产品及材料环境管理物质规定

1、*目录*项目ITEM页次PAGE目1修2132.33.3445565-207208.20-30内 容 DESCRIPTION订履历目的范围参考文件定义职责环境管理物质的规定文件变更时机及权限附加文槽*修订履历*版次REV.ECN NO.修订履历Revise History备注RemarkABC-02-54514新版发行 (Issued first time)1、目的 Purpose:本规定主要是针对 NWInG （以下简称本公司）相关客户环境要求之产品 及材料等中所含的环境管理物质，明确禁止使用物质，计划废除物质以及削减物质，期让公司内部及供应商人人 皆知，达到防止向客户产品混入环境有害物质，

2、提高本公司产品的环境质量及产品的竞争力及遵守法令，保护地球环境以及减轻对生态系统影响的目的.This Regulation mainly focus on the Environment-related substances to be controlled （"The Controlled Substances ”）contained in the products and materials required by relatedcustomers of Foxconn NWInG, Clarified the banned substance, substances to be

3、 phased out and substances to be reduced, weexpected the regulation can be forwarded to companyinterior and suppliers to prevent the above-mentioned substances from being used for customers. Improve the environmentquality and competition of product to comply with related lawsand regulations. To redu

4、ce the influence of the above-mentioned substance upon the ecosystem and contribute tothe global environmental preservation.2、范围 Scope:2.1 成品和半成品（功能单元，模块，板组件等的组装零件等）Finished products and semi-finished products （e.g. modules, functional units, board assemblies, and other parts etc.）2.2 零件（电气零件，机构零件，半

5、导体产品，印刷电路板，记录介质，包 装材料，包装零件）Parts （electrical parts, mechanical parts, semiconductor devices, PWBs, recording media, packaging materials, packaging parts）2.3 螺丝 Screws2.4 附件（遥控器，鼠标,AC适配器等为设备使用而配套的附属品等）Accessories （remote controllers, mice, ACadaptors and other accessories）2.5 产品所使用的附属材料（胶带，焊接材料，粘结剂等）

6、等构成材料 Materials employed in subsidiary parts and materials usedfor products （adhesive, soldering materials, adhesive tapes）2.6 操作说明书 Instruction manuals2.7 服务零件 Repair parts2.8 产品交货时发送和保护货物所使用的包装材料（木框，托架，导轨,杠杆，袋，缓冲材料，固定器具，薄板，绳索，硬纸箱，胶带，捆绑带，标签，印刷油墨及涂料等）The packaging materials used for delivery and pro

7、tection products (wooden frames, trays, reels, sticks, bags, cushions, staples, sheets wraps, tapes, labels, corrugated cardboard, vinyl ties, and inks or paints for printing)备注：止匕外，在本文件中未明确规定的物质或其用途，如果各国，当地法令或相关客户禁止使用或限制使用，必须按照其要求执行.Remark: Regarding the substances or their purpose whose use is ban

8、ned by regional or country or related customerslaws and ordinances, the laws and ordinances must be observed even though the substances or their purposeare not clearly regulated in this document.3、参考文件 Reference:3.1 Sony SS-00259技术标准(第2版)Sony SS-00259 Technical Standards (Rev: 2)3.2 环境管理物质管制及异常处理程序(

9、SG-2B0-016)The Controlled Substances Management & Deviation Handling Procedure4、正义 Definition4.1 环境管理物质 Environment-related Substances to beControlled ("The Controlled Substances ”)客户及本公司判断在产品，设备等所含有的物质中,有对地球环 境和人体存在显著影响的物质.The substances contained in products or materials judged byFoxconn

10、or customers that they obviously impact on both humans and global environment.4.2 管理级别：Management Standards按照以下3种管理级别进行管理To managethe above-mentioned substances, the following three levels are used.4.2.1 1 级：对于该物质及其用途立即禁止使用.Level 1: The substances and purposes classified at this level are those whos

11、e use must be banned immediately.4.2.2 2 级：对于该物质及其用途规定一定时期予以禁止.超过表中规定的日期之后，不能在产品及材料中使用，到达期限时指定为“1级”Level 2: The substances and purposes classified at this level are those for which periods for phased out are individually set. After the time set in each table, the substance fulfilling the above condi

12、tion will be classified at level one and must not be contained in parts and materials.4.2.3 3级：目前虽然没有规定日期以及削减目标，但指定了计划削减在产品，材料中含量的物质及其用途.Level 3: No periods or targets for reduction are currently set for the substances and purposes classified at this level. However, the contents in products and mate

13、rials ought to be reduced.4.3 含有 Contained含有系指无论是否有意，所有在产品的零件，设备或使用的材料中添 力口，填充，混入或黏附的物质(包括在加工过 强中无意混入乎黏附于产品中的物质)"Contained " is a situation in which a substance is added to, fills up, mingles with or adheres to the parts ordevices employed in products, the materials used for the parts or d

14、evices, regardless if the situation isintentionally created or not. (When a substances is unintentionally contained in, or added to a product in a processing process, this is also regarded as"Contained ”)4.4 杂质 Impurity包含在天然材料中，作为工业材料使用，在精制过程中技术上不能完 全去除的物质(natural impurity),或者合成反应过程中产生，而在技术上不能完

15、全去除的物质.A substance contained in a natural material, which cannot technically be removed in a refining process totally, or a substance generated in a synthesis process, the total removal of which is technically impossible.此外，为了与主原料加以区别，在为了改变材料的特性而使用称之 为“杂质”的物质时，也按“含有”处理.但是，在制造半导体产品等 使用的掺杂剂(DOPANT),虽然

16、是有意添加的，但实质上在半导体产品 中仅有极微量残存，这种情况下不作为“含有”处理 .,Additionally, there are substances calledaimpurity ” , thename of which is used to distinguish them from main materials. If they are used for the purpose of changing the characteristics of materials, they are treated as “ Contained ” . There are substances

17、 called Dopants (Doping Agents) that are intentionally added to manufacture semiconductor devices. They are not treated as "Contained " if left in the devices in a very small amount.在本规定中,在指定允许浓度的情况下，当在产品或材料中该环境管 理物质作为杂质混入或者黏附时，其浓度不应超过该允许浓度.“When an allowable concentration of an “ Environm

18、ent -related Substances to be Controlled " is specified in this management regulation, the concentration must be kept even if the substance, as an aImpurity ” , mingles with or adheres to products or materials.4.5 禁止供货时期 The time to ban on receiving the parts and materials.产品和材料禁止向客户和Foxconn供货日

19、t期(即客户和Foxconn收货之日期).This indicates the time when customers and Foxconn must not receive the parts and /or materials specified in this rule5、职责 Responsibilities:参见环境管理物质管制及异常处理程序Refer toThe Controlled Substances Management & Deviation Handling Procedure6、环境管理物质的管理标准Management standards for the c

20、ontrolledsubstances1.1 环境管理物质：本规定中作为对象的环境管理物质名称见表6.1Environment-related Substances to be Controlled( "TheControlled Substances " ): refer to table 6.1 of“List of“ Environment - related substances to be controlled ”regulated in this regulation.表6.1环境管理物质名称一览表Table 6.1 List of Environment-re

21、lated Substances to be Controlled ("The Controlled Substances ”)物质名称Substances11重金属Heavy metals镉及镉化合物 Cadmium and cadmium compounds铅及铅化合物 Lead and lead compounds汞及汞化合物 Mercury and mercury compounds六价铭化合物 Hexavalent chromium compounds有机氯化合物Chlorinated organic compounds多氯联苯 Polychlorinated biphen

22、yls (PCB)多氯化奈 Polychlorinated naphthalene (PCN)氯代烷烧 Chlorinated paraffin (CP)灭蚁灵 Mirex (Perchordecone)其它 有机 氯化 合物 Other chlorinated organic compounds有机澳化合物 Organicbrominated compound多澳联苯(PBB) Polybrominated biphenyls多澳二联苯 Polybrominated diphenylethers (PBDE)澳双酚-A-双-(2,3-二澳丙醍)Tetrabromobisphenol-A-bi

23、s-(2,3-dibromopro pylether) ( TBBP-A-bis)其它有机澳化合物Other brominated organiccompounds有机锡化合物(二丁基锡化合物，二苯基锡化合物 Organic tin compounds (Tributyl tin compounds, Triphenyl tin compounds)石棉 Asbestos偶氮化合物 Azo compounds甲醛 Formaldehyde聚氯乙烯(PVC)以及聚氯乙烯化合物Polyvinyl (PVC) and PVCblends1.2 环境管理物质主要对象及禁止供货日期Main “Targe

24、ts ” and “The time to ban on receiving the parts and materials “ regarding The Controlled Substances ”物名耦：第以及辐化合物Substances:Cadmium and Cadmium compounds明：金腐，合金，辗械化合物，有械化合物，辗械蜜，有械蜜等含有第元素的所有物冽象甄圉All metals, alloys, inorganic compounds, metal-organic compounds, inorganic salts, organic salts, and othe

25、r substances封象 Targets禁止供SO寺期The time to ban on Receiving the parts and materials僦Level 1* 包装崖品（参照表6.3a）（把手，塑料袋,余箱索，箔，托架,溥< ,W>盒等）;* 塑料（包括橡夥）材料中使用的稳定剜,m料，染料（H氟速的，遥控 器维 飙等啼 意子崖品的外装榭脂，外框，黑！，唱片等）;* 壅料，墨水* 表面虞理（霞艘等）,w，照片;* 日光燎（小型日光燎，直管日光燎）;-Packaging materials （Refer to table 6.3a）（e.g. handles, c

26、ushions, wraps, foil, trays, reels, sticks, magazines and polyethylene bags;-The stabilizers, pigments, or dyes used for plastics （including rubber） materials （e.g. labels, cabinets, phonograph records, vinyl ties, the keys of remote controllers, the outer plastics resins of electrical parts, and th

27、e insulators of electrical wiring）-Paints, inks;-Surface treatment （e.g. plating）, coating; Photographic films;-Fluorescent lamps （small-sized ones, straight-tube ones）;立即孰行Banned immediately2级在H随雷池中作得新型！品而供货的材料，但所有的H 牖雷池优2004年11月始符禁止供货;The Nickel and NiCd batteries that are received as new parts,Al

28、l the Nickel and NiCd batteries must not be used in or after November 2004优2003年2月1日鼠始On and after February 1, 20033级以外的所有用途.例如，直流重勤械，信昌,畿霜器，断路器等重接黑占；温度保陂的可溶醴;玻璃以及玻璃壅料的!料，染料（用於玻璃的!料，染料以及玻璃用壅料）;金旱金易（第含量悬20ppm以上的金旱金易）;螯光11示装置中含有的螯光,CdS光醇霜池霜阻（玻璃料）等；注:辞屡金蠹件等金JS崖品中的辐，除了有意添加以外，符作卷亲跳?不予理曾.优2004年11月1日融始2级Le

29、vel 23级Level 3All other purpose, which are not classified at Typical examples are given below:Level 3 ”-Switches, relays breakers, DC motors, and other electrical contact points;- Fuse elements of temperature fuses;- Glass, and the pigments and dyes of glass paints (paints for glass and the pigments

30、 and dyes used for glass);- Solder (whose cadmium concentration is 20 ppm or more);- CdS-photocells and the phosphors contained in fluorescent display devices;- Resistor elements (glass frit);Note): Cadmium contained in metal parts (e.g. zinc die-casting) is regarded as an impurity. Therefore, their

31、 cadmium concentration shall be disregarded unless cadmium is intentionally added to them.要求使用可靠性高的重接黑占而没有替代材料的品The plating of electrical contacts, for which high reliability is required and which has no substitute materialsOn and after Novemberl, 2004允言包！度：小於5ppm,塑料（包括橡H ）Allowable concentration: L

32、ess than 5 ppm for plastics （including rubber）测定檄型:UM理：有皿前1理方法，探用硫酸，硝酸以及谩氧化氢存在下的?累式分解法（例如BS EN1122:2001" Plastics- Determination ofcadmium - Wet decomposition method中音已载的分解方法等），硫酸存在下的灰化法或者在密朗容器中的加IB酸分解法 （微波分解法）等.测定装置檄型装置卷感鹰等蹄子醴彝光分光分析装置（ICP-MS）除以上之外，通imat理和测定装置的合 以探用上述AAS以外的方法同日寺迤行分析（ICP-AES,ICP

33、-OES）,原子吸收装置（AAS）,感鹰等蹄子till量分析装置，如果可以保if第的定量下限悬5 ppm以下日寺剧作悬正品.此外，第和也可Standard for measurement:1) Pre-conditioningTypical examples are as follows:(1). A wet decomposition method under the existence of sulfuric acid, nitric acid, and hydrogen peroxide (e.g. the decomposition method specified in BS EN1

34、122:2001,Plastics-Determinatiowet decomposition method');(2) . An incineration method under the existence of sulfuric acid; and(3) . A pressurized acid decomposition method done in a sealed container (a microwave decomposition method).If precipitated are produced, dissolve them with some methods

35、.(2) Measurement methodUse any one of ICP-AES (OES)(Inductively Coupled Plasma-Atomic OpticalEmission Spectroscopy) or AAS (Atomic Absorption Spectroscopy), or ICP-MS (Inductively Coupled Plasma MassSpectroscopy).These are standard measurement methods.it is also availab-If a combination of pre-condi

36、tioning and a measurement method can guarantee that In this purpose, the lower determination limit of Cadmium is less than 5 ppm, Note: With the above-mentioned pre-conditioning and measurement method (expect AAS), it is possible to analyze cadmium and lead simultaneously.物名耦：以及化合物Substances: lead a

37、nd lead compounds明：金腐，合金，辗械化合物，有械化合物，辗械蜜，有械蜜等包含元素的所有物德1像甄圉All metals, alloys, inorganic compounds, metal-organic compounds, inorganic salts, organic salts, and other substances封象 Targets禁止供货日寺期The time to ban on Receiving the parts and materials1级Level 1包装材料(参照表6.3a)用於印刷fO各板而使用的料，1®料，墨水；Packagi

38、ng materials (Refer to table 6.3a)-Pigments, paints, and inks containing lead, which are used for PWBs;在小型密封池中作焉斫型®品而供K的崖品；The small-size -sealed lead-acid batteries that are received as new parts;立即孰行Banned immediately2级Level 2所有的小型密封池优2004年11月始禁止供货All small-size sealed lead-acid batteries mus

39、t not be received in or after November 2004.徙2004年11月融始On and after November, 20042级Level 2*崖品的外部重趣，引醇端子等的冬旱金易虑理(重氟崖品/半醇醴崖品/散热片等);*AC遹配器 重源霞，速接雷，遥控器，鼠檄，彳着外露部分中使用的塑料(包括橡W )材料中的稳定剜 X料，染料,壅料以及墨水-Soldering on the external electrodes and on the external lead wires of parts.(e.g. electrical parts, semicon

40、ductor devices, and heat sinks);-The stabilizers, pigments, dyes, paints, or inks contained in the plastics (including rubber) materials that are used for an outer and exposed part of the following articles: mice, devices, AC adaptors, connection cords, remote controllers, power supply cords, and th

41、e exposed parts of a device.优2004年2月1日鼠始On and after February 1, 20042级Level 23级以外的所有用途.例如，* 在85wt%以下的有金旱金易中，所含有的的含量在1000Ppm以上的厘品；* 光擘玻璃所含有的 ;* 含有允音翎1度*以上的各槿合金(包括金旱金!材料);* 除AC遹配器，重源，速接，遥控器，鼠檄，彳着外露部分以外所使用的塑料(包括橡 )材料中的稳定剜,m料，染料，料以及墨水All other purposes, which are not classified at“ Level 3 " ,typi

42、cbelow:* Among the type of leaded solder, the ones that satisfy both of the following conditions:(1) Leaded solder that contain less than 85wt% of lead; and(2) Leaded solder whose lead concentration is 1000 ppm or more.-Lead contained in optical glass-All kinds of alloys whose individual lead/lead c

43、ompounds concentrations exceedthe regulation (Refer to the table in" Level 3 ”)-The stabilizers, pigments, dyes, paints, and inks contained in the plastics(including rubber) materials that are used for articles other than mice, AC adaptors, connection cords, remote controllers power-supply cord

44、s, and the exposed parts of a device.al examples are given优2004年11月1日融始On and after November 1, 20043级Level 3崖品，lf的内部速接用高熔黑占蜉金易(能 85wt%以上的有蜉金易)* 子陶禽董品(屋重元件，陶瓷感鹰材料等)* 11像管，重子品，蛰光H示管所使用的玻璃材料；霜子品中使用的玻璃材料和密封材料，包括重阻醴,醇霜,，粘接剜，玻璃料等；* 含有的如下合金(*1)合金的槿含的允言镀!度金同材0.35wt%以下金日合金0.4 wt%以下铜合金4 wt%以下金旱金易1000Ppm以下Hig

45、h-melting point solder for internal connections used for parts and devices (the leaded solder whose lead contents is at least 85wt%);- Electronic ceramic parts (e.g. piezoelectric elements, ceramic dielectric materials);- Glass materials used for electronic parts, cathode-ray tubes, or vacuum fluore

46、scent displays;- Glass materials used for electronic parts include sealing materials, resistor elements, conductive pastes, adhesives, and glass frit;- The following alloys that contain lead as an additive Type of alloyAllowable content of leadSteelLess than 0.35wt%Aluminum alloyLess than 0.4wt%Copp

47、er alloyLess than 4wt%SolderLess than 1000 ppm允言包1度:100ppm以下；塑料(包括橡fg )Allowable concentration: Less than 100 ppm for plastics and rubbers测定檄型:(1)颈虑理sot理方法探用硫酸，硝酸以及谩氧化氢存在下的潟式分解法，硫酸存在下的灰化法或者在密朗容器中的加屋酸分解法(微波分解法)等.在彝生沉物日寺使用某槿方法迤行溶解.(2)测定装置檄型装置悬感鹰等蹄子ft樊光分光分析装置(ICP-AES,ICP-OES),原子吸收装置(AAS),感鹰等蹄子till量分析装置

48、(ICP-MS).通谩以上Shi理和测定装置的合，如果可以保的定量下限悬30 ppm以下日寺，即作悬正品.此外，第和也可以探用上述AAS以外的方法同日寺迤行分析.Standard for measurement:1) Pre-conditioningTypical examples are as follows:(1) . A wet decomposition method under the existence of sulfuric acid, nitric acid, and hydrogen peroxide;(2) . An incineration method under th

49、e existence of sulfuric acid; and(3) . A pressurized acid decomposition method done in a sealed container (a microwave decomposition method);2) Measurement methodUse any one of ICP-AES(OES)(Inductively Coupled Plasma-Atomic Optical Emission Spectroscopy) or AAS (Atomic Absorption Spectroscopy), or I

50、CP-MS (Inductively Coupled Plasma Mass Spectroscopy). These are standard measurement methods.If a combination of pre-conditioning and a measurement method can guarantee that In this purpose, the lower determination limit of lead is less than 30 ppm, “ it is also available;Note: With the above-mentio

51、ned pre-conditioning and measurement method (expect AAS), it is possible to analyze cadmium and lead simultaneously.物名耦：汞以及汞化合物Substances: mercury and mercury compounds明：金腐，合金，辗械化合物，有械化合物，辗械蜜，有械蜜等包含汞元素的所有物冽象甄圉All metals, alloys, inorganic compounds, metal-organic compounds, inorganic salts, organic

52、salts, and other substances至勺象Targets禁止供SO寺期The time to ban on Receiving the parts and materials1级Level 1包装材料(参照表6.3a)- m料淮料，墨水；- 汞重池，言十日寺器；- 小型日光燎(液晶背光燎等)，每一支的含量超谩10mg;- 直管日光燎，每一支的含量超谩20mg;- 使用汞作卷接黑占的畿霜器，信封，傅感器塑料中的添加剜.- Packaging materials (Refer to table 6.3a);- Pigments, paints, and inks-Mercury

53、cells, hour meters;- Small-sized fluorescent lamps (e.g. the ones for the back lights of liquid crystal displays),whose mercury content (per lamp) is more than 10 mg;- Straight-tube fluorescent lamps,whose mercury content (per lamp) is more than 20 mg;- The relays, switches, or sensors for which mer

54、cury is used in contacts;- Mercury or its compounds mixed in plastics.立即孰行Banned immediately2级Level 2* 小型日光燎，每一支的含量悬5mg以上10mg以下；* 直管日光燎，每一支的含量悬10mg以上20mg以下：* 氧化金艮霜池，性扣霜池，空氧霜池；* 1版和3级以外的所有用途.* All other purpose, which are not classified at Level 1 or 3;* Small-sized fluorescent lamps,whose mercury co

55、ntent (per lamp )is 5;* 10 mg-Straight-tube fluorescent lamps,whose mercury content (per lamp) is 10-20 mg;* Sliver oxide cells, alkaline-manganese cells, and air cells.优2004年11月1日融始 On and afterNovember 1,20043级Level 3* 小型日光燎，直管螯光燎以外的燎(高屋汞燎等)；* 小型日光燎：每一支的含量悬5mg以下；* 直管日光燎：每一支的含量悬10mg以下.* Lamps other

56、 than small-sized fluorescent lamps and straight-tube fluorescent lamps (e.g. High-pressure mercury lamp);* Small-sized fluorescent lamps,whose mercury content (per lamp) is less than 5mg;* Straight-tube fluorescent lamps,whose mercury content (per lamp) is less than 10mg.物!名H :六僵路化合物Substances: Hexvale