半导体词汇缩写表

1、半 导 体 词 汇 缩 写 表A/DanalogtodigitalAAatomicabsorptionAASatomicabsorptionspectroscopyABCactivity-basedcostingABMactivity-basedmanagementACalternatingcurrent;activatedcarbonACFanisotropicconductivefilmACIafter-cleaninspectionACPanisotropicconductivepasteACTalternativecontroltechniques;actualcycletimeADC

2、analog-to-digitalconverterADEadvanceddevelopmentenvironmentADIafter-developinspectionADTapplieddiagnostictechniqueADTSEMApply/DevelopTrackSpecificEquipmentModelAEatomicemission;acousticemission;absoluteellipsometryAECadvancedequipmentcontrollerAECSAdvancedEquipmentControlSystem;AutomatedEquipmentCon

3、trolSystemAEIafter-etchinspection;automatedequipmentinterfaceAEManalyticalelectronmicroscopyAESAugeremission/electronspectroscopyAFMatomicforcemicroscopyAFPabrasive-freepolishAgsilverA-GEMTFAdvancedGEMTaskForceAGVautomatedguidedvehicleAHFanhydroushydrogenfluorideAHUairhandlingunitAIRautomatedimagere

4、trievalAlaluminumALDatomiclayerdepositionALEatomiclayerepitaxy;applicationlogicelementALSadvancedlightsource;advancedlow-powerSchottkyAMCairbornemolecularcontaminationAMHSautomatedmaterialhandlingsystemAMTadvancedmanufacturingtechnologyAMUatomicmassunitANNartificialneuralnetworkANOVAanalysisofvarian

5、ceAOVair-operatedvalveAPadhesionpromoterAPAadvancedperformancealgorithmAPCadvancedprocesscontrolAPCDadd-onpollutioncontroldeviceAPCFIAdvancedProcessControlFrameworkInitiativeAPCVDatmosphericpressurechemicalvapordepositionAPECadvancedprocessequipmentcontrolAPIapplicationprogramminginterface;atmospher

6、icpressureionizationAPMatmosphericpassivationmodule;acousticplatemodeAPRDLAdvancedProductsResearchandDevelopmentLaboratoryaPSMattenuatingphase-shiftmaskAQIACCESSqueryinterfaceAQLacceptablequalitylevelArargonARaspectratioARAMSAutomatedReliabilityARCantireflectivecoatingARDEaspectratio-dependentetchin

7、gARPAAdvancedResearchProjectsAgency(seeDARPA)ARSangle-resolvedscatteringAsarsenicAS/RSautomatedstorageandretrievalsystemASAPAdvancedStepperApplicationProgramASICapplication-specificintegratedcircuitASOautomaticshutoffASPadvancedstripandpassivation;advancedstripprocessorASRautomatedsendreceiveATDFAdv

8、ancedToolDevelopmentFacilityATEautomatictestequipmentATGautomatictestgenerationATLASabbreviatedtestlanguageforallsystemsatmatmosphereATPadvancedtechnologyprogram;adenosinetriphosphate;acceptanceandtoolperformanceATRattenuatedtotalreflectanceAttattenuatedAugoldAVPadvancedverticalprocessorAVSadvancedv

9、isualizationsystemAWEasymptoticwaveformevaluationAWISPMabovewaferinsituparticlemonitoringAWSadvancedwetstationBbillion;boronBabariumBARCbottomantireflectivecoatingBASEBostonAreaSemiconductorEducation(Council)BAWbulkacousticwaveBCbiascontrastBDEVbehavior-leveldeviationBDSBrownianDynamicsSimulationBeb

10、erylliumBEOLbackendoflineBESOIbondedandetchbacksilicononinsulatorBFbrightfieldBFGSBroyden-Fletcher-Goldfarb-Shann00PtimizationalgorithmBFLbufferedfield-effecttransistorlogicBGAballgridarrayBHTBrinellhardnesstestBibismuthBiCMOSbipolarcomplementarymetal-oxidesemiconductorBIFETbipolarfield-effecttransi

11、storBIMbinaryintensitymaskBiMOSbipolarmetal-oxidesemiconductorBISTbuilt-inself-testBITbulkiontemperatureBITEbuilt-intestequipmentBMCbubblememorycontrollerBMDbulkmicrodefectBOEbufferedoxideetchantBORbottomofrangeBOSSBookofSEMIStandards;binaryobjectstoragesystemBOXburiedoxideBPRbeamprofilereflectometr

12、y;businessprocessreengineeringBPSGboronphosphosilicateglassBPTEOSBPSGfromaTEOSsourceBrbromineBSEbackscatteredelectrondetectionBTABbumpedtapeautomatedbondingBVbreakdownvoltageCcarbonCacalciumCACIMarchitectureCAACIMapplicationsarchitectureCABCompetitiveAnalysisBenchmarkingCADcomputer-aideddesignCADTco

13、ntrolapplicationdevelopmenttoolCAEcomputer-aidedengineeringCAIcomputer-assistedinstructionCAMcomputer-aidedmanufacturingCAPScomputer-assistedproblemsolvingCARchemicallyamplifiedresistCARRIComputerizedAssessmentofRelativeRiskImpactsCASEcomputer-aidedsoftwareengineering;computer-aidedsystemsengineerin

14、gCATcomputer-aidedtestingCAWConstructionAnalysisWorkgroupCAWCcryogenicaerosolwafercleaningCBGAceramicballgridarrayCBSchemicalbottlestorageareaCBTcomputer-basedtrainingCCchipcarrier;clustercontrollerCCCceramicchipcarrierCCDcharge-coupleddeviceCCSLcompatiblecurrent-sinkinglogicCCWcounterclockwiseCdcad

15、miumCDcriticaldimensionCD/OLcriticaldimensionoverlayCDAcleandryairCDEchemicaldownstreametchCDEMCustomerDeliveryEnterpriseModelCDIcollector-diffusionisolationCDMCommonDeviceModelforSABCDOcontrolleddecomposition/oxidationCDRchemicaldistributionroomCDSchemicaldistributionsystemCeceriumCEcapillaryelectr

16、ophoresisCECcellevaluationchipCEEcontrolexecutionenvironmentCEMcontinuousemissionsmonitoringCER-DIPceramicdualin-linepackageCFAcomponentfailureanalysisCFCchlorofluorocarbonCFDcomputationalfluiddynamicsCFMcontamination-freemanufacturingCICcleanroominterfacechamberCIDcharge-injectiondeviceCIEcomputer-

17、integratedengineeringCIMcomputer-integratedmanufacturingCIM-OSAcomputer-integratedmanufacturing-opensystemsarchitecture(ESPRITprogram)CIPContinuousImprovementProgramCISCenterforIntegratedSystemsCISCcomplexinstructionsetcomputerClchlorineCLCCceramicleadedchipcarrierCLICclosed-loopintensitycontrolCMco

18、nfigurationmanagement;cassettemoduleCMCcassettemodulecontrollerCMLcurrentmodelogicCMMcapabilitymaturitymodelCMOScomplementarymetal-oxidesemiconductorCMPchemicalmechanicalplanarizationCMRcommon-moderejectionratio;cancelmoverequestCNCcomputernumericalcontrol;condensationnucleuscounterCNTcarbonnanotube

19、CocobaltCOBchip-on-boardCOCcostofconsumablesCODECcoder-decoderCOEDcomputer-optimizedexperimentaldesignCOGScostofgoodssoldCoOcostofownershipCORBAcommonobjectrequestbrokerarchitectureCOREcompositeobjectreferenceCOSScommonobjectservicesspecificationCOTcustomer-ownedtoolingCoVcoefficientofvarianceCpproc

20、esscapabilityCPDconcurrentproductdevelopmentCPECommunicationsCPGAceramicpingridarrayCpkprocesscapabilityindexCQFPceramicquadflatpackCQNclosed-queuingnetworkCrchromiumCRCcyclicredundancycheckCRMCost/ResourceModelCscesiumCSACIMsystemsarchitectureCSEcontrolsystemsengineeringCSFcriticalsuccessfactorCSLc

21、urrent-steeringlogicCSMA/CDcarrier-senseCSPchip-scalepackageCSPEDconcurrentsemiconductorproductionandequipmentdevelopmentCSTCIMsystemstechnologyCSTRcontinuouslystirredtankreactorCSVcomma-separatedvariableCTCclustertoolcontrollerCTEcoefficientofthermalexpansionCTIcycletimeimprovementCTMCclustertoolmo

22、dularcommunicationsCucopperCUBcentralutilitybuildingCUBEScapacityutilizationbottleneckefficiencysystemCUIcommonuserinterfaceCUSUMcumulativesumCVcapacitance-to-voltageCVCMcollectedvolatilecondensablematerialsCVDchemicalvapordepositionCWcontinuouswaveCzCzochralskiprocessD/AdigitaltoanalogD/Bdiebonding

23、DACdigital-to-analogconverterDASdirectabsorptionspectroscopyDASSLdifferentialalgebraicsystemsolverDBMSdatabasemanagementsystemDCdirectcurrentDCAdirectchipattachmentDCATSdouble-containedacidtransfersystemDCEdistributedcomputerenvironmentDCLdigitalcommandlanguage;displaycommunicationlogDCSdichlorosila

24、neDDLdevicedescriptionlanguageDDMSdefectdatamanagementsystemDEDSdiscrete-eventdynamicsimulationDESdataencryptionstandard;displayequipmentstatusDFdarkfieldDFCdensifiedfluidcleanDFEdual-frequencyetchDFMdesignformanufacturingDFRdesignforreliabilityDFTdesignfortestDFYdesignforyieldDHFdilutehydrofluorica

25、cidDIdeionized;dielectricisolationDIBLdrain-inducedbarrierleakageDICdifferentialinterferencecontrastDILdualin-lineDIPdualin-linepackageDLBIdevice-levelburn-inDLOCdevelopedsourcelinesofcodeDLSdisplaylotstatusDLTdevice-leveltestDLTSdeep-leveltransientspectroscopyDMAdirectmemoryaccess;dynamicmechanical

26、analysisDMHdisplaymessagehelpsDMLdatamanipulationlanguage;displaymessagelogDMMdigitalmultimeterDMOSdiffusedmetal-oxidesemiconductorDMRdisplaymoverequestsDOdynamicoptimizationDOAdead-onalignmentDOASdifferentialopticalabsorptionspectroscopyDOEdesignofexperimentsDOFdepthoffocusDOPdioctylphthalateDPAdes

27、tructivephysicalanalysisDPMdigitalpanelmeterDPPdischarge-producedplasmaDPSRAMdual-portstaticrandomaccessmemoryDRAMdynamicrandomaccessmemoryDRAPACDesignRuleandProcessArchitectureCouncilDRCdesignrulecheckDREdestructionremovalefficiencyDRIFTSdiffusereflectanceinfraredFouriertransformspectroscopyDRTdefe

28、ctreviewtoolDSAdisplaysystemactivity;dimensionallystableanodeDSCdifferentialscanningcalorimetryDSMCdirectsimulationMonteCarloDSQdownstreamquartzDSSdisplaystockerstatusDSWdirectstep-on-waferDTdynamictestDTAdifferentialthermalanalysisDTCdirectthermocouplecontrolDTLdiodetransistorlogicDTMdefecttestmoni

29、tor;delaytimemultiplier;devicetestmodule;digitalterrainmapDTMPNdefecttestmonitorphasenumberDUTdeviceundertestDUVdeepultravioletDVdesignverificationDVERdesignruleverificationDVMdigitalvoltmeterDVSdisplayvehiclestatusDWGdomainworkgroupEAPSMembeddedattenuatedphase-shiftmaskEAROMelectricallyalterablerea

30、d-onlymemoryEASEequipmentandsoftwareemulatore-beamelectronbeamEBHTelectron-beamhigh-throughputlithographyEBICelectronbeam-inducedcurrentEBRedgebeadremovalECengineeringchange;equipmentcontrollerECAengineeringcapabilityassessmentECADelectroniccomputer-aideddesign;engineeringcomputer-aideddesignECAEele

31、ctroniccomputer-aidedengineeringECLemittercoupledlogicECNengineeringchangenoticeECOengineeringchangeorderECQBelectrochemicalquartzcrystalbalanceECRelectroncyclotronresonanceEDAelectronicdesignautomationEDSenergy-dispersivespectroscopyEDUequipment-dependentuptimeEDXenergy-dispersiveX-rayEDXAenergy-di

32、spersiveX-rayanalysisEEDFelectronenergydistributionfunctionEELSelectronenergy-lossspectroscopyEEPROMelectricallyerasableprogrammableread-onlymemoryEFEMequipmentfront-endmoduleEFOCSevanescentfiber-opticchemicalsensorEFTIRemissionFouriertransforminfraredspectroscopyEFVexcessflowvalveEGEethyleneglycole

33、thersEHSextremelyhazardoussubstanceEIequipmentintegrationEIDEquipmentInterfaceDevelopmentEIPEquipmentImprovementProgram;EquipmentImprovementProjectEISelectrochemicalimpedancespectroscopyEKFextendedKalmanfilterELFextremelylowfrequencyEMenterprisemodel;electromagnetic;electromigrationEMAequipmentmatur

34、ityassessmentEMCelectromagneticcapability;electromagneticcompatabilityEMFelectromagneticfieldEMGelectromigrationEMIelectromagneticinterferenceEMMAelectronmicroscopyandmicroanalysisEMPelectromagneticpulseEMRentermoverequestEMUelectromagneticunitEOSelectricaloverstressEOTendoftransfer;equivalentoxidet

35、hicknessEPextremepressure;electropolishEPLelectronprojectionlithographyEPRelectronparamagneticresonanceEPROMelectricallyprogrammableread-onlymemoryEPSSelectronicperformancesupportsystemEPTequipmentperformancetrackingEQUIPC/IequipmentcontrolandintegrationEQUIPRTCequipmentreal-timecontrolERAMequipment

36、reliabilityERMenterprisereferencemodelERNexternalrecurrentneuralnetworkERPextendedrangepyrometerERSeventreportingstandardERTemergencyresponsetimeESengineeringspecification;expertsystemESCelectrostaticchuckESCAelectronspectroscopyforchemicalanalysisESDelectrostaticdischargeESHenvironmentESMelectronic

37、servicemanualETABExecutiveTechnicalAdvisoryBoardETQRExternalTotalQualityandReliabilityEUVextremeultravioleteVelectronvoltEWMAexponentiallyweightedmovingaverageFfluorineF/IfinalinspectionFAfailureanalysisFABfastatombombardmentFAMOSfloating-gateavalanche-injectionmetal-oxidesemiconductorFBGAfine-pitch

38、ballgridarrayFCflipchipFCMfacilitiescostmodelFCSfactorycontrolsystemFDCfaultdetectionandclassificationFDEfrequencydomainexperimentsFDSOIfullydepletedsilicononinsulatorFeironFECfabricationevaluationchipFEMfiniteelementmodelFEOLfrontendoflineFESEMfieldemissionscanningelectronmicroscopyFETfield-effectt

39、ransistorFFTfastFouriertransformFFUfilterfanunitFIfilterabilityindex;factoryintegrationFIBfocusedionbeamFIDflameionizationdetectorFIFOfirst-inFIMSfront-openinginterfacemechanicalstandardFLfuzzylogicFLOPCfloatingpointoperationsneededpercycleFLOTOXfloatinggatetunneloxideFLRTfactorylayout/relayouttoolF

40、MforeignmaterialFMEAfailuremodeandeffectsanalysisFMMCfactorymaterialmovementcomponentFMVPFrameworkMemberValidationProjectFNNfeed-forwardneuralnetworkFOCSfiber-opticchemicalsensorFOSBfrontopeningshippingboxFOUPfrontopeningunifiedpodFOVfieldofviewFOXfieldoxideFPflashpointFPDfocalplanedeviation;flatpan

41、eldisplayFPGAfield-programmablegatearrayFPLAfield-programmablelogicarrayFPLFfield-programmablelogicfamilyFPLSfield-programmablelogicswitchFPMSFactoryPerformanceModelingSoftwareFPROMfield-programmableread-onlymemoryFRACASFailureReportingFRAMEFailureRateAnalysisandModelingFRMBfastrampminibatchFSGfused

42、silicaglassFSMfinitestatemachineFTfinaltest;FouriertransformFTAfaulttreeanalysisFTABFocusTechnicalAdvisoryBoardFTIRFouriertransforminfraredFWfullwaveFWHMfull-widthhalf-maximumFZfloatzoneGagalliumGACgranularactivatedcarbonGCgaschromatography;gravimetriccalibratorGCCgenericcellcontrollerGCDgaschromato

43、graphydistillationGCMSgaschromatographymassspectroscopyGDPPgasdriveplasmapinchGDSgraphicaldesignsystem;graphicaldesignsoftwareGegermaniumGEMGenericEquipmentModelGEMVSGEMverificationsystemGESgenericequipmentsimulatorGFCgasfiltercorrelationGFCIgroundfaultcircuitinterrupterGIDLgate-induceddrainleakageG

44、ILDgasimmersionlaserdopingGLCgasliquidchromatographyGOIgateoxideintegrityGPIBgeneral-purposeinterfacebusGSCEgassourcecontrolequipmentGTSGEMTestSystemHhydrogenHAPhazardousairpollutantHARIhighaspectratioinspectionHASThighlyacceleratedstresstestingHAZCOMHazardCommunicationStandardHBhorizontalBridgemanc

45、rystalHCIhotcarrierinjectionHCMhollowcathodemagnetronHCMOShigh-densityCMOSHCShot-carriersuppressedHDhighdensityHDLhardwaredescriptionlanguageHDPhigh-densityplasmaHDPEhigh-densitypolyethyleneHeheliumHEMhigh-efficiencymatchingHEPAhigh-efficiencyparticulateairHfhafniumHFhydrofluoricacidHgmercuryHIBShea

46、vyionbackscatteringspectrometryHiPOxhigh-pressureoxygenHLFhorizontallaminarflowHMDShexamethyldisilizaneHMIShazardousmaterialsinventorystatementHMMPhazardousmaterialsmanagementplanHMOShigh-performanceMOS;high-densityMOSHOMERhazardousorganicmassemissionrateHOPGhighlyorientedpyroliticgraphiteHPhighpuri

47、tyHPEMHybridPlasmaEquipmentModelHPIhighpressureisolationHPLhigh-performancelogicHPLChigh-performanceliquidchromatographyHPMhazardousproductionmaterials;high-puritymetalHPVhigh-pressureventHRAhumanreliabilityanalysisHRRhighramprateHRTEMhigh-resolutiontransmissionelectronmicroscopyHSQhydrogensilsesqui

48、oxaneHTOhigh-temperatureoxidationHTRBhigh-temperaturereversebiasHUPWhotultrapurewaterHVACheatingIiodineI/Oinput/outputI2LintegratedinjectorlogicI300IInternational300mmInitiativeICintegratedcircuit;InvestmentCouncil;ionchromatographyICAPinductivelycoupledargon-plasmaspectrometryICMSintegratedcircuitm

49、easurementsystemICPinductivelycoupledplasmaICP-AESinductivelycoupledplasmaatomicemissionspectroscopyICP-MSinductivelycoupledplasmamassspectrometryICTidealcycletimeIDDQdirectdrainquiescentcurrentIDEALinitiatingIDLinterfacedefinitionlanguageIDLHimmediatelydangeroustolifeorhealthIDSinteractivediagnosti

50、csystemIEAionenergyanalysisIECinfusedemittercouplingIEDFionenergydistributionfunctionIERNinternal-externalrecurrentneuralnetworkIFinterfaceIGFETinsulated-gatefield-effecttransistorILBinnerleadbondILDinterleveldielectric;interlayerdielectricILSintracavitylaserspectroscopyIMintegratedmodel;integratedm

51、etrologyIMDintermetaldielectricIMMAionmicrophobemassanalysisIMSionmobilityspectroscopyInindiumINCAMSindividualcassettemanufacturingsystemIPAisopropylalcoholIPLionprojectionlithographyIPTidealprocesstimeIriridiumIRinfraredIRASinfraredreflection-absorptionspectroscopyIRISimagingofradicalsinteractingwi

52、thsurfacesIRNinternalrecurrentneuralnetworkIRONMANImprovingReliabilityofNewMachinesatNightIRTC-1interconnectreliabilitytestchip-1ISinformationsystems;interfacespecifications;integratedsystemsISCIndustrySteeringCouncilISEMinspection/reviewspecificequipmentmodelISMinductorsupermagnetronISMTInternation

53、alSEMATECHISPMinsituparticlemonitorISRinsiturinseISSionscatteringspectroscopyITRIInterconnectionTechnologyITRSInternationalTechnologyIVHinterstitialviaholeIVPintegratedvacuumprocessingJDPJointDevelopmentProgramJEDECJointElectronDeviceEngineeringCouncilJESSIJointEuropeanSubmicronSiliconInitiativeJICJ

54、ointIndustrialCouncilJITjust-in-timeJJTJosephsonjunctiontransistorJVDjetvapordepositionKpotassium;thousandkeVkiloelectronvoltKPAkeyprocessareaKrkryptonkVkilovoltLalanthanumLAMMAlasermicro-massanalysisLAMMSlasermicro-massspectroscopyLCinductance-capacitance;liquidchromatographyLCAlifecycleanalysisLCC

55、leadedchipcarrierLCLlowerconfidencelimitLDDlightlydopeddrainLDLlowerdetectionlimitLDPlow-densityplasmaLDPElow-densitypolyethyleneLECliquidencapsulatedCzochralskicrystalLELlowerexplosivelimitLERlineedgeroughnessLFlaminarflowLFLlowerflammablelimitLGQlinearGaussianquadraticLilithiumLIlaserinterferometr

56、yLIClinearintegratedcircuitLIDleadlessinverteddeviceLIFOlastinLIMAlaser-inducedmassanalysisLIMSlaser-inducedmassspectrometryLLCCleadlesschipcarrierLLDlowerlimitofdetectionLLNQleastlotsnextqueueLMlightmicroscopeLMMAlasermicroprobemassanalysisLOCOSlocaloxidationofsiliconLOSlossofselectivityLPClinearpr

57、edictivecoding;laserparticlecounter;lowparticleconcentration;liquid-born eparticlecounterLPCVDlow-pressurechemicalvapordepositionLPDlightpointdefectLPEliquidphaseepitaxyLPIlow-pressureisolationLPPlaser-producedplasmaLRSlaserRamanspectroscopyLSElatexsphereequivalentLSHIlarge-scalehybridintegrationLSI

58、large-scaleintegrationLSMlaserscanningmicroscopeLTAlaserthermalannealLTCVDlow-temperaturechemicalvapordepositionLTOlow-temperatureoxidation/oxideLTPDlottolerancepercentdefectiveLTVlocalthicknessvariationLVlatentvariableLVDTlinearvoltagedifferentialtransducerLVIlow-voltageinverterLVSlayoutverificatio

59、nofschematicLWRlinewidthreductionLWSlargewaferstudyMmillion;megaMACTmaximumachievablecontroltechnologyMALDImatrix-assistedlaserdesorptionandionizationMANmetropolitanareanetworkManagementStandardManufactur ingandScienceMAPmanufacturingautomationprotocolMasterDeliverablesListMAWPmaximumallowableworkin

60、gpressureMBmachinebatchMBCmachinebathcollectionMBEmolecularbeamepitaxyMBPCmodel-basedprocesscontrolMBTCmodel-basedtemperaturecontrolMCBAmeancyclesbetweenassistsMCBFmeancyclesbetweenfailuresMCBImeancyclesbetweeninterruptsMCMmultichipmodule;manufacturingcyclemanagementMCPmastercontrolprocessor;multich