Victoria SIM card Solder printing DOE.ppt

1、1,Solder printing DOE report Model: Victoria SIM card 16-Dec-2007,Prepared by :Kaiser Approved by :Handy,2,Solder printing DOE,1.Background & objective: Since build up this project the result of printing not steady, in order to obtained the stably and high yield rate a DOE team was set up to track t

2、his issue for printing process. Experiment place: SMT Line 1 DOE team member:,3,2.Evaluation Summary the DOE Requirement for the experiment run DOE test optimize printing process verifier the result,Solder printing DOE,4,3.The requirement for the DOE test 3.1 DEK Auto printer 3.2 SE200 thickness mea

3、suring instrument 3.3 Senju solder paster(M750-GRN360-K2-V) 3.4 Victoria SIM card project 802H739B FPC 3.5 Squeeze(200mm) 3.6 Stencil :THK=0.1/0.13mm 3.7 Air gun 3.8 Magnifier(5X) 3.9 Project Work instruction 3.10 Cleaner-Isopropyl Model:SC22 3.11 Lint paper,Solder printing DOE,5,4.Variable factor a

4、ffecting the printing per team member discuss, fix the parameter show as below clear mode: W/D/V, Print gap: 0.7mm, auto clean cycle 5Panel, manual clear cycle: 20Panel .we select the qualified solder point as the output. Y=(X1,X2,X3,n ,under factors A,B ,C ,D), and select several vital few paramete

5、r as factors and then use the DOE 3 factors 2 level replicate 2 times to run the experiment.,Solder printing DOE,6,Solder printing DOE,5. 3 factors 2 level experiment,7,Solder printing DOE,6. According to design demand (each group print 10set) random test result:,8,Observation: From the P value 0.05

6、 , it showed that printing pressure and printing speed and separation speed were the significant cause to affect the result.,Solder printing DOE,9,Observation: The factors printing pressure and printing speed and separation speed can explain 99.03% of total variation for affecting result.,Solder pri

7、nting DOE,10,Selection of Best setting: Printing pressure (-), printing speed (-), separation speed (-), Predict Response: = 778+(-3.125)*(-1)+(-6.125)*(-1)+(-7.625)*(-1)+3*(-1)*(-1)+2.5*(-1)*(-1)+(-0.5)*(-1)*(-1)+0.875*(-1)*(-1) =800,Solder printing DOE,11,Solder printing DOE,7. Residual plots use

8、to examine the goodness of model fit:,The data are normally and random distributed. The state is ok.,12,8. Use the main effects plot for comparing magnitudes of main effects:,The plots indicate when printing pressure 6kg/cm, printing speed 35mm/s separation speed0.3mm/s the output Y max.,Solder prin

9、ting DOE,13,Solder printing DOE,A Printing pressure：6. 0kgf/cm B Printing speed：35mm/S C Separation speed：0.3mm/S,Below are the optimized parameter print result,9. Per the DOE experiment ,We obtain the following factors and levels:,14,Solder printing DOE,10. Validate of Experiment,From the printing yield rate we kno