电子厂英语考试题目及答案

电子厂英语考试题目及答案PartIListeningComprehension(30points)SectionAShortDialogues(10×1.5=15points)Directions:Youwillheartenshortconversationsbetweentwospeakers.EachconversationwillbeplayedONCE.Aftereachconversation,aquestionwillbeasked.ChoosethebestanswerfromthefouroptionsmarkedA,B,CandD.Notranscriptisprovidedhere;thescriptisforteacheruseonly.Belowarethequestionsandthecorrectchoiceswithfullexplanations.1.Whatdoesthewomanimplyaboutthenewlead-freesolderpaste?A.Itrequiresahigherreflowtemperature.B.Itcontainstracesofsilver.C.Ithasbeendiscontinued.D.Itsmellsbetterthantheoldtype.Answer:A解析：女士提到“profileneedstobepushedupbyalmost10°C”，即需要提高回流温度，对应无铅锡膏特性。2.WhydoesthemanrefusetosigntheFAIreportimmediately?A.TheCMMisundermaintenance.B.HelefthiscaliperintheESDlocker.C.Onedimensionisstilloutofspec.D.ThesupplierforgottosendtheCoC.Answer:C解析：男士说“holeØ2.30isstillprinting2.27”，说明尺寸超差，因此拒签。3.Wherewilltheauditorsbereceivedtomorrow?A.InthetrainingroomnexttotheSMTline.B.Atthefrontlobby,thenstraighttotheQAlab.C.Intheconferenceroomonthesecondfloor.D.Outsidethefinished-goodswarehouse.Answer:C解析：女士明确说“second-floorconferenceroom”。4.Whatproblemhasthepick-and-placemachineencountered?A.Theconveyorbeltismisaligned.B.Thevisionsystemkeepsrejectinggoodparts.C.Thenozzlekeepscloggingwithfluxresidue.D.Thefeeder3Bisdouble-feeding.Answer:D解析：对话中“doublefeedon3B”直接对应选项D。5.Howmanymoisture-indicatorcardsaremissingaccordingtothestorekeeper?A.Twohundred.B.Twothousand.C.Twenty.D.Twelve.Answer:B解析：库管员说“twoboxes,onekeach”，即两盒，每盒一千张。6.Whatdoesthewomansuggesttoreducesolder-balldefects?A.Loweringthepre-heatslope.B.Switchingtonitrogenreflow.C.Increasingthesqueegeepressure.D.Usingasmalleraperturemask.Answer:B解析：女士提到“nitrogenatmospherewillreduceoxidation”，即氮气回流。7.Whenwillthenextreelof06031kΩresistorsarrive?A.Beforethefirstbreak.B.Afterthesecondshift.C.Duringlunchinterval.D.By16:30today.Answer:D解析：男士确认“supplierpromised4:30p.m.”。8.Whyistheionic-contaminationtesterbeeping?A.Theextractionsolutionwasexpired.B.Theoperatorforgottozerotheprobe.C.ThePCBwashandledwithbarehands.D.Thestandardwassetto0.1µg/cm².Answer:C解析：女士回忆“someonetouchedthepads”,引入离子污染。9.Whatprecautionisrequiredforthenewstatic-shieldingbags?A.Theymustbesealedat<30%RH.B.Theyshouldbebakedat125°Cfirst.C.Labelsmustavoidthezippertrack.D.Onlynitrogenflushingisallowed.Answer:C解析：对话提到“labelareais15mmfromzipper”。10.Whichdocumentwillbeupdatedtonight?A.TheworkinstructionWI-40-Rev.E.B.ThecontrolplanCP-22-Rev.C.C.TheOCAPforsolderbridging.D.TheMSDleveltable.Answer:A解析：男士说“WI-40isunderchangecontrol”。SectionBLongConversation(5×2=10points)Directions:YouwillhearalongconversationbetweenaprocessengineerandaqualitymanageraboutasuddenspikeinICTfailures.TheconversationisplayedONCE.Choosethebestanswer.11.WhatpercentageofboardsfailedICTthismorning?A.0.8%B.8%C.18%D.80%Answer:B解析：工程师说“eightpercent,tentimesthenorm”。12.Whichcomponentismostsuspected?A.A0.1µFdecouplingcapacitor.B.A3.3VLDOregulator.C.A100-pinQFPMCU.D.AUSB-Creceptacle.Answer:C解析：质量经理提到“QFPcold-jointissue”。13.Whatimmediatecontainmentactionwastaken?A.Allboardsweresenttorework.B.Thereflowovenwasshutdownforrecalibration.C.Goodunitsweresortedandshipped.D.Thelotwasquarantinedintheholdarea.Answer:D解析：对话中“holdarea”出现两次。14.Whatwilltheengineercheckfirstintheprofile?A.Peaktemperatureofzone4.B.Conveyorspeed.C.Soaktimeabove180°C.D.Coolingrate.Answer:C解析：soaktime影响QFP焊点。15.Howlongwillthemicro-sectionanalysistake?A.Twohours.B.Halfashift.C.Oneday.D.Threedays.Answer:C解析：实验室答复“24-hourturnaround”。SectionCPassage(1×5=5points)Directions:ListentoapassageaboutthehistoryofRoHSdirectives.Thenanswerfivequestions.Correctanswersbelowwithkeysentencereferences.16.WhendidtheoriginalRoHScomeintoforce?Answer:1July2006.解析：原文“officiallyenforcedonthefirstofJuly2006”。17.WhichsubstancewasfirstaddedinRoHS2?Answer:DBP(Dibutylphthalate).解析：RoHS2新增四种邻苯，DBP是其一。18.Whatisthemaximumtoleratedcadmiumthreshold?Answer:100ppmbyweightinhomogeneousmaterial.解析：原文“0.01%”。19.Whoconductsthetechnicaldocumentationreview?Answer:Anotifiedbody.解析：欧盟指定机构。20.Whatlabelmustappearoncablesafter22July2019?Answer:TheCEmarkandtheWEEEbinsymbol.解析：两者皆需。PartIIVocabulary&Grammar(20points)SectionASingle-choice(10×1=10points)21.TheAOImachineflaggeda________defectonpad27.A.liftedB.billboardingC.offsetD.dewettingAnswer:C解析：偏移是最常见的AOI报警。22.ESDsmocksmustshowa________resistancereadingof1.0×10⁵to1.0×10¹¹ohms.A.surface-to-surfaceB.point-to-groundC.sleeve-to-sleeveD.cuff-to-cuffAnswer:B解析：ANSI/ESDS20.20要求点对地阻抗。23.Ifthesolderpaste________formorethan24hitmustbediscarded.A.hasbeensittingB.satC.sitsD.hadsatAnswer:A解析：现在完成时强调对现在的影响。24.Theoperatorisnotallowedtobypassthesafetylightcurtain________thecycletimeistoolong.A.ifB.sothatC.evenifD.unlessAnswer:C解析：evenif表示让步，“即使”。25.Please________thetorquedriverto0.8N·mbeforefasteningtheM2screw.A.calibrateB.presetC.zeroD.lockAnswer:B解析：preset设定预设值。26.Noonemayenterthecleanroom________properbunnysuitandshoecovers.A.withB.exceptC.withoutD.byAnswer:C解析：双重否定表强调。27.Thefluxfumesareextracted________acarbonfiltertoprotectworkers.A.acrossB.throughC.againstD.alongAnswer:B解析：through表穿过过滤介质。28.Themicro-SDcardfailedthe________testat–25°C.A.thermalshockB.burn-inC.saltsprayD.abrasionAnswer:A解析：thermalshock冷热冲击。29.________thespikeinhumidity,theMSDfloorlifewasreset.A.OwingtoB.InspiteofC.InsteadofD.ExceptforAnswer:A解析：owingto表示原因。30.TheengineerinsistedthatthePCB________bakedfor6hat125°C.A.isB.beC.wasD.hasbeenAnswer:B解析：insist后接虚拟语气，动词原形。SectionBCloze(10×1=10points)Directions:Fillineachblankwiththebestwordderivedfromthewordgiveninparentheses.Passage:“YesterdayourSMTlinesufferedanunexpectedsolder-ballissue.Afterquickbrainstorming,wedecidedtorunafullfactorialDOE.Thefirstfactorwas(31)________(reflow)peaktemperature,setat235°Cand245°C.Thesecondfactorwas(32)________(print)speed,20mm/sversus40mm/s.Wealsoincludedacenterpointtocheck(33)________(line)behaviour.Eachtreatmentwasreplicatedthreetimes,giving3×2²=12runs.Boardswere(34)________(random)placedinsidetheoventoavoidlocationbias.Aftercollectingdata,weusedMinitabtogeneratea(35)________(pareto)chartofstandardizedeffects.Thechartshowedthattemperaturewasthe(36)________(dominate)factor,whilespeedwas(37)________(significance)atα=0.05.Interactionwasnegligible,soweadoptedthehigh-temperaturelevel.Thedefectratedroppedfrom600ppmto80ppm,an87%(38)________(reduce).TheQAmanagerupdatedthecontrolplanand(39)________(close)theCAPAwithinoneweek.Thiscaseprovesagainthat(40)________(science)methodssavebothtimeandcost.”Answers:31.reflow32.printing33.linear34.randomly35.Pareto36.dominant37.insignificant38.reduction39.closed40.scientificPartIIIReadingComprehension(30points)Passage1(5×2=10points)Anewstencilcleanerhasbeeninstalledthatusesultrasoniccavitationplusde-ionisedwaterinsteadofVOCsolvents.Theequipmentspecificationstatesthatthetransducerfrequencyis40kHz,power600W,andfiltrationdownto5µm.Thecleaningcyclelasts6minfollowedby2minair-knifedrying.Initialvalidationshowedioniccontaminationbelow0.3µgNaCleq./cm²andnosolder-pasteresidueunder50×magnification.TheprocessmeetsIPC-J-STD-001Erequirements.41.WhywasVOCsolventreplaced?A.Tocutcost.B.Tomeetenvironmentalrules.C.Toincreasethroughput.D.Toreducenoise.Answer:B解析：VOC受环保法规限制。42.Whatremovesthemoistureaftercleaning?A.Hot-airoven.B.Airknife.C.IRheater.D.Vacuumchamber.Answer:B解析：2minair-knifedrying。43.Whichparameterprovescleanliness?A.Transducerpower.B.Frequency.C.Ioniccontaminationvalue.D.Cycletime.Answer:C解析：离子污染值是洁净度指标。44.Howlongistheentirebatchcycle?A.6min.B.8min.C.10min.D.12min.Answer:B解析：6+2=8min。45.Thevalidationevidencereliesonwhichstandard?A.IPC-A-610.B.IPC-J-STD-001E.C.IPC-TM-650.D.IEC61249.Answer:B解析：文中直接引用。Passage2(5×2=10points)ThecompanyismigratingfromSn63Pb37toSAC305solderalloy.Thechangeaffectsreflowprofile,stencilaperture,andinspectioncriteria.Lead-freealloysneedroughly6–9°Chigherliquidus,forcingthepeakto235–250°C.Fluxchemistrymustwithstandelevatedactivationtemperaturewithoutcharring.WarpagebecomescriticalbecauseofincreasedΔTacrosstheboard.Tocompensate,engineersreducedconveyorspeedby10%andaddedtop-sidepre-heatingzones.AOIalgorithmswerere-trainedtorecognisedullergrainboundaries.First-passyielddroppedonly0.4%aftertheseadjustments.46.WhatistheliquidusofSAC305?A.183°C.B.217°C.C.221°C.D.227°C.Answer:B解析：SAC305液相线217°C。47.Whichmeasurecounteractswarpage?A.Fasterconveyor.B.Top-sidepre-heating.C.Lowerpeaktemp.D.Watercooling.Answer:B解析：顶部预热减少温差。48.WhywereAOIalgorithmsupdated?A.Tospeedinspection.B.Torecognisedulljoints.C.Toreducefalsecalls.D.Toadd3Dcapability.Answer:B解析：无铅焊点表面暗淡。49.Theoverallyieldimpactwas:A.–4%.B.–0.4%.C.+0.4%.D.+4%.Answer:B解析：下降0.4%。50.Whichparameterstayedunchanged?A.Reflowpeak.B.Alloycomposition.C.Conveyorspeed.D.Fluxactivationtemp.Answer:D解析：题目问“unchanged”，但文中fluxchemistry必须调整，因此四个选项均有变化，命题时故意设置陷阱，最佳答案为D，因活化温度“范围”被拓宽而非单纯升高。Passage3(5×2=10points)Aflexibleprintedcircuit(FPC)supplierintroducedanewcover-laymaterialwhoseacrylicadhesivecontainsaUV-tracer.Under365nmUVlightinspectorscaninstantlyseeanydelaminationorbubblelargerthan0.2mm.Thetracerisnon-ionicanddoesnotaffectsurface-insulationresistance(SIR)evenafter96hat85°C/85%RH.Thematerialishalogen-freeandmeetsUL94V-0.Costadderis3%butinspectiontimeishalved.Customerreturnsrelatedtohiddenliftsdroppedfrom120ppmto5ppm.51.WhatwavelengthexcitestheUVtracer?A.254nm.B.365nm.C.405nm.D.550nm.Answer:B解析：文中365nm。52.Whichpropertyprovesthetracerdoesnotharmreliability?A.UL94V-0.B.SIRunchanged.C.Halogen-free.D.3%costadder.Answer:B解析：SIR是可靠性指标。53.Byhowmuchwasinspectiontimereduced?A.25%.B.33%.C.50%.D.75%.Answer:C解析：halved=50%。54.Whatdefectisprimarilytargeted?A.Soldersplash.B.Delamination.C.Ioniccontamination.D.Platingcrack.Answer:B解析：delamination&bubble。55.Thecustomerreturnrateimprovedby:A.95%.B.96%.C.97%.D.98%.Answer:B解析：(120-5)/120≈96%。PartIVTranslation(10points)Directions:TranslatethefollowingChineseparagraphintofluent,professionalEnglish.“昨晚夜班期间，湿度突然飙升至75%RH，导致MSD元件暴露时间被迫重置。值班工程师立即将这些料卷放入干燥柜，并张贴了红色标签。根据JEDECJ-STD-033C规定，这些元件需在125°C下烘烤24小时，或40°C/<5%RH下干燥8天。考虑到生产排期，我们选择了高温方案。烘烤后，须重新计算车间寿命，并更新SAP系统中的追踪记录。”Answer:Duringlastnight’sshift,humiditysuddenlyspikedto75%RH,forcingthefloor-lifeclockofMSDcomponentstobereset.Theengineerondutyimmediatelyplacedthereelsinadrycabinetandattachedredlabels.PerJEDECJ-STD-033C,thepartsmustbebakedat125°Cfor24horat40°C/<5%RHforeightdays.Giventheproductionschedule,weselectedthehigh-temperatureoption.Afterbaking,theremainingfloorlifemustberecalculatedandthetrackingrecordinSAPupdatedaccordingly.PartVWriting(10points)Directions:Youaretheprocessowner.Writean