KLA缺陷检查培训学习课程

1、21xx Capabilities2第1页/共24页第一页，编辑于星期六：三点 四十九分。3第2页/共24页第二页，编辑于星期六：三点 四十九分。Run Overview4第3页/共24页第三页，编辑于星期六：三点 四十九分。Run one waferInspection Queue5第4页/共24页第四页，编辑于星期六：三点 四十九分。6第5页/共24页第五页，编辑于星期六：三点 四十九分。7第6页/共24页第六页，编辑于星期六：三点 四十九分。8第7页/共24页第七页，编辑于星期六：三点 四十九分。9第8页/共24页第八页，编辑于星期六：三点 四十九分。Stopping the Inspe

2、ction10第9页/共24页第九页，编辑于星期六：三点 四十九分。Defect Overview To improve production yields, defects need to be monitored and statistically analyzed at each stage of wafer production.11第10页/共24页第十页，编辑于星期六：三点 四十九分。Defect Sort1.False : Found nothing after review with inspection data.2.Unkown : Defects were found b

3、ut there is no suitable defect code to assign.3.Fall on particle : Particle on surface of patten. 4.In film particle : Particle was contained in film, such as poly, HDP, metal and so on.HDPPoly12第11页/共24页第十一页，编辑于星期六：三点 四十九分。5.Scratch : Especially for scratch caused by robot , other tool parts or man

4、-made. Defect map :Defect iamge:MicroMacro13第12页/共24页第十二页，编辑于星期六：三点 四十九分。6.Discolor : Color difference7.Masking ：Should be etched but still remian(poly,SiN,spacer,metal and so on). Some connect more than two lines,its bridge(killer).14第13页/共24页第十三页，编辑于星期六：三点 四十九分。8.Ring like defect: Such as defects

5、caused by ARC splash, usually related to PHOTO.PolyMetal9.Grape like defect:Induces by PHOTO PU.15第14页/共24页第十四页，编辑于星期六：三点 四十九分。10.Residue ：Always happen after wet station clean.11.Patten abnormal : Roughness,Defocus,Patten shift and so on.RoughnessDefocusPatten shiftPatten Abnormal16第15页/共24页第十五页，编辑

6、于星期六：三点 四十九分。12.Concave: COP（ Crystal oriented pits ）, Oxide Loss，Pits.13.Peeling : Pattern shift or missing（W plug is one of peeling,always appear at wafer edge.） 17第16页/共24页第十六页，编辑于星期六：三点 四十九分。14.Blind : CT or Via have not been opened.15.Patten damage : Metal damagePoly broken is patten damage too

7、,always happen during High Imp.18第17页/共24页第十七页，编辑于星期六：三点 四十九分。16.W Residue : 1). Caused by Oxide Loss; 2). Caused by CMP.NORMAL ABNORMAL17.Under_Pat ：Under layer pattern fail issue.19第18页/共24页第十八页，编辑于星期六：三点 四十九分。18. Salicide_abnormal:Salicide poor formation.19.Grain : Including poly or metal grain.20第19页/共24页第十九页，编辑于星期六：三点 四十九分。20.Slurry: 21.PR /Polymer_remain :PR has not been stripped completely, typically contains Carbon21第20页/共24页第二十页，编辑于星期六：三点 四十九分。22.Arcing:23.Line open:22第21页/共24页第二十一页，编辑于星期六：三点 四十九分。24.Corrosion : Caused by etch strip chamber or bad environment. This type defec