回复Average平均数bala nee 平衡Bala nee sheet资产负债对照表Bi no mial二项分酉己Body机构Brain storm ing Te

2、ch niq ues 脑力风暴法Busi ness Systems Pla nning企业系统规划Cable电缆Capability 能力Cause and Effect matrix 因果图.鱼骨图Centerline 中心线check检杳Check Sheets 检杳表Chi-square Distributi on 卡方分布Clutch spring离合器弹簧Coining压印加工Com mon cause 共同原因Complaint 投诉Compo und factor 调合因素Concept新概念Condenser聚光镜Conformity 合格Connection 关联Consum

3、er ' s risk消费者之风险Control 控制Con trol characteristic管制特性Control chart 管制冬Control plan管制方案Correcti on 纟纟片正Correlation Methods 相关分析法Cost down降低本钱CPI: con ti nu ouse Process Improveme nt连续工序改善Creep渐变Cross Tabulati on Tables 交 * 表CS: customer Sevice 客户中心Cushion 缓冲Customer 顾客DSA: Defects An alysis Syst

4、em缺陷分析系统Data数据Data Collectio n 数据收集Data co ncen trator资料集中缓存器DCC: Docume nt Con trol Ce n ter文控中心Decision决策.判定Defects per unit 单位缺点数Descripti on 扌苗述Detection难检度Device装置Digital 数字Do执行DOE: Desig n of Experime nts实验设计Element 兀素Else否那么二ngin eeri ng recbno logy工程技术Entropy 函数Environmental 环境Equipment 设备Es

5、timated accumulative freque ncy计算估计累计数EV: Equipme nt Variati on设备变异Eve nt事件External Failure外部失效，外部缺陷ZA: Failure An alysis 坏品分析zact control事实管理zatique 疲劳-MEA: Failure Mode and Effect an alysis失效模式与效果分析=PY合格率-QA: Fi nal Quality Assura nee最终品质保证-QC: Fi nal Quality con trol 最终品质控制Full-steer完全转向function

6、职能Gauge system 量测系统Grade等级Gum-roll橡皮滚筒Health meter 体重计Heat press 冲压粘着Histogram直方图Hi-tech高科技hypergeometric 超几何分酉己hysteresis磁滞现象mprovement 改善nductanee 电感nformation 信息n itial review 先期审查nspection 检验nternal Failure内部失效，内部缺陷PQC: In Process Quality Co ntrol制程品质控制QC: In commi ng Quality Co ntrol来料品质控制S In

7、tern ati onal Orga ni zatio n for Sta n dardizati on国际标准组织.aw of large number 大数法贝 Unk连接.CL: Lower Con trol limit管制下限.QC: Li ne Quality Co ntrol生产线品质控制lSL: Lower Size Limit规格下限Machine 机械Man age管理Materials 物料Measurement 量测Median中位数Miss feed 漏送Module,sub-system,sub-unit单位Momentum 原动力Mon te garlo metho

8、d 原子核分裂热运动法MSA: Measureme nt System An alysis量测系统分析Multiplication rule乘法运算规那么NIST美国:标准技术院Normal常态分布Occurrenee 发生率On .off system 开,关系统Operati on In struct ion 作业指导书Organization 组织Parameter 参数Parto柏拉图Parts零件Parts per millio n 不良率Passive消极的，被动的zPlan方案Pulse脉冲Policy方针Population 群体Power力量,能源pQA: Process Q

9、uality Assura nee制程品质保证Practice 实务Preeision精密度preemptive先占式多任务Pressure 压缩Prevention 预防Probability 机率Probability den sity fun ctio n机率密度函数Procedure 流程Process 过程Process capability an alysis制程能力分析图Process con trol and process capability制程管制与制程能力Producer s risk生产者之风险Product 产品Product ion 生产Program 方案Pro

10、jects 工程QA: Quality Assura nee品质保证QC: Quality Control 品质控制QE: Quality Engin eeri ng品质工程QFD: Quality Fun ctio n Desg in品质机能展开Quality 质量Quality manual 品质手册Quality policy 品质政策Random experime nt 随机试验Random nu mbers 随机数Range全距Record记录Reflow回流Reject拒收Repair返修Repeatusility 再现性Reproducibility 再生性Requirement

11、 要求Residual 误差Resp onse 响应Resp on sibilities 职责Review评审Reword返工Robust ness 稳健性Rolled yield 直通率RPN: Risk Priority Number 风险系数sample抽样,样本Sample space 样本空间Sampli ng with replaceme nt放回扌由样Sampli ng without replaceme nt不放回扌由样Scatter diagram 散布图分析Scrap报废Screw螺旋Severity严重度Shot-preening微粒冲击平面法Simple random

12、sampli ng 简单随机取样Size规格SL: Size Line 规格中心线Slip滑动Stratified random sampli ng分层随机抽样SOP: Sta ndard Operatio n Procedure标准作业书SPC: Statistical Process Con trol 统计制程管制Special cause 特殊原因Specification 标准SQA: Source(Supplier) Quality Assura nee供货商品质保证Stage sampli ng分段随机抽样Sta ndard Deviati on 标准差Sum of squares

13、 统计表supplier平方和System供方systematic sampli ng 系统，体系Statistical tables系统抽样Taguchi-method 田口方法Tech ni cal committees 技术委员会Test piece测试片Theory原理Time stamp时间戳印Time-lag 延迟Title标题Torque转矩Total求和TQC: Total Quality Con trol全面品质控制TQM: Total Quality Man ageme nt 全面品质管理Traceability 追溯Training 培训 1Tran sacti on p

14、rocess ing and logging交易处理Trouble 困扰Up and down 上和下UCL: Upper Control Limit管制上限USL: Upper Size Limit 规格上限Validation 确认Variable计量值Varianee变异禾口Vector向量Verifieation 验证Version 版本VOC: voice of Customer 客户需求VOE: V oiee of Engin eer 工程需求GRR Gauge Repeatability Reproducibility量测的再现性与再生性FPI First Piece In sp

15、ection首件检杳Sampli ng without replaceme nt不放回扌由样SQA: Source(Supplier) Quality Audit供货商品质审核1. QC : quality con trol质量管理2. IQC : in comi ng quality con trol进料质量管理3. OQC : output quality con trol出货质量管理4.PQC : process quality con trol制程质量管理也称IPQC : in process quality control .5. AQL : acceptable quality l

16、evel允收标准6.CQA: customer quality assura nee客户品质保证7. MA : major defeat主要缺点8. MI : minor defeat次要缺点9. CR :critical defeat关键缺点10. SMT : surface mou nting tech nology外表粘贴技术11. SMD :surface mou nting device外表粘贴程序SMC : surface mounting comp onent 外表粘贴组件12.ECN : en gi n eeri ng cha nge no tice工程变更通知13.DCN :

17、 desig n cha nge notice设计变更通知14.PCB : printed circuit board 印刷电路板15.P CBA : printed circuit board assembly装配印刷电路板16. BOM : bill of material材料清单17. BIOS : basically in put and output system根本输入输出系统18. MIL-STD-105E :美国陆军标准，也称单次抽样方案.19. ISO : in ternatio nal sta n dard orga ni zatio n国际标准化组织20. DRAM:内存

18、条21.Polarity :电性22. Icicles :锡尖23. No n-wetti ng :空焊24. Short circuit :短路25. Miss ing comp onent : 缺件26. Wrong comp onent : 错件27 . Excess comp onent : 多件28. I n sufficie nt solder : 锡少29 . Excessive solder : 锡多30. Solder residue:锡渣31. Solder ball :锡球32. Tombst one :墓碑33 . Sideward :侧立34. Comp onent

19、damage : 零件破损35. Gold fin ger:金手指36. SOP : sta ndard operatio n process标准操作流程37. SIP : sta ndard in specti on process标准检验流程38 .The good and not good segregatio n :良品和不良品区分39. OBW : on board writer 熸录 BIOS40 . Simple ran dom sampli ng : 简单随机抽样41. Histogram :直方图42 . Sta ndard deviation :标准差43. CIP : C

20、on ti nu ous improveme nt program持续改善计戈 U44. SPC : Statistical process con trol制程统制45 . Sub-c on tractors : 分包商46. SQE: Supplier quality engin eeri ng47. Sampli ng sample :抽样方案48. Loader :治具49. QTS: Quality tracki ng system质量追查系统50. Debug :调试51. Spare parts: 备用品52. Inven tory report for : 库存表53. Man

21、 power/Tact estimati on工时预算54. Calibration :校验55. S/N :serial nu mber 序号56. Corrugated pad :波纹垫57.Takeout tray:内包装盒58. Outer box :外包装箱59. Vericode :检验码60. Sum of square :平方和61. Range :全距52. Conductive bag :保护袋53. Preve n tive maintenance :预防性维护54. Base unit :基体55. Fixture :制具56. Probe :探针57. Host pr

22、obe :主探针58. Golden card :样本卡59. Diag no stics program :诊断程序70. Frame :屏面71. L in t-free gloves :静电手套72 .Wrist wrap :静电手环73. Target value :目标值74. Related departme nt : 相关部门75. lifted solder浮焊76.plug hole 孑L塞77. Wrong direction 极性反78 p onent damage or broke n零件破损79.U nm eleted solder 熔锡不良30.flux resid

23、ue 松香未拭31.wr ong label or upside dow n label贝占反32. mixed parts 机种混装33. poor solder mask 绿漆不良84. oxidize零件氧化85.sta nd off height 浮高86. IC reverse IC 反向87.supervisor 课长88. Forman 组长89. Wl=work in structio n作业指导90. B.P.V:非擦除状态91. I n ternal notificatio n:内部联络单92. QP :Quality policy 质量政策93. QT: Quality

24、target品质目标94. Trend:推移图95.Paret柏拉图96. UCL: Upper con trol limit管制上限97丄 CL:Lower con trol limit管制下限98. CL: Cen ter line 中心线99.R.T. Y: Rolled throughout yield 直通率100. PPM: Parts per millio n不良率101.DPU: Defects per unit 单位不良率1O2.Resistor:电阻1O3.Capacitor:电容104. Resistor array :排阻105. Capacitor array:排容1

25、06. DIODE:二极管107.SOT:三极管108. Crystal:震荡器109.Fuse 保险丝110.Bead:电感111.Connector:联结器112.ADM: Admi nistrati o n Departme nt行政单位113. CE: Compo nent En gi neeri ng零件工程114. CSD :Customer Service Departme nt客户效劳部115. ID: In dustrial Desig n工业设计116.IE: In dustrialEn gi neeri ng 工业工程117. IR: In dustrialRelatio

26、nship 工业关系118. ME: Mecha ni cal Engin eeri ng机构工程119. MIS :Man ageme nt In formatio nSystem信息部120. MM: Material Ma nageme nt资材121. PCC: ProjectCoordi natio n/Co ntrol 专案协调控制122. PD: Production Departme nt生产部123. PE: Product Engin eeri ng产品工程124. PM: Product Man ager 产品经理125. PMC: Productio nMaterial

27、 Co ntrol生产物料管理126. PSC: Project Support & Co ntrol产品协调127.Mag nesium Alloy:镁合金128. Metal Sheari ng:裁剪129.CEM:C on tract Electro nicsManu facturi ng 电子制造效劳企业EMS: Electro nics Man ufacturi ng Services130. ERP: En terprise Resource Pla nninq企业资源规划SCM+CRM+ERP+EAI=Network direct TM links procureme n

28、t, productio n. Logistics and sales采购，生产，后勤管理及市场营销的融合EAI: En terprise applicati on In tegrati on企业应用系统整合CRM: Customer Relatio n ship Pla nning客户效劳规划SCM : Supply chain ma nageme nt供给链管理131. OJT: On job trai ning在职培训132.Access Time:光盘搜寻时间133. B2CEC:Busi ness to con sumer electro nic commerce企业对消费者的电子商

29、务B2BEC:Bus in ess to bus in ess electr on ic Commerce企业间的电子商务134.CCL:Copper Clad Laminate铜箔基板135. Intranet:企业内部通讯网路136. ISP: In ternet Service Provider网络效劳提供者ICP: In ternet Co ntent Provider网络内容提供者137. GSM: Global System for Mobile Com mun icatio n泛欧数子式行动 系统GPS:全球卫星定位系统138. Home Page:网络首页139.Video C

30、lip:影像文件140. HTML:超文标记语言141.Domainname:网域名称142. IP:网络网域通讯协议地址143.Notebook:笔记型计算机144. VR: Virtual Reality虚拟实境145. WAP: Wireless Applicati on Protocol无线应用软件协议146. LAN : Local area network局域网络WWW: World Wide Web 世域网WAN: Wide Area Network 广域网络147. 3C: Computer, Communication, Consumer electronic计算机，通讯，消

31、费性电子三大产品的整合148.I nformation Supplier Highway:信息高速公路149.UPS:U nin terrupted powersystem不断电系统150.Processed material: 流程性材料151.Entity/ltem:实体152.Quality loop:质量环 153.Quality losses:质量损失154.Corrective action:纠正措施155. Preventive action:预防措施156.PDCA:Plan/Do/Check/Action方案 / 实施 /检查 /处理157. Integratedcircui

32、ts(IC):集成电路158.Applicati onprogram:应用程序159.Auxiliary storage/Second storage:;辅助存储器161.Silicon chip:硅片162Diskette drive:软驱163.Display screen/Monitor: 显示器164.Foreground:前面165.Montherboard:母板166.Mermory board:内存板167.Slot :插槽168.Bus:Data-bus/address-bus/Control bus:总线 /数据总线 /地址总线 /控制总线169.Plotter:绘图170：

33、0姻£规 ltimedia perso nal computer 振多媒体荡器172.Automatic teller term in al: 自动终端(出纳)机173.Joystick port:控制端口174.VGA: VideoGraphics Array 显示卡175.Resolution:分辨率176.Register:存放器177.ISA: 1 ndustry Sta ndard Architecture:工业标准结构178.EISA: Exte nded In dustryArchitecture179.Adapter:适配器18O.Peripheral:外部设备181

34、.Faxmodem:调制解调器181.NIC:Network in terface card 网络接口卡182. SCSI: Small computer system in terface183.VESA: Video Electro nicSta n dards Associati on184. SIMM: Sin gle in-li ne memory module单排座存储器模块内存条185.Casing:外箱186.Aluminum:铝质187.Ceramic:陶瓷的188.Platter:圆盘片189.Actuator:调节器19O.Spindle:轴心191.Actuation

35、arm:存取臂192.Default code:缺省代码193.Auxiliary port:辅助端口194.Carriage return :回车195.L in efeed:换行196.ASCII: America n Stan dard Code for In formatio n In tercha nge197.Video analog:视频模拟198.TTL: Transistor- Transistor logic晶体管-晶体管逻辑电路199.Three-pro ngplug:三芯电插头200.占o隅1eiick:nnor:连接插座2O2.Output level:输出电平2O3

36、.Vertical/Horizo ntal synchroni zati on:场 / 行同步2O4.H(Horizontal)-Phase:行相位2O5 patible:兼容机206.Hardware Expansion Card: 硬件扩充卡207.Buffer:缓冲2O8.CRM:Customer relatio n ship Ma nageme nt客户关系管理209.WIP: Work in process半成品21O.Waiver:特别采用211.CXO 系列一 CEO Chief Executive Office 首COO :Chief Operating OfficeCFO C

37、hief Finance OfficerCBO Chief Busi ness OfficerCTO Chief Techn ology OfficerCIOChief In formation OfficerCGO Chief Governme nt Officer212. NASDAQ:纳斯达克证券市场NASDAQ Automated Quotati on system213.VC: Ven ture Capital风险投资214. PDA: Perso nal Date Assista nt个人数字助理PLA: Perso nal In formation Assista nt个人信息助

38、理215. PPAP: Adva n eed Product Quality Pla nning and Con trol Pla n生产性零组件核准程序216. FMEA: Pote ntial Failure Mode and Effects An alysis失效模式与效应分析217. MSA: Measureme nt Systems An alysis量测系统分析218. QAS: Quality System Assessme nt质量系统评鉴219. Cusum:累计总合图220. Overall Equipment Effectiveness设备移动率221. Ben chma

39、rk ing: 竞争标杆An alysis of motio n/Ergono mics动作分析/人体工程学222. Roka Yoke 防错法MCR: machi ne capability ratio机器利用率223. Mistake Proofi ng防呆法Taguchi methods 田口式方法224, Vertical integration垂直整合Surveillanee 疋期追踪审查225. EMS: Electr on ics Manu facturi ng Supply-cha in226. Cause & Effects charts 特性要因图227. Scat

40、ter:散布图Fool-Proof System 防呆系统228. VE: Value En gi neeri ng价值工程QFD: Quality Fun ctionDevelopment 质量机能展开229. Arrow Chart箭头图法Affiliate Chart 亲和图法230. PDPC: Process Decision Program ChartSystem Chart 系统图法231. Relation Chart 关边图法 Matrix Chart 矩阵图法232. Matrix Data An alysis矩阵数据分析法234. Brain-storm 脑风暴法JIT:

41、 Just In Time:及时性生产模拟235. Demi ng Prize:戴明奖Prototype 技术试作236. BPM: Business Process Management .业务流程管 MBO 目标管理237. MBP:方针管理FTA:故障树分析QSCV:效劳质量238. IPPB: Information情况planning 筹划Programming 规划Budget预算239. EQ: Emotion Quotie nt: 情商IQ: In tellige nee Quotie nt: 智商240. Implied Needs:隐含要求Specified Require

42、me nt:规定要求241. Probati on: 观察期Incoming Product released for urge nt product ion紧急放行242.Adva n eed quality pla nning先进的质量筹划243. AOQ: Average Outgoi ng Quality平均检出质量AOQL: Average Outgoi ng Quality Limit平均检出质量界限244.Approved Supplier List经核准认可的供给商名单245.Attribute date 特征Be nchmarki ng基准点Calibrati on校准246

43、.C apable process 工序能力 Capability Index 工序能力指数Cap ability ratio工序能力率247.CHANGE CY CLE TIME修改的时间周期Co nti nuous improveme nt持续改良248. Con trol pla ns控制筹划Cost of quality质量本钱249. Cycle time reductio n减少周期时间250. Design of experiments头验设计Deviation / Substitution偏差 / 置换251. ESD: Electrostatic discharge静电释放2

44、52. EH&S: Environmental, Health, and Safely环境,健康.平安253. ESS: En viro nmental Stress Scree ning环境应力筛选254. FMEA: Failure Mode Effect An alysis失误模式效应分析255. First Article approval产品的首次论证256. First pass yield一次性通过的成品率257. First sample in specti on第一次样品检验258. FMECA: Failure mode effect and critically analysis失误模式，效应及后果分析259. Gauge control 测量仪器控制260. GR&R: Gauge repeatability and reproducibility测量仪器重复性和再现性261. HALT: Highly Accelerated Life Test高加速寿命试验262. HAST: Highly Accelerated Stress Test高加速应力试验263. IN