手机基本结构介绍课件

1、手機的基本結構介紹內容提要一. 手機基本結構介紹;二. 手機零件介紹;三.手機設計開發流程簡介;四.手機測試驗證簡介手機基本結構介紹手機結構魚骨圖介紹;手機結構爆炸圖分析; . 翻蓋型手機 (Clam Phone) . 直板型手機 (Candy bar )天線模組連接器模組(I)電路板模組 IML機殼多媒體卡連接器Shielding Can電路板(PCB)SIM卡連接器天線組件振動器按鍵模組顯示模組塑膠機殼模組遮蔽模組手機機構組件 EMI 墊片開關/接鍵 IMD機殼 EMI處理多色異材設出 鏡片 防塵墊單色烤漆 雙色烤漆 電鍍處理 IML key Pad Plastic+Rubber Mult

2、i-point molding Laser刻字LCD連接器Rubber SD卡連接器電池連接器 電源插口 語音插口腔 輸入輸出端口多色射出(異材)主動元件被動元件Camera其子電子元件LCDTouch Screen 陣列天線EMI Form IN Place麥克風Speaker面型天線線型天線Shielding StripEMI SputteringEMI housingEMI Gasket反射薄膜光源Light guide Metal dome振動器連接器連接器模組(I)麥克風連接器觸摸開關Volume連接器Speaker連接器7手機機構組件魚骨圖手機結構爆炸圖分析-翻蓋型專案名稱: ZU

3、MA 市場定位 : High tier 自動翻蓋手機 (2.0M CameraMP3AGPS BLUTOOTH)產品客戶: Spring Nextel / Boost MobileAnt_launch_holderAnt_launchBaker_Side_button_ (with adhesive)Side ButtonTop ButtonSpeak_grill_leftvibratorMain_PCBSD_connectorAGPS_carrierAGPS elementHousing_frontSpeaker Felt RightSpeaker Felt LeftMain_keypadS

4、peaker Grill_ rightSwitch_PTT Button Mylar-Antenna_Blue_toothAntenna_Blue_tooth_carrierLatch_SIM DoorDoor_SIM ConnectorBase Screw Plug LeftAntennaBacker_TOP Button(with adhesive)HingeHinge Push Button (with adhesive)Hinge Push Button CapSwitch_Buttons TOP MylarSD_Baker(with ADH)Backer_SIM(with adhes

5、ive)Base_flexSpeaker-HSGSeal_ Back AcousticBattery FloorPin_SIM ConnectorADH_speaker_HSGBase Screw Plug RightBase Screw (4)Antenna_screwSpring_Battery Door LatchBattery_cover_HSGAudio jack sealSeal_Accessory ConnectorLatch_Battery CoverBatteryHousing_backSpeaker(with adhesive)Housing_Audio jack conn

6、ectorBattery bumper-Main_keypad_MylarZUMA_bottom_viewZUMA_top_viewLens_ InnerADH_Lens_ InnerScrew_flip(4)Transducer_feltmagnetFlip_inner_HSGCamera_shieldTransducercameralens Flip_outerFlip_outer_HSGMp3_Button_downBoost logo light guideFelt_ Flip outer(with_adhesive)Grill_flip_outerLens_flashOuter_Le

7、ns_ADHCamera_ PORON_ pad(with adhesive)(2)Camera _lens_adhesiveLCD_bezelSuper_flex_bareTransducer_GrillCamera _lensPORON_CID(with adhesive)Bushing_screw_insert(4)_HOS_pad(with adhesive)Mp3_Button_down_MylarMp3_Button_up_MylarMp3_Button_upCID-LCD_ASSLCD_bezel_poron(with ADH)手機結構爆炸圖分析-直板機專案名稱: Kingfis

8、her II市場定位 : Low Tier (帶AGPS功能)產品客戶: Boost MobilelensFront housingSide keyMic_asmKey padTransducer asmLcd gasketMain PCBJack sealAcoustic sealspeakerVibrator asmAntenna capGPS antennaBack housingBattery doorSim_trayBump GPS stopperAntenna CoilAntenna cushionFelt speakerLCD moduleLCD frameKingfisher

9、2 master assembly 手機零件介紹Unique parts -Plastic parts; -Metal parts ; -Die cut parts; -Rubber parts;Common parts -Electric ModulePlastic parts - uniques常用材料:一般採用PC, PC+ABS, IXEF, Thermotuf, PMMA, ABS 等等; 主要應用零件: 殼體類零件, 支架類零件, 導光件, 鏡片等等;製造工藝: 主要是模具射出成型; 表面處理一般用烤漆,電鍍,電鑄,IML/IMD,燙印,水轉印,移印等等;尺寸型狀要求:形狀較複雜,

10、 尺寸精度較高.Metal parts - uniques常用材料: 不鏽鋼板材,鎂合金,鋁合金,線材,鍍鋅板等等;主要應用零件:殼體類零件, 支架類零件, 屏蔽罩,彈簧,軸類以及螺絲等等;製造工藝: 沖壓成型,壓鑄成型,機加工等等;表面處理一般用電度,陽極,拋光,拉絲,蝕刻,移印,鑽雕等等;尺寸形狀要求:形狀可以較複雜,尺寸精度較高.Rubber parts - uniques常用材料:Silicon rubber, TPU等等;主要應用零件: 按鍵, 密封件,緩衝件,以及用於雙色成型等等;製造工藝: 注射成型,模壓成型 等等;表面處理一般用烤漆,鐳雕等等;尺寸形狀要求:形狀可以較複雜,但尺

11、寸精度一般.Die cut parts - uniques常用材料:泡棉,背膠,貼紙,薄塑膠板材,保護膜,Film 等等;主要應用零件: 密封件,緩衝件, 外觀貼紙標簽, 表面保護膜等等;製造工藝:模具沖切,鐳射切割;尺寸形狀要求:形狀簡單;模具沖切的尺寸精度較低,鐳射切割的精度高,但成本也高,不具備量產性能.Electrical module - common partsEM 零件-電子機構件,電子和結構同時管控的零件.具體如下:Audio Jack-音頻接口Battery connector-連結電池和主板,電池給主板供電Battery charge connector-充電器和數據線接口

12、.Electrical module - common partsKeypad Mylar Dome-Keypad switch, 按鍵開關Mylar+Adhesive+Dome Mic-麥克風, Electrical module - common partsFlex-軟板,起柔性連結作用.SD connector-SD卡基座Electrical module - common partsSIM connector-SIM 卡連接器.Vibrator-震動馬達, 手機震動 時動力來源.Speaker-喇叭Electrical module - common partsCamera Flash

13、-攝相頭閃光燈Camera socket-攝相頭基座Hinge Flex-軟板,起柔性連 結作用.Electrical module - common partsCID-(Call Indicator Display) 外部顯示屏Camera-攝相頭Transducer-(Receiver) 音蘋 轉換器.Electrical module - common partsLCD-(Liquid crystal display) 主顯示屏手機設計開發流程簡介Pre _ Master file received from MotorolaFeasibility study/ Conceptdesig

14、nRefine / Complete ID master fileAAR (Architecture Acceptance Review)Concept design reviewID master lockdownID Rendering ID Rendering lockdownCMF CMF Sign offDetail designAnalysis (Interference check, TA, simulation, etc)CDR (Critical design review)Final design reviewTooling releaseProcess check (SO

15、P / fixture checkMock up samplesID master lockdownFOTAssemble (LV/LX)ABC/ALT TESTPilot buildRamp upSAdatabase changesECNDMAIC/ANALYSISProcess check (SOP / fixture check手機可靠性驗證 可靠性驗證是手機設計開發過程中必不可少的環節, 它是通過在惡劣環境下加速老化來檢測手機和零件的性能. 手機可靠性驗証簡介溫濕度,鹽霧,滴水,輻射,砂塵按鍵,轉軸耐久性測試跌落,彎曲, 振動通訊信號參數檢驗手機開發 驗證測試 耐久測試環境測試電學測試機械測試 手機驗証項目(環境應力驗證) 高溫試驗 低溫試驗 高溫高濕試驗 溫濕度循環試驗 冷熱沖擊試驗 陽光老化試驗 冷凝試驗 鹽霧試驗 雨淋試驗 砂塵試驗 紫外光試驗 抗化學試驗 手機驗証項目(機械應力驗證) 振動沖擊試驗 自