品管常用术语英文翻译.ppt

1、品 管 常 用 朮 語 英 文 譯 解 SMT品管部 2003.6.18,COMMON word in out working; 1.IQC:Incoming Quality Control(進料品管) Incoming Inspection item:appearance(外觀),dimension (尺寸),marking(標記),function(solder-ability)功能-焊錫性),quantity(數量) Material status(物料狀況):accept(合格),reject(拒收),waive (特采),hold(待判) 2.IPQC:In Process Qual

2、ity Control(制程品管) Inspection item:production survey(產品稽核).equipment parameter check(設備參數點檢)material confirm(物料確認),.etc. 3.FQC:Final Quality Control(最終檢驗) Inspection item:component assmbly(元件安裝),solder status(焊錫狀況),cleaning(清潔度),marking(print marking)(標記),package(包裝)etc. 最終檢驗),4.OQC:Outgoing Quality

3、Control(出貨查核) Inspection item:quantity(數量),package(包裝)etc. 5.QE:Quality Engineering (品質工程) working content:revise specification(修訂規格),deal with quality complain(處理品質抱怨),analyze process abnormality(分析制程異常),renew inspection means(更新檢驗方法),etc. Qulity record Form(品質記錄表單) 1.incoming quality weekly (Month

4、ly)report-進料品管周(月)報 2.Incoming quality history List-進料品質經歷表,3.Daily inspection report-檢驗日報表 4.Vendor Defects Corretion Sheet(VDCS)-進料品質異回饋單 5:Ionic contamination test record-殘餘離子測試記錄表 6:Omega meter check &maintenance record-歐姆測試機點檢&維護記錄表 7:Performing process patrol inspection record-前加工制程巡檢記錄表 8:Fur

5、st inspection record(F.P.I.R)初件檢驗報告 9:In-process patrol inspection record-制程巡迴檢查表 10:Process abnormality notice -制程異常連絡單,11:Finished product quality history list -最終成品品質經歷表 12:Final quality control weekly(monthly)report -最終檢驗周(月)報 13:Outgoing quality weekly (monthly)report-出貨品質周轉(月)報 14:outgoing aud

6、it data sheet-出貨查核數據記錄表 15:ESD(Electricity static discharge )strap daily verification record 靜電防護措施日點檢記錄 Other word or abbreviae word in our working P/N:Part/Number(料號) HH:HonHai(鴻海) Defect(缺陷),CRI:Critical(嚴重的) MAJ:Major(主要的) MIN:Minor (次要的) QC:Quality Control(品質控制) QA:Quality Assurance(品質保證) AQL:A

7、ccept Quality Level(品質允收水準) PMP:Production process Managemint Planing(產品品質計劃) ISO:International Standard Organization(國際標準化組織) SOP:Standard Operation Process(標準作業流程) SPC:Statistic process control(統計製程控制) PTH:Plate Through Hole (鍍層穿孔),SMT:Surface Mount Technology (表面粘貼技術) SMC:Surface Mount Component

8、(表面粘貼元件) SMB:Surface Mount Board (表面粘貼板) SMD:Surface Mount Device(表面粘貼設計) AI:Automatic Insertion (自動插件) CAR:Corrective Action Report(糾正措施報告) BOM:Bill Of Material(物料清單) QCC:Quality Control Circle (品管圈) QIT :Quality Improve Team(品質改善小組) MRP:Material Requirement Plan (物料需求計劃) LRR:Lot Reject Rate (批退率),

9、RMA:Reject Merchandise Authorization (銷貨退回品確認) MIR:Method Improvement Report (提案改善報告) ICT:In-Circuit Test(在線測試) ATE:Auto-Test Equipment (全自動測試設備) IC:Integrated Circuit (集成電路) Capacitor(電容器) Resistor(電阻器) Inductance(電感器) Core(鐵芯) Diode(二極真空管) Switch(開關) Resistor Network(排阻) PDCA:Plan,Do,Check,Action(計劃,做,查核,行動) 5W1H:Who,When,Where,What,Why,&How(誰,時間,地點,事件,為什麼&怎麼樣),10M:Market,Money