入门级专业英文词汇

1、PCB入 门 级 专 业 英 语 词 汇编制: 工程MI组日期:2013-11-15物料篇Laminate 层压板Base material 基材CCL (Copper-clad laminate) 覆铜板PP ( Prepreg ) 胶片,预浸或半固化片,常用的有1080/2113/2116 /7628等.Resin, Epoxy Resin 树脂,环氧树脂Woven glass fabric 玻璃纤维布Core 芯板Copper foil 铜箔,主要使用的铜箔有HOZ/1OZ等.Rolled copper foil 压延铜箔THE 铜箔( High temperature elongati

2、on electrodeposited copper foil) 高延展性电解铜箔Kraft Paper 牛皮纸Peelable mask 兰胶Kapton tape 高温胶Carbon ink 碳油Solder mask/Solder resist ink 阻焊油墨Thermosetting type ink 热固化油墨Silkscreen/Component mark/Legend 字符Solder, Tin/Lead solder 焊料,铅锡焊料Drill bit, Rout bit /milling cutter 钻咀,锣刀,铣刀Chemical 化学的Dry film 干膜,是一种能

3、感光,显像,抗电镀,抗蚀刻之阻剂TG (Temperature of Glass Transition) 玻璃态转换温度CTE( Coefficient of Thermal Expansion) 热膨胀系数CTI( Comparative Tracking Index ) 相对漏电指数Anti-CAF( conductive anodic filament ) 耐离子迁移Dielectric constant 介电常数(DK/Er)TD( Temperature of Decompose) 热裂分解温度RoHS( Restriction of Hazardous Substances Dir

4、ective )危害性物质限制指令 (Lead铅 , Mercury汞 , Cadmium镉 , Chromium (VI)六价铬 , Polybrominated biphenyls ( PBBs)多溴联苯, Polybrominated diphenyl ethers ( PBDEs)多溴联苯醚) 工艺篇Laminate cutting 开料,裁板Baking 烤板Desmear 除胶渣PTH( Plated-Through-Hole) 镀通孔,也指沉铜Plasma cleaner 等离子清洗Panel plating 全板电镀,也叫整板电镀Pattern plating 图形电镀Imag

5、e transfer 图形转移Tin Stripping 褪锡Etching 蚀刻Under cut 侧蚀SES 褪膜-蚀刻-褪锡连线(碱性蚀刻线)DES 显影-蚀刻-褪膜连线(酸性蚀刻线)Etching factor 蚀刻因子(蚀刻系数),主要用来衡量侧蚀量的大小,蚀刻 因子=2*铜厚/(下线宽-上线宽)Solder mask printing 印阻焊Exposure 曝光UV cure UV固化(ultraviolet)LPI( Liquid Photo Image) 液体感光成像Developing 显影Silkscreen stencil 丝印钢网，简称丝网Aluminum sheet

6、 铝片Scrubbing 磨边DI water 纯水,去离子水( Deionization),由树脂对无物理大颗粒的水体进行阴阳离子的吸附,常见的有钙离子/氯离子/镁离子等 HASL (Hot Air Soldering Level) 喷锡,热风整平LF-HASL (lead free-hot air soldering level) 无铅喷锡ENIG/Immersion gold沉金(沉镍金, Electroless Nickel/Immersion Gold )ENEPIG ( electroless nickel electroless palladium immersion gold

7、)沉镍钯金HDI( High Density Interconnector )高密度互连 Flash gold 水金(电薄金)Hard gold 厚金Immersion Tin 沉锡OSP / Entek (Organic Solderability Preservatives) 有机保焊剂,防氧化处理Immersion silver 沉银Pressing process 压合工艺Brown oxidation 棕化Layer up 叠层,预叠板Lamination structure 压合结构LASER (Light Amplification by Stimulated Emission

8、of Radiation) 镭射 ,激光Registration 对准，对位OPE (Optiline Post Etch)內层蚀刻对位冲孔机Rivet 铆钉/铆合Fusion 热熔X-ray, X射线CCD( Charge Coupled Device ) 电荷耦合器件 X-Y dimension machine 二次元Label, Barcode label 标签,条码标签V-cut / V-score 刻槽Rout 锣槽,锣板Routing 布线(route的ing形式) ,也指锣槽,锣板Punch 冲板/啤板AOI (Automated Optical Inspection) 自动光学

9、检查Fly-probe test 飞针测试Ultrasonic Cleaning 超声波清洗Microetching 微蚀Aspect Ratio 纵横比,厚径比,一般指板厚与最小孔孔径的比值工程篇Gerber data: Gerber 资料 Original Gerber 原稿Working Gerber 工作稿，生产稿Specification 规格,规范Fabrication drawing 制作图纸Purchasing order 定单Technical card / form 技术卡/表单Pad 焊盘Isolation pad 孤立焊盘Ground layer 接地层Power la

10、yer 电源层Signal layer 信号层Dielectric 介质层Impedance 阻抗Single-end impedance / Characteristic impedance特性阻抗Differential impedance 差分阻抗Copper circuits 线路Solder mask opening 阻焊开窗Solder dam / solder mask bridge 阻焊桥Thermal Via 导热孔,散热孔Teardrop 泪滴Annular ring 焊环Beveling 斜边Chamfer 斜边,倒角Clearance 清除(通常在内层指隔离环clear

11、ance land,在阻焊指开窗solder mask clearance)Via holes 导通孔Component holes 元件孔BGA( Ball Grid Array) 矩阵式球垫表面装组件 IC (Integrated Circuit) 集成电路器Pitch 节距,比如IC的节距, 就是IC pad的中心距离VIP,Via in Pad,盘中孔SMD (Surface Mount Device) 表面贴装组件(零件)SMT (Surface Mounting Technology ) 表面贴装技术THT( Through hole technology) 通孔插装技术Artwo

12、rk 底片,菲林Break-away area / panel rail 工艺边Panel / Set / array 套板Panelization 排版Component side 元件面Solder side 焊接面Soldering / Assembly 装配Fiducial mark 光点,定位光学点,用于装配时定位Slot 槽FPC (Flexible Printed Circuits) 软性电路板(软板)挠性印制板 Rigid PCB 硬板Rigid-Flex PCB 软硬结合板Semi-Flex PCB 半挠性板FR-4 (Flame Resistant Laminates) 耐

13、燃性积层板材Gold fingers 金手指Connector 连接器Press-fit hole 压接孔,一般孔径公差要求严,插件的脚一般不需要焊接Stamp hole / thread hole / mouse bite 邮票孔Blind hole 盲孔Buried hole 埋孔Tooling hole 工具孔,一般为NPTHX-out 打X板,即有缺陷的板Counterbore 沉头孔Countersinking 锥型扩孔，嗽叭孔Drill map/Drill drawing/Hole chart 孔图 SPC (Statistical Process Control) 统计制程管制G

14、reen 绿色gloss green 光亮绿色matte green / dull green 哑光绿色Compensate 补偿品质篇Tolerance / out of tolerance 公差/超出公差Dimension 尺寸Delamination 分层,多指多层板的金属层与树脂之间的分离而言Dent 凹痕/凹陷Wrinkle 皱褶/起皱Hole breakout 孔破Void 空洞Nick 缺口Pin hole 针孔Wicking 灯芯效应Cleanliness 清洁度Ion Cleanliness 离子清洁度Etchback 凹蚀Negative Etchback 负凹蚀灯芯效应E

15、lectrical test 电测试Roughness of hole wall 孔壁粗糙度Shelf life 保质期(沉金,喷锡板12个月,OSP,沉银,沉锡6个月)Inspection 检查visual examination 目视检查Thermal shock test 热冲击测试Solderability test 可焊性测试Edge dip test 浸锡测试 Solder float test 浮锡测试 Wave solder test 波峰焊 测试Wetting Balance 湿润平衡Conductor width 导体宽度(线宽)Conductor spacing 导体间距(线距)Bow and twist 板弯板翘Scratch 刮痕,刮伤 Measling 白斑Split 裂纹Repair / rewor