认识Mask以及其制作流程

1、认识Mask以及简要的制作流程,TM,The Role of Mask in IC Industry,DESIGN,MASK,WAFER,TESTING,ASSEMBLY,How Does Mask Work in Wafer FAB,-Stepper,How Does Mask Work in Wafer FAB,-Scanner,Raw Material of Mask,Blank,BIM (binary mask) PSM (phase shift mask) A. KRF-PSM B. ARF-PSM,Size of Blank,5inch 90mil(5009) 5inch 180m

2、il(5018) 6inch 120mil(6012) 6inch 250mil(6025) 7inch 250mil(7015),What kind of mask SMIC FABs use?,Blank Component,Binary Blank,PSM Blank,Photo Resist(3K,4K,4650A),CrO&Chrome(1050A,700A),Quartz,Photo Resist(2K,3K,4KA),CrO&Chrome(1000,550A),Quartz,MoSi Film,Photo Resist Opaque Metal Film Substrate,Ph

3、oto Resist Opaque Metal Film Phase Shift Layer Substrate,Blank Qz Characteristic,Rigidity,Heat Expansion(ppm/oC),Blank Qz Characteristic,Optics Character,Transmission ( % ),200,300,400,0,20,40,60,80,100,Quartz,Silicon-Boride,Soda Lime,Wave Length(nm),Thats why we choose Quartz as the substrate of bl

4、ank,How to Transfer Design to Mask?,Writer,Process,Metrology,Vis-Inspect,Clean/Mount,AIMS,Repair,1st Inspect,Thr-Inspect,STARlight,Shipping,Develop,Strip,Etch,Front-end Process,Blank configuration,Photo-resist,Cr film,Quartz,Exposure,Photo-resist develop,Wet etch,Photo-resist strip,AEI,ASI,Re-Etch ?

5、,AEI: After Etch CD measure ASI: After Strip CD measure,Step1,Step2,Step3,Step4,Step6,Step5,Step7,Front-end Process,Dry process,Resist,Cr,Qz,H+,H+,H+,H+,H+,H+,H+,Exposure(EB1,EB2,EB3DUV,LB5,LB6),PEB (Post Exposure Bake) SFB2500,APB5500,PAG,Acid generation,Acid diffusion,Deprotection reaction,Develop

6、ment(SFD2500,ASP5500),H+,Dry Etch(Gen3,Gen4)AEI, Re-etch,Strip, ASI,Pellicle Component,Pellicle Membrane,Frame(Aluminum Alloy),Adhesive Tape,Pellicle Membrane (25 um),Pellicle Frame,Double Side Adhesive Tape,Cr,Glass,What Pellicle Do?,Particle Immunity Control,Particle size (D) V.S. Minimum Stand-of

7、f (T),T = (4M/N.A.)D,M - Magnification N.A.- Numerical Aperture of the Lens,For glass side particle, T = 2.3mm,D1,T1,T2,D2,Mask Quality Control,C.D. Defect Registration,CD (critical dimension) measurement,Defect Type,Hard Defect Soft Defect,Miss Size,How to Do Mask Defect Inspect,Mask Layout Exempli

8、fication,Normal,+,+,+,+,Fiducial,Test Key,Test Line,Main Pattern,Scribe Line,Global Mark,QA Cell,Barcode,Multi-Chip,+,+,+,+,Fiducial,Test Key,Test Line,Scribe Line,Global Mark,QA Cell,+,+,A Chip,B Chip,C Chip,D Chip,+,The Principle of STARlight Inspect,The Model in SMIC Mask Shop(SL3UV) can only det

9、ect pattern side,STAR: Synchronous Trans. And Reflected,What is Registration,Registration Result Exemplification,Mask:6”, t=0.25”Quartz Measurement Area:67.2*92.2mm Array:8*10 Variation Quantity: nm Maxmin X7.20.0 Y22.00.2,How Does OPC Work?,comparison,design/mask,With OPC,wafer,OPC Pattern on Mask,0.64 um Line Pattern,0.25 um Serif for 0.6 um Contact,0.57 Line Pattern,0.27 um assistant bar for 0.72 um Line,Over-all flow,Customer,FTP,Note: Yellow box is activities custo