ANSYS R18 SI产品新功能介绍

1、ANSYS R18 SI产品新功能介绍HFSS update：宽带自适应网格 Broadband Adaptive Meshing.宽带: 用户自行设置感兴趣的频段 HFSS自动确定频率点 2HPC任务提交: 分段独立设置为仿真的每一步定义独立的HPC 资源Initial meshAdaptive meshFrequency sweep在整个仿真过程中优化HPC资源34ANSYS Siwave R18 UpdateR18 SIwave新功能带感应线位置的多相电源模块直流压降求解器与Mechanical和Icepak进行电热交互（焦耳热）用于电源完整性分析的RLCG提取(SIwave-CPA &

2、 Q3D求解器)3D Layout界面下的DoE优化（需Optimetrics License）时频域串扰扫描平面波激励求解器 (电磁耐受度)Synopsys HSPICE, Cadence PSPICE, and SIMetrix Simplis电路模型5RH-CTAThermal TotemAnalog/IPPowerArtistRTLRedHawkSoCSIwaveQ3DNexximCPAPSIHSPICEPSPICEHFSSSpectre6R18 SIwave新功能带感应线位置的多相电源模块直流压降求解器与Mechanical和Icepak进行电热交互（焦耳热）用于电源完整性分析的RL

3、CG提取(SIwave-CPA & Q3D求解器)3D Layout界面下的DoE优化（需Optimetrics License）时频域串扰扫描平面波激励求解器 (电磁耐受度)Synopsys HSPICE, Cadence PSPICE, and SIMetrix Simplis电路模型7带传感线位置的多相电源模块SIwave新加入的功能。通过检测负载工作电压，自动平衡PCB或封装上的负载电流。工作原理：通过感应线检测电压，为了确保CPU或ASIC上电压合 适，多相电源模块使用反馈环满足PCB板上负载电流 需求。Active DeviceVRM8多相电源模块简介91、多相电源模块基础 远程监

4、测 电流平衡2、执行SIwave直流压降分析3、在SIwave中如何建立多相电源模块4、直流仿真设置、分析和结果开环电源供电网络在真实电源供电网络中，在电源和负载芯片之间会存在路径电阻 使得负载电压产生跌落 Creates a drop in the delivered voltage. 负载电压随负载电流变化而变化 Load voltage changes as the load current varies. = 10闭环电源供电网络远程监控挽救负载电压创建反馈环路，将负载电 压反馈给可变电流源，有 助于减少电压跌落。这是一个真实的降压型变 换器的直流平均模型.Remote sense l

5、ine( )= Want to be “big enough”to make this term small.KCL: 11= 开关电源模块主流降压型电源变化器等效电路。 脉宽调制脉冲控制开关管。Includes the popular “buck”regulators.PWM pulse controlsthe switching transistors.占空比 Duty cycle = /优点：电源模块功耗低 Advantage: only a small amount of power is dissipated by regulator.缺点：输出电流和电压有纹波 Disadvanta

6、ge: output current/voltage has a ripple.Load() = 12多相电源模块使用2个或更多的电源变换器同时工作对设计有帮助。每一路电源变换器叫就是一个相 源。Having two or more regulators working together can help.所有的供电电流流入同一电源网络Both supply current to the power delivery network.可以调节这些电源变化器的相位消除纹波 Can adjust their phases to (mostly) cancel ripples out.() ()13

7、 ()为什么要使用多相电源模块14减少输出纹波.先进处理器工作电压低(1 to 2 volts)，并且消耗电流很大，根据芯片工作活跃程度为1-150A.使用单一电源模块很难提供这么大的电流，非常昂贵。多相电源模块构架From Walters US Patent 6,278,263 (Intersil Corp.)15电流平衡需求16如果设计不小心，不同路径的供电电流会差异很大。 在供电网络中不用位置，路径电阻不同。 不同的电源芯片驱动力有差异.This is bad: 负担重的通道很快发热. 可能会导致负担重的通道过早失效 丧失了多相架构的其他好处为了避免失效，多相电源模块使用主动控制技术去平

8、衡电流Multi-Phase VRM Implementation电流反馈电压反馈Cleverness17From Walters US Patent 6,278,263 (Intersil Corp.)电压电流反馈组合每一个相源的驱动力是与电压反馈和电流反馈的组合成线性关系Each phase source is driven by an amplified version of thecombined voltage and current differences:, = + ( ,)18负反馈 Negative feedback:如果检测电压超过参考电压，或者相电流大于平均电流，相电压将

9、会降低 ； Phase voltage will decrease if the sense voltage is above the reference voltage, or Phase current is above the average current. = 1, , SIwave普通直流压降分析19直流压降分析: 定义电流负载和电压源*注意: 这里定义的电压源只用来做非多相的直流压降分析。因为多相选 项会自动创建电压源。当多相分析时，这些电压源需要被禁止。20配置直流压降分析:点击 Configure Simulation 按钮点击 Validate 按钮验证模型没问题点击 Si

10、mulate 按钮输入仿真名如果想做热分析，勾选 “Export power dissipation for usein ANSYS Icepak and Mechanical” 选项验证电压源 node to ground为 “Negative”直流压降分析: 仿真设置21直流压降分析：精度和HPC设置配置直流压降分析：选择 “Other solver options” 按钮选择 DC 页面, 将滑杆拉倒“Optimum Accuracy”选择 Multiprocessing 页面, 设置合适的核数用于HPC并行计算. 然后点击 OK点击 Launch 按钮开始仿真22直流压降分析：结果直流

11、压降仿真结果板上多个电源模块输出不同的 电流值；因此也显示出不同的输出功率，会导致 产品不稳定23多相电源模块直流压降分析24多相直流压降分析配置:关掉前面设置的电压源禁止掉普通直流压降分析中用过的直流电压源点击 Home 菜单点击 Circuit Element Parameters 图标点击 Voltage Sources 页面选中第一行，按住 shift 键，选中最后一行。点击 Deactivate 按钮25多相直流压将配置：定义多相电源模块建立多相电源模块分析 :按住CTRL键，选中多相系统中所 有的电源模块。点击鼠标右键，选择 “CreateMultiphase VRM” 命令多相电

12、源模块定义窗口将被打开26多相电源模块配置: 定义多相电源模块PowerMOdules:板上每一个被选中的电源模块都会被列在这 里每一个被列在这里的电源模块要处于激活或 禁止状态，看设计者的兴趣了。每电源模块应该给出一个 relative strength，strength 是电源模块实际供电电流与电源模块 设计电流的比值 ，此项设置可以被设计按照 不同的者的设计情况进行更改。27Remote Sense Pins:远程监测管脚是是被检测器件上的管脚。此处的反馈电流值将被测量。器件上的管脚必须被定义。正端和负端管脚 信息可以使用下拉工具盒手动添加；用户也 可以简单点击 “Select in L

13、ayout” 按钮，然后在 版图中点击器件管脚。.Nominal Voltage and Load Regulation:标称电压是电源模块的输出电压。负载调节是指对于一个给定的负载电流，电 源模块输出电压会比设计电压偏移多少。相数:仿真中用到的电源模块数目多相电源模块配置: 定义多相电源模块建立多相电源模块分析多相电源模块定义窗口：输入 Relative Strength百分比， 激活或禁止电源模块对于远程监测管脚，可以手动输入器件名、器件标号和管脚，也可以点击 “Select in Layout” 按钮，在版图上选择管脚。输入标称电压，负载调节百分比总负载电流量28多相电源模块配置: 定义

14、多相电源模块一旦多相电源模块被定义，通过Advance菜单下 的 Multiphase VRMs 按钮，可以随时编辑修改。 打开电源模块定义，一系列电源模块模块定显示 出来。在本例中，只有一个多项电源义被创建。 用户也可以点击Add 按钮创建多个多项电源组合。用户可以通过点击 Edit按钮激活或禁止不同的的定义和不同的电源模块。注意：如果存在多个多项电源定义，用户必须确 认只激活了那些对当前仿真要用的多项电源。29使用多相电源模块进行直流压降分析使用多相电源定义启动直流压降分析：选择 Simulation菜单选择 Compute DC IR选项输入仿真名字如果还要做热分析，勾选 “Export

15、 power dissipation for usein ANSYS Icepak and Mechanical”选项验证电压源 node to ground为 “Negative”选择 “Other solver options” 按钮选择 DC 页面，设置滑竿到 “Optimum Accuracy”选择 Multiprocessing 页面，设置HPC核数，然后点击 OK点击 Launch 按钮开始仿真30直流仿真结果对边清晰显示：当 多相电源模块被使用时，电流和 功耗更为平均没有激活多相电源模块激活电源模块直流压降分析：结果对比31直流分析结果：电压分布云图直流仿真的电压分布结果显示：在

16、结果窗口中的 DC IR Drop Simulation 中，找到像看的 仿真项目，点击鼠标右击选择 “Plot Currents/Voltages在 DC IR Drop Simulation Results 窗口中, 取消 GND 网络勾选取消 过孔电流 Iv, 电流密度 J, 和功率 P 的结果显示，只 显示电压 V.点击 “Update Plot Display” 按钮32电压分布云图显示：使用多电源模 块使得所有负载工作电压正常。没激活多相的多电源模块激活多相的多电源模块直流分析结果：电压分布云图对比33在SIwave中设置Icepak热仿真从SIwave启动 Icepak 仿真:选

17、择 Simulation 菜单点击 Icepak 按钮输入仿真名选择直流仿真结果（激活或未激活多相）。注意，两个 Icepak仿真被 执行，一个激活多相，一个没有激活。选择传导或对流（本例中使用传导）设置网格刨分滑竿为 Basic 或 Detailed设置HPC核数选择热环境页面，做合理设置。在本例中使用简单的自然对流。对多相电源模块直流压 降分析结果进行设置对普通电源模块直流压 降分析结果进行设置34Icepak热分析结果Icepak返回的热仿真结果显示：在结果窗口中，选择适合的 Icepak 仿真结果，点击鼠标右键，选择 Display Temperature35温度分布云图显示：使用多相

18、电源模块使得PCB板上温差分布更均匀没激活多相的多电源模块温度激活多相的多电源模块设计温度低一些( 3 cooler)Icepak热分析结果对比36R18 SIwave新功能带感应线位置的多相电源模块直流压降求解器与Mechanical和Icepak进行电热交互（焦耳热）用于电源完整性分析的RLCG提取(SIwave-CPA & Q3D求解器)3D Layout界面下的DoE优化（需Optimetrics License）时频域串扰扫描平面波激励求解器 (电磁耐受度)Synopsys HSPICE, Cadence PSPICE, and SIMetrix Simplis电路模型37PCI G

19、raphics card使用Icepak进行直流热分析 card with38componentsPCI express spec:Max power not to exceed 75 W Includes dissipation from IC dies and PCB Joule heatingImpact of SIwave &Icepak LinkDC Power ConsumptionWithout Joule Heating69.3 WattsWith Joule Heating75.7 WattsSIwave GUI Launches Icepak Solver:Conducti

20、on only analysisNatural convection analysisForced convection (fan) analysisMulti-phase VRM design supportIDF boundary conditions & Heat Sink creationGeometry pre-processing for stand-alone IcepakComponent power (Watts) allocation during setupJoule heating power mapping into Icepak & MechanicalCut pl

21、ane temperature monitoring in XY-, XZ-, and YZ-planesAbility to “Open” and perform more detailed analysis & reporting in the stand-alone IcepakSIwave Icepak自动双向耦合Thermal Cut-PlanesTemperature Plots with IDF setup39Joule Heating40SIwave Icepak 电热分析设置SIwave - Mechanical电热力分析41R18 SIwave新功能带感应线位置的多相电源模

22、块直流压降求解器与Mechanical和Icepak进行电热交互（焦耳热）用于电源完整性分析的RLCG提取(SIwave-CPA & Q3D求解器)3D Layout界面下的DoE优化（需Optimetrics License）时频域串扰扫描平面波激励求解器 (电磁耐受度)Synopsys HSPICE, Cadence PSPICE, and SIMetrix Simplis电路模型42芯片-封装-分析支持芯片封装电路板协同分析生成RLCG models芯片设计者和封装/电路板设计的纽带芯片设计者使用Linux平台上的RedHawk-iCPA封装/电路板设计者使用Windows或Linux版

23、本的SIwave-CPA(SIwave-PI)什么是CPA43封装/PCB设计工程师:提取RLCG模型 显示版图弱点 进行设计迭代 供电电源系统直流到几个GHz单个凸点级别快速修改设计信号完整性分析快速提取数百个信号生成RLCK IBIS封装模型快速扫描信号属性.芯片设计工程师:在芯片仿真中包含封装影响 芯片-封装-电路板联合仿真热点探测联合设计&协同可视化CPA技术对谁有好处？44SIwave-CPA 特点精度使用FEM求解器对电源网络分析 在Q3D的10%精度范围内.选择MoM求解器（Q3D）精度更高速度-精度兼顾性能/容量容量巨大的FEM求解器完整封装和PCB结构数万个sources/s

24、inks快速提取数分钟到几个小时既使上万个凸点的极大封装技术使用3D FEM和3D MoM求解器类似PSI and Q3D 求解器提取RLCG网表频率相关体现地弹效应系统流程和利用整合进ANSYS RedHawk整合进ANSYS SIwave-PI非常易用，报告详细CPA应用Silicon Interposer and RDL硅通孔(TSVs)结构封装电路板支持去耦电容和嵌入式元件PI and SI 分析IBIS封装建模宽带Spice模型45SIwave-CPA亮点46求解器高粒度凸点级别的快速RLCG提取精确的MoM求解器(Q3D)用于高精度应用场合模型宽带SPICE网表和IBIS PKG模

25、型生成ESD和CPA模型用于ANSYS RedHawk/Totem芯片-封装-电路板协同仿真结果详细报告中包含：RLCG 表单管脚级别的电阻和电感色彩云图与主流SPICE仿真器兼容的SPICE网表HTML网页式报告包含完整的仿真设置、模型结构和仿真结果。报告中结果的交互 控制用于定制化SIwave-CPA RLCG参数提取-自动交互索引报告CPA Solver Q3D Solver47交互的 WebGL 报告CPA求解器能够进行凸点/焊球分辨力的RLGC参数提取可在凸点/焊球和管教组上显示 色柱SIwave-CPA报告48SIwave-CPA结果对比49Wirebond Package PDN

26、 SystemSolverNetR(m)L (pH)C (pF)Solve Time (Hours)Speed UpRAM (GB)RAMReductionQ3D (TPA)PDN C1.5879.2128.448-71-CPAPDN C1.6179.9129.30.1480 x135xQ3D (TPA)PDN D0.1612.6973.448-71-CPAPDN D0.1612.9979.30.1480 x135xSolverNetR(m)L(nH)C(pF)Solve Time(minutes)SpeedUpRAM(MB)RAMReductionQ3D (TPA)PDN A12.3310.

27、624.84.51-748-CPAPDN A12.9312.425.80.411x2104xQ3D (TPA)PDN B9.1224.824.84.51-748-CPAPDN B9.2230.725.90.411x2104xFlip-Chip PDN SystemR18 SIwave新功能带感应线位置的多相电源模块直流压降求解器与Mechanical和Icepak进行电热交互（焦耳热）用于电源完整性分析的RLCG提取(SIwave-CPA & Q3D求解器)3D Layout界面下的DoE优化（需Optimetrics License）时频域串扰扫描平面波激励求解器 (电磁耐受度)Synops

28、ys HSPICE, Cadence PSPICE, and SIMetrix Simplis电路模型50SIwave S参数求解器集成进电子桌面ANSYS电子桌面3D Layout项目中增加SIwave求解支持参数化求解支持RSM远程求解支持DoE优化Insert HFSS 3D Layout DesignAdd SIwave AC SYZ Solution51 EnablesDoE Optimetrics（Design of Experiments）SIwave电磁场求解器集成进3D LayoutHPC Setup52SIwave参数化设计53Easy SDM (频谱分解法) SetupA

29、NSYS电子桌面中的RSM远程求解支持 在电子桌面中运行SIwave SYZ 求解器扫频利用SIwave优化参数求解器不同的操作模式本机模式分布式工作站模式(有/没有调度软件)分布式刀片集群模式(带调度软件)支持LSF调度软件支持Windows HPC调度软件为了速度最大化，根据可用核数和频点自动调整负载首先，分布频点第二，分布CPU核运行中动态调整负载1GHz2GHz3GHz4GHz5GHz6GHz7GHz8GHz9GHz10GHz提升SIwave SYZ 差值扫频速度比分立扫频和旧版本的差值扫频快 了近2倍54R18 SIwave新功能带感应线位置的多相电源模块直流压降求解器与Mechan

30、ical和Icepak进行电热交互（焦耳热）用于电源完整性分析的RLCG提取(SIwave-CPA & Q3D求解器)3D Layout界面下的DoE优化（需Optimetrics License）时频域串扰扫描平面波激励求解器 (电磁耐受度)Synopsys HSPICE, Cadence PSPICE, and SIMetrix Simplis电路模型55Time Domain Cross-talkWaveform ViewerZo 特征阻抗时域串扰Coupling Plots3D Interactive Bar GraphsTime Domain Near- and Far-end Vo

31、ltages频域串扰Coupling PlotsFrequency Domain Near- and Far-end Coupling Coefficients整板Zo&串扰扫描交互式WebGL 报告显示56SIwave电磁敏感度57IEEE论文：SIwave电磁敏感度58RLCG参数表改善增加SIMetrix Simplis的SPICE模型输出59SIwave&HFSS构架虚拟系统3D Assembly，组装ECAD & MCAD选择合适的求解器HFSS, SIwave or PlanarEM在电路分析原理图中链接TX/RX分析LNAIBIS & IBIS-AMIQuickEye & Ver

32、ifEyeHSPICE*PSPICE*高速总线合规检查模板DDR4GDDR5。60*HSPICE solver requires Synopsys license; Nexxim supports HSPICE syntax* Uses Nexxim solver with PSPICE syntaxReceiver ICDriver ICA digital signalU7.(pin)60U1.(pin)25Zo voidAZo void BVoid Aon return current pathVoid Bon return current pathSNA provides:1. Zo P

33、rofile & Delay for all paths of a signal.2. Reflection Noise throughtransient analysis.阻抗&飞行时间计算ImpedanceVColhtaagreawctaevreifsotrimc at receiver IC61自动创建&求解仿真电路62NRZ and PAM-4眼图分析6364ANSYS Q3D R18 Update触屏设计65触屏&芯片封装网格刨分加速“Phi Mesher” for Q3D Targets Touch Panel DisplaysRemoves ACIS ProcessesSurfa

34、ce Meshing“Cut Up” Advancement Targets reduction of adaptive passesduring Meshing ProcessProject NumberAverage Speed Up400%15 inch Speed Up9 hours to 1.5 hours66converencePhi Mesher for Planar StructuresMeshes planar structures in a fraction of the timeFaster solution times with equal or betterModel

35、R17Total SolveTimegR18Total SolveTimeR18 vs. R17Total Solve time Speed UpR17MeshingTimeR18MeshingTimeR18 vs. R17Mesh SpeedUpR18 vs. R17RAMReductionPanel A36hr 5min13hr 7min3x10hr 51min1hr 33min7x1.4xPanel B14hr 38min4hr 19min3.5x3h 17min29min7x1.8x67Multi-physics: ThermalCouplingTemperature dependen

36、t AC and DC solutionsBi-directional power and heat mapping using Feedback IteratorCompatible withIcepakFLUENTMechanical ThermalApplication AreasPower ElectronicsPower ConversionCable Modeling6869Power Converter DesignPredict parasitic performance to maximize Power ConverterEfficiencyThree-Phase Mode

37、lSingle-Phase Model70Power Converter DesignCurrent DCCurrent 10 MHzNIGBT_DB1.IC-8.2520.00NIGBT_DB1.V-2.00100.0047.00m48.75m48.00mSwitching OnNIGBT_DB1.IC-8.2520.0053.2540.00NIGBT_DB1.VCE-2.00202.00100.0047.23m47.24m47.26m47.27mSwitching OffNIGBT_DB1-7.5020.00-2.00100.0053.25202.0044.50256.0040.00CE.

38、IC200.0047.00m48.75m48.00mNIGBT_DB1.IC0-7.50NIGBT_DB1.VCE NIGBT_DB1.VCE-2.0044.50256.00200.0020.00100.0047.23m47.24mSwitching On47.26m47.27mSwitching Off71ANSYS Icepak R18 UpdateIcepak R18Added Mesh Level Support for SIwave Icepak solutionAdded automated iterative loopImproved Via handling capabilit

39、iesIndividually modeling vias no K averagingVia Drill holes importedRedHawk CTM import with back annotation of Temps into RHMeshing ImprovementsSolver ImprovmentsVaccum - enable radiation control in fluid zonesMass & Heat fluxes across periodic surfacesAsymmetric periodic boundariesSpaceClaim Design

40、 Modeler incorporates DME “Simplify Functions”Arbitrary Board Outline Imports using IDFImproved Krylov ROM for efficient network modelingPost ProcessingLED Efficiency as a function of temp.Solar Heat Flux reportingImproved Surface ProbingSmooth 3D ContoursOptimized Manhattan displaysTransient option

41、 for “Full Reports”Plane Cut improvements - restrict to solid & fluid regionsNode-weighted interpolation for accurate facet-based reportingCu-brass72Icepak Vision - R18.1 & BeyondCreate an Automated, Streamlined Electro-Thermal Multi-Physics Solution that utilizes Native MCAD/ECAD for First Pass Mes

42、h/Solve SuccessKey Drivers/MandatesModern UI, Ease-of-UseIntegration into AEDTRapid Release CyclesR18.1 First releaseInitial exposure with mostcommon feature setCPS with EnclosureSteady-state thermalImproved WorkflowNative MCAD ModelerECAD-MCAD AssemblyIntegrated Electro-ThermalWorkflowGeometry Clea

43、n Up & SimplificationANSYS Electronics Desktop (AEDT)AEDT-Icepak73Icepak Summary74Long Term Commitment to Icepak that is MCAD & ECAD CentricIcepak Vision - Streamlined Multi-physics PerformanceSimplify Functions Placed into SpaceClaim & AEDT at R18ANSYS Electronics Desktop Icepak Initial Release Pla

44、nned for R18.1Improvements to Release Process Enables Rapid Release Cycles for CustomersStreamlines the Unique Multi-physics flow for Icepak, Simplorer, & Maxwell75感谢聆听76LeadFrame EditorLead Frame EditorCreates SIwave & 3D Layout GeometriesCreates HFSS & Q3D 3D GeometriesLead Frame EditorSIwave QFP

45、Package from Lead Frame EditorLeadframe EditorSIwave77ANSYS Electronics DesktopOpen DXFImport DXF FileImported DXF file is shown in the Editor. All the layers are shown in the DXF FilesworkspaceLead frame Editor WorkflowLaunch Lead frame EditorImport DXFEdit Cross SectionCopy Geometry-Lead-Wire0-Net

46、name0Build PolygonNet Assignment (Optional)Export to ANF/AEDT/SAT78Edit Cross SectionEdit Cross SectionIn the Cross section windowMold and Die properties height can be assigned One of package types: QFN/QFP/DIP/SO can be selected Wirebond profile types can be selected Import the Netlist file if pres

47、ent.Lead frame Editor WorkflowLaunch Lead frame EditorImport DXFEdit Cross SectionCopy Geometry-Lead-Wire0-Netname0Build PolygonNet Assignment (Optional)Export to ANF/AEDT/SATSelect the Netlist file which maps the Lead numbers with Net namesSelect the Wirebond ProfileSelect the package TypeR18 Featu

48、res:New package types added:DIP family, SO familyLead(ParICs) ModelingBondwire Profile setting79Lead Frame EditorExport ANF/AEDT/SATFrom the Cross Section workspace, Right-click on Cross Section and select one of the options : Export XFL/ANF, Export to HFSS 3D Layout, HFSS Design, Q3D Extractor Desi

49、gnLead frame Editor WorkflowLaunch Lead frame EditorImport DXFEdit Cross SectionCopy Geometry-Lead-Wire0-Netname0Build PolygonNet Assignment (Optional)Export to ANF/AEDT/SATR18 Features:Export as HFSS projectExport as Q3D projectExport as SAT file8081SIwave-PSIRequires PSI Solver OptionSIwave-PSI是专用

50、于封装和PCB分析的三维全波快速有限元场求解器利用RedHawk CPM模型将芯片电源网络包含在CPS流程的电源网络分析中。SIwave-PSI支持PI Advisor的去耦电容自动分析SIwave-PSI支持电源通道构建器创建RedHawk封装模型功能:SYZ参数提取交流电流分析82What is SIwave-PSI?100200600700800-130-110-120-100-90-80-70300400500Frequency (MHz)Trace Current (dBA)Simulation MeasurementEMC envelopeFailure !Package/PCB

51、EMI MapSIwave-PSI应用：CPS EMI电磁干扰分析83PSI交流电流分析：总辐射功率Exports the total radiated power as afunction of frequency in .csv format84PSI交流电流分析：被选网络上的电流分布选择关注网络， 点击Update Plot Display按钮。显示被选网 络上的表面电流85TSV分析SIwave-PSI原生支持TSV阵列提取用户将硅建模成半导体，添加TSV镀层/sidewalls例如二氧化硅用户可以使用编辑TSV特征设置，将任意过孔转化成PSI提供了一种简单的3D-IC工作流程和TSV

52、提取选 项，轻松进行分析用户可以在结果窗口中检视每个关注频点下的RLGC结果。用户可以输出TSV提取得到的SPICE模型用于SPICE 电路仿真。User can output the spice netlist of the TSV extraction for use in spice simulations86改善CPM处理支持.PLOC管脚位置文件自动创建Pin Groupp自动生成端口自动创建8788HFSSBroadband Adaptive MeshingBroadband Adaptive MeshingHighest?What frequency should be used

53、 for the mesh?Lowband?Middle?Highband?Cavity Diplexer89Broadband Adaptive Meshing, cont.With mesh link a multi-frequency mesh can be createdBut it can be computationally expensive90Broadband Adaptive Meshing, cont.HighestCavity DiplexerMulti-frequency: Refine multiple frequencies in parallelLowestLo

54、wbandMiddleHighband91Broadband Adaptive Meshing, cont.Broadband: User sets the frequency sweep of interest HFSS determines frequencies automatically 92Broadband Adaptive Meshing Accuracy93Broadband Adaptive Meshing PerformanceTypeAdapt (min)Sweep (min)Speedu pMesh Link8.77.1-Multi-Freq7.56.01.2Broad

55、band5.03.51.9Performance Using 12 CoresTypeAdapt(min)Sweep(min)SpeedupMesh Link43.47.7-Multi-FreqBroadband94Performance Using 32 CoresBAM: Broadband Adaptive Meshing95Broadband HFSSUtilizing multiple frequencies in parallel to adaptmesh across a frequency bandProvides reliable an

56、d guaranteed accurate mesh forentire frequency bandHPC: Frequencies can be solved in parallelExample Project: Cavity Diplexer387MHz96396MHzBAM vs. Single Frequency AdaptBAM97SPBAM MeshSpatially uniform meshEach resonator has localized mesh adaption98Single Frequency Mesh 390 MHz a spatially localize

57、d mesh99S-Parameter: Single Point vs. BAMBAM: Solid Lines SP: Dashed LinesHigh band response not correct100BAM Mesh SetupTwo optionsUser can define frequencies for adaptingIndividual frequencies can have unique convergence, max delta SDefine frequency band, HFSS selects frequenciesBAM solution setup

58、s101Comments on BAM meshBAM achieved quicker convergence, fewer passes, to final responseBAM by pass6SP pass 9. Does not get the high band response correctBAM solution more accurateMore uniform throughout volume102Two Point vs. BAMSet two frequencies for adapt, one in each pass band, 387 and 396 MHz

59、BAM1032 pt.Comments on 2 pt. meshVery comparable accuracy as 10 pt. adaptingNot as uniformly distributedMuch better than single point adapt104105HFSSS-Parameter Only Matrix SolveS-Parameter Only Matrix SolveOnly hold in memory matrix for extracting S-Parameters10-20% speed up per solution pointExamp

60、le: 16 Element Waveguide Slot Antenna, 447 vs. 183MBHPC solves more frequency point in parallel in same memory106S-Parameter Only Matrix Solve, #2Two connectors on PCB327k tetrahedra, 1.978k matrix sizeDiscrete sweep w fields: 01:40 13.5 GDiscrete point n fields: 01:28 3.4 GB12% faster 4X savings in