M004雷射钻孔教材

機台廠商型式軸vs

床台數量MitsubishiCO21/14CO22/14CO22/211HitachiCO22/23CO24/24Siemens

CO21/13UV1/18Kinsus現有雷射機台數量及型式：Comment：CO2機台共6種型式29台，UV機台共2種型式8台2/4/20231機台光路設計的差異YXGalvanoscannerFθlensYXWorkLaserbeamResonatorTop-hatopticsystem

ImprovedenergyefficiencyDevelopmentofhighpowerresonator＋DoubledenergyYXEnergyattheprocessingpointissimilartothesinglemachineBeamsplitSinglemachine2-workmachineMaskResonatorGaussianopticsystem2/4/20232TophatbeamVsGaussianHoleshapebytophatbeamHoleshapebygaussianbeamAcrylicbarnpatternResultofenergydistributionsimulationResinDamageontheinternalcopperNodamageontheinternalcopperGaussianbeamCopperResinResinCopperTophatbeam2/4/20233ＸＹtableXYGalvanoscannerFθlensVisionsensorVisionsensorGalvanoscannerFθlensXYtableXYFθlensXYtableVisionsensorGalvanoscannerXY機台型式設計原理比較2/4/20234雷射共振腔CollimationlensMask

LaserbeamScanningareafθlensGalvanomirrorProtectlensCollimationlens：決定雷射光能量分佈Mask：決定LaserBeam的大小Galvanomirror：決定雷射定位精度(20um)fθlens：使雷射光垂直於工件Protectlens：保護fθlens主要部品的名稱及功能簡介2/4/20235Workpiecedistance

fθlensGalvanomirror決定加工速度的因素有二：Galvanomirror的定位速度現有規格：1000Hz/1200Hz/1400HzGalvanomirror涵蓋的區塊面積

可用規格：10~70×10~70mm

現在生產：50mm×50mm?Area大小對加工有何影響?2/4/20236※IncaseofCO2laser,resultofaprocessingchangesbythesurfacetreatmentconditionofcopperfoil.ImagingCopperdirectBVHConformalProcess350400450500Diameter(μm)ResinThickness:50μmCopperfilm:5～9μmPossibleVia-holeDiameter50100150250300700サイクル＆バーストパルス2000CO2laserUV-YAGlaser雷射鑽孔加工方式2/4/20237雷射鑽孔加工流程入料取隔紙及板面檢查有無參數通知工程師設定參數測試並新增機台參數是否有程式程式轉檔設定該料號參數檔校正能量設定自動排程生產首件檢驗品質是否正常繼續生產通知工程師處理出貨有無無有是不是PS：1．能量校正1次/4HR2．精度校正1次/4HR1．1/10pnl/pnls2．量測上下孔徑2/4/20238Mis-alingmentResinresidueonstoppadStoppaddamageOverhangtoobig雷射品質項目簡介2/4/20239OpticalSystemCameraLaserShutterBeamExpanderDichroicMirrorMirrorSurfaceDeflectionHeadF-ThetaObjectiveQuarterWavePlateAchromatIlluminationRingImagesection4.3*2.8mm.Resolution:5.5/pixel.Illumination:verticaland60o,30oanglediodeslighting.Wavelength:λ=880nm.HighresolutionCCDcamerawithaPROFIBUSvisionsensormodelSIMATIC-VS710fromSiemensisusedasaprocessingsystem.

2/4/202310X,Y-axesLinearmotorwithlinearscalesystemtotravelthevacuumplateisonthetransportunit.

2/4/202311The3ndstep: Cleanedthebottomsideofhole(OutofFocus)

ResinremoveThe2ststep: Copperandfibercuttingprocesstomaketheholeshape(InFocus)The1ststep: Copperopeningandfibercuttingprocesstomaketheholeshape(InFocus)UV雷射鑽孔加工方式2/4/202312※Theorem908070605040302010035510649400Absorption(%)WavelengthinNanometersCopperDielectricGlassCO2LaserUVLaser10600PS：利用UVLaser和CO2Laser的不同波長及其波長對Copper、Glass及Dielectric的不同吸收率，來達到開銅窗及除膠的目的。2/4/202313UV和CO2加工方式比較2/4/202314UV和CO2加工孔徑的比較・ThroughputVisnotincludingXY-tablepositioningtime,

alignmenttimeandL/ULtime.01002003004000305080100150UV-YAGCO2Epoxy-resin：ｔ30～60μmCopperfoil:t6～9μmHolediameter(μm)ThroughputV(holes/sec)2002/4/2023151．CO2雷射鑽孔機適用於預開銅窗的盲孔加工

(目前廠內生產的為65um~250um，ABF的產品孔徑為50um)2．UV雷射鑽孔適用