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TRACKModuleexplanation1第1页TRACKFUNCTIONSFunctionUsedforcoatingthewaferswithBARC,TARCorresist.SendthecoatedwaferstothescannerforexposureGetsbacktheexposedwafersfromthescannerfordevelopingItismadeupofdifferentunitslikecoaters,developers,WEE,hotplates,chillplates,adhesionbakestopreparethewafersforexposureAdhesionbakes(ADH)–applyHMDSprimerCoaters(COT)–coatresist,BARC(DUV)orTARC(I-LINE)Hotplates(LHP)–bakethewafersChillplates(HCP)–coolthewafersafterbakingDevelopers(DEV)–todevelopthewafers 2第2页OVERVIEWOFSYSTEMDUVtracksI-linetracksCoaterDeveloperTheDUVtracksareconnectedtoDUVscanners.Forcriticallayers.TheI-linetracksareconnectedtoI-linescanners.Fornon-criticallayersTheseparateMARK8systemsareforthepolyimideprocessduetodifferentresistsystems3第3页DUVTRACKSYSTEMD-chuckE-chuckP-chuckRobotInOut1234DUVSCANNER4DEV2BCT2COT4SMIFLOADINGPORTSSCANNERINTERFACEBLOCK1BLOCK2DUVTRACKSCANNERSIDETRACKSIDEWEE4第4页I-LINETRACKSYSTEMD-chuckE-chuckP-chuckRobotInOut1234ASML/400I-LINESCANNER4DEV2TCT2COT4SMIFLOADINGPORTSSCANNERINTERFACEBLOCK1BLOCK2TELACT8I-LINETRACKSCANNERSIDETRACKSIDEWEE5第5页MODULEOVERIEWPreExposureSideAdhesionBakes(ADH) ChillPlates(HCP)Coaters(COT,BCT,TCT)HotPlates(LHP,HHP)Interface(IFB)PostExposureSideWaferEdgeExposureunit(WEE)PrecisionChillingHotplates(PCH)ChillPlates(HCP)Developer(DEV)Hotplates(LHP)SMIF6第6页ADHESIONBAKEWhatisaadhesionbakemodule?? ADHappliesachemicalcalledHMDS,orprimer,tothewafertocreategoodadhesionatthewafersurfaceHowdoesitwork??Chamberlidgoesdowntocreatevacuum.Hightemperature.AgasbubblesthroughtheHMDSbottleinchemicalcabinettocreateHMDSvapor.Gasesarepurged.WhydoweneedHMDS?? Tomaketheresiststickbettertothewafersurfaceduringdeveloping.Otherwise,resistwillliftoff.7第7页THISISWHATHAPPENSWHENTHEREISINCOMPLETEHMDSPRIMINGResistwillliftoffduringdeveloping8第8页HIGHSPEEDCHILLPLATEWhatisachillplate??? HCPisaHigh-SpeedChillPlatewhichcoolsdownawaferinashorttimeHowdoesitwork??ThewaferisplacedclosetoachillblockWateratacontrolledtemperatureflowsinthechillblocktocoolthewafer

Whydowechillawafer??Wechillwaferstobringdownthetemperaturefromhightoanormaltemperature.Thishappensaftereverybakestep.AftereveryADHorPEBstep,wechillthewafertocoolandtogetabetteruniformityoftheresistordeveloper.9第9页COATERMODULEThereare3typesofcoatersResistcoaters–COTBARCcoaters–BCTTARCcoaters–TCTWhatisacoater?? Acoaterisaspinmodulewhichspinsaphotoresist,BARCorTARCandcleanstheedgeofthewafersurfacetoremoveresistwaste. Asolventisusedtocleanawaytheresistwaste.ThisiscalledTEBRorTopEdge-BeadRemoval,andbacksiderinse.10第10页COATERMODULEHowdoesitwork??Thedispensearewilldispensearesistonthewafersurface.ThecoaterspinsouttheresisttocreateauniformlayerAfterspin-out,wecleantheedgeofthewaferwithanTEBRandbacksiderinse.SpindrytoremovesolventattheedgeWhydowecoatawafer? Tocreateaphoto-sensitivelayerwhichcanbeexposedinascanner11第11页COATERMODULECriticalpartsTheresisttemperatureandcoaterspinspeedwillaffecttheCDofthefeaturesForDUVsystems,theresistcanbecontaminatedeasily.Alwayssendthewafersforreworkandexposeagainwhenthemachinestopsworking.ForI-linesystems,thereislessproblemandwecanusearetryrecipe.12第12页SOFTBAKEWhatisSoftbake? SoftbakeusesaLowTemperatureHotPlate(LHP)toheatawafer.Itissimilartoaadhesionbakemodule(ADH)withoutusingchemicalsHowdoesitwork?Thewaferwillbebakedundervacuumandafixedtemperature.Thetemperatureusedisdifferentfordifferentresists.Afterthebake,wedoapurgebakewithN2gas.Whydowebakeawafer?TodrytheresistforgoodsensitivityRemovesolventfromtheresistImproveuniformityoftheresistlayerImproveadhesionoftheresist13第13页INTERFACEBLOCK

WhatisaInterfaceBlock? Ainterfaceblock(IFB)isamodulewhichmoveswafersfromthetracktothescannerandback.Howdoesitwork? Thetrackplacesawaferintothescannerinterface(Inputpedestal)andremovesthewaferfromthescanner(Outputpedestal).WhydoweneedanInterfaceBlock?? Tomoveandcommunicatebetweenscannerandtrack14第14页WAFEREDGEEXPOSURE(WEE)WhatisaWaferEdgeExposuremodule?? AWaferEdgeExposuremodule(WEE)usesI-linewavelengthtoexposetheedgesofthewaferHowdoesitwork?TheWEEmoduleislocatedatthebackofthetrackThewaferisrotatedunderabeamoflight.ThebeamoflightwillexposetheedgeofthewaferveryaccuratelytoremoveresistwasteWhydoweneedaWEE??RemovesresistwasteveryaccuratelyExposeonthePrimaryMarkers(PM)andwafer-IDtocleartheresist15第15页POSTEXPOSUREBAKE(PEB)WhatisaPostExposureBake?? APostExposureBakealsousesaPrecisionChillingHotPlate(PCH)tobakeawafer.Howdoesitwork? Itworksinthesamewayforthesoftbake.ThePCHgivesamoreaccuratebakingtemperaturethanaLHP.WhydowehaveaPostExposure?? Tominimizetheeffectofasinglewavelengthexposure.16第16页DEVELOPER(DEV)WhatisaDeveloper?? ADeveloper(DEV)isaspinmodulewhichspinsachemicalonthesurfaceofthewafertomaketheexposedpatternvisible.Howdoesitwork??WedispensedeveloperfluidatthesurfaceofthewaferThewaferstopsspinningforaper