ANALYSIS TECH 半导体微电子热阻导热系数测试仪

1、AnalysistechPhase11半导体热阻分析仪、AnalysisTechPhasellPhaselO概述ANALYSISTECH半导体热分析仪SemiconductorThermalAnalyzer热阻测试仪中国MICOFORCE米力光CO供应,由美国AnalysisTechInc公司的PHASE10PHASE11热阻测试仪电子封装器件，符合美军标和JEDEC标准.AnalysisTechInc.成立于1983年，坐落于波士顿北部，是电子封装器件可靠性测试的国际设计，制造公司。他的创始人是JohnW.Sofia，美国麻省理工的博士，并且是提出焊点可靠性,热阻分析和热导率理论的专家.发表

2、了很多关于焊点可靠性，热阻分析和热导率论文.AnalysisTechInc在美国有独的实验室提供技术支持。热阻分析仪Phase11主要用于二极管、三极管、线性调压器、可控硅、LED、MOSFET、MESFET、IGBT、IC等分立功率器件的热阻测试和分析。二、AnalysisTechPhase11Phase10工作原理及测试过程Phase11采用油浴法测定热敏参数校正曲线。在通以感应电流结还没有明显产生热量时，如果给定足够的时间，结温和壳温将达到热平衡，壳温非常接近结温。将热电偶直接连接到器件表面采集数据时，油浴将充分保证器件的温度稳定并且使热电偶采集的温度等于感应结温。在这个环节中，感应电流

3、大小的选择是很重要的。感应电流过大，会导致结温明显变化；感应电流过小，会导致正向压降值测量误差较大。Phase11感应电流的可选范围是0.1mA50mA，完全符合JEDEC标准。在加热器件的过程中，Phase11采用了脉冲加热方式，如下图所示：d.u.t.UeatingCurrisintParas=iticCopacitonesTj=m*Vf4TOElectrofticSwitchHcaHngSnseCurrentFEjj=(Tj-l3)/(vI)加热电流和感应电流通过电子开关切换的方式轮流工作。每加热15秒，测量1次热敏参数，即获得1个结温值，测量完之后继续加热，加热15秒，再次测量结温值，

4、如此反复工作。在这个过程中，系统将每次测量到的结温值和前面7个结温值进行比较，如果连续8个结温值相同，系统会判定器件达到热平衡，并计算出稳态热阻值。如果用户需要得到热阻热容曲线，只需要将电子开关锁定在测量端即可。此时，因为没有了加热电流，器件开始降温，通过监测器件电压可以得到一条温度下降的曲线，进而通过一系列数学变换得到热阻热容曲线以及瞬态热阻抗曲线。Umn4cii三、AnalysisTechPhase11PhaselO技术指标0加热电流测量精度（低电流测量：0.2A,1A和2A测量）2A系统：1mA,10A系统：5mA,20A系统：10mA0加热电流测量精度（高电流测量：2A,10A和20A

5、测量）2A系统：4mA,10A系统：20mA,20A系统：40mA0加热电压测量精度：0.2%读数0.025%量程0热电偶测量精度（T型）：典型土0.1C，最大0.3C0结温测量精度：典型0.1C0结温测量延迟时间：1us0设备工作电压：220VAC,3A,50/60HZ0器件的最大供电电压：5V（选配PowerBooster可以扩展到100V）0器件的最大供电电流：2A,10A,20A（选配PowerBooster可以扩展到1000A）0结温的感应电流：1mA,5mA,10mA,20mA,50mA,0.150mA可设定四、附件介绍1、Nuova校准浴锅用来得到节电压和结温的函数关系即K值。产

6、品特点：1）由集成在热阻分析仪中的模块直接进行温度控制2）使用有陶瓷镀层的磁力搅拌器3）带有冷却风扇的坚固底盘能够控制升温速率并保证安全性4）有盖的四升不锈钢水浴锅5）悬挂结构支持部件被校准6）四升绝缘良好的导热矿物油，对环境无害并能重复使用2、EVN12静止空气测试箱EVN-12是用于在标准化的静止空气环境中测试元件。自然对流条件下的热阻测量会对实验室里的不期望的空气流动非常敏感。这套静止空气测试箱可以排除这种潜在的产生测试错误的因素。3、风洞相对于静止空气测试箱,伺服控制风洞提供了一个强制对流、均匀一致的测试环境。在测试对气流比较敏感的器件时，我们能够更加准确地测量出器件在不同风速下的热阻

7、。4、Rjc测试夹具（风冷型）风冷型Rjc测试夹具是一个高性能的风冷型热沉，可以很方便地固定被测器件，是测量JEDEC标准定义Rjc的理想夹具。Rjc测试夹具采用了一种特殊的装置可以准确的测量壳温。5、Rjc测试夹具（水冷型）水冷型Rjc测试夹具需要配合循环冷水机使用，具有散热迅速的特点，通常用来测试IGBT和MOSFET等功率较大的器件。6、Rjb测试夹具完全按照JEDECJESD51-8的要求设计，用来测试结到电路板的热阻。当被测LED的正向压降高于5V,可以选择LED高压放大器，提供28V的测试电压。8、功率放大器叶山瑁舫旳测Pm軻0OO9lr提供高达200A,400A和1000A的加热

8、电流。9、热阻分析仪校准仪溯源到NIST,可以用于热阻分析仪的故障诊断，建议每半年对热阻分析仪做一次校准。10、热电偶校准仪0000000000溯源到NIST,用于对热电偶接口进行校准。五、AnalysisTechPhase11主要特色所有测试数据、图像全屏显示高速数据采集和分析，能对各种类型器件进行测试能够输出常规的数据和文件类型，能将设置参数和数据存储在硬盘上能对操作人员的错误和测试数据的有效性进行连续监测四线制测试方法排除测试导线电阻的影响兼容IEEE488和RS-232C通讯方式，测试方法遵循MIL&JEDEC标准根据电流、功率或ATJ对器件的功率进行自动控制，用户选择热平衡的监测方法

9、对附属设备进行自动控制，对集成电路和多芯片模块有多结探测能力三个内部参考热电偶，能通过红外线对器件表面的温度进行测试有标准和常规的测试夹具，设备校准方便AnalysisTechThermalAnalyzersmeasuresemiconductorjunctiontemperaturesusingtheelectricmethodofjunctiontemperaturemeasurementfortestingalltypesofsemiconductordevices.Thiscapabilityisthefoundationofnumeroustestmethodsincluding:t

10、hermalresistance,transientthermalimpedance,dieattachscreeningandfunctionalpowercycling.Theconvenientflexibilityoftheanalyzeralsofacilitatesinterconnectedcontrolofotherlaboratorytestequipment.SemiconductorThermalAnalyzersperformthermalmeasurementsonalltypesofpackagedsemiconductordevicesincludingdiode

11、s,LEDs,bipolartransistors,MOSFETs,functionalanalog/digitalintegratedcircuits,ACSICS,IGBTs,SCRs,TRIACs,andthermal-test-dies.AllproductsofferedconformtoapplicableJEDECandMILStandards.Usingtheelectricalmethodofjunctiontemperaturemeasurement,AnalysisTechThermalAnalyzersaccuratelymeasurecomponentthermalp

12、arameters-essentialfordesignandimplementationofthermallyreliableelectronics.Inadditiontoequipmentsales,AnalysisTechoffersComponentTestServicesforthermalcharacterizationofsemiconductordevicesatourfactorytest-laboratory.Thistypeoftestequipmentisalternatelyknownas:semiconductorthermalresistancetesters,

13、semiconductorthermalimpedancetesters,componentthermalresistancetesters,componentthermalimpedancetesters,dieattachtesters,dieattachmenttesters.TheAnalysisTechThermalAnalyzerPhase11providescomprehensiveautomatedcontrolofsemiconductorthermalmeasurementsforproductionanddevelopmenttestingwithpowerfulfeat

14、uressuchas:AllTestModes:Testcapabilitiesforalldevice-types:diodes,LEDs,bipolars,MOSFETs,IGBTs,functionalICs,thryistors,thermaltestdiesAutomatedhighspeeddatacollection,reduction,andanalysisCompatiblewithall750EMilStdsandJEDEC51SeriesmethodsDataplotsforalltestparametersinalltestsmodesSimple,automatedi

15、n-labinstrument-calibrationproceduresVarioustextandgraphicsfileformatsforconvenientexportingContinuousintelligentmonitoringforerrorsanddatavalidityKelvin(4-wire)connectionstoeliminatetestcableresistanceseffectsCompatibilitywithUSB,IEEE488,andRS-232Ccommunications10/100EthernetNICinterfaceTestmethods

16、compatiblewithMIL&JEDECteststandardsSelectionofautomaticpower-controlbycurrent,wattage,andATjStandardandcustomtestfixturingavailableWindowsXPProoperatingsystemSteadyStateThermalResistanceMode:Multi-junctiontemperaturesensingcapabilityforICs&multi-diedevicesUser-selectablethermalequilibriumcriteriaBa

17、tch-modefordeterminingpowerlevelandairfloweffectsControlofaccessorylaboratoryequipmentforintegratedtesting-InfraredcasetemperaturemeasurementcapabilityCapabilityforautomaticallyswitchingthedeviceundertestDieAttachorPowerPulseMode:Pass/Failorbinsortingbasedondie-attachqualitySerializedparttestingData

18、plotsofallparametersincludingdie-attachhistogram-Extended-lifetestingwithintersperseddie-attachtestingInterfaceformechanizeddevicehandlersBatchmodedie-attachmentproductiontestingmulti-chipmodulesHeatingCharacterization/TransientThermalImpedanceMode:Heatingandcoolingcurvetime-resolution:1microsecondH

19、eatingandcoolingcurvespan:1microsecond-10,000secondsHeatingandcoolingcurvepoints-per-decadeplotted:15Utilizestime-constant-spectrumandstructurefunctionanalysesOptimizedcompactdynamicRCmodelswith2-8discretestagesMultipleSense-JunctionChannelsUptoeightjunctiontemperaturescanbesimultaneouslysensedforte

20、stingdeviceswithmultiplejunctionsandforcharacterizingmulti-chippackagesormodules.Inmultiple-diepackages,thedie-to-dieheating(thermalcross-coupling)mustbemeasuredtoaccuratelycharacterizethesetypeofpackages.Fortestingfunctionalintegratedcircuits(ICs),multiplesensejunctionsoffervalidationofthejunctiont

21、emperature(Tj)readingsininstanceswheresomeoftheTjsenseconnectionsaresubjecttothespuriouselectricaleffectsofotherportionsoftheICcircuitry.Whentestinghybridsandlarge-dieICs,multiplesensejunctionscanrevealtemperaturedistributionsthatoccurwhensubstantialtemperaturevariationsexistwithinthetestdevice.Mult

22、iplesensechannelapplicationsinclude:Multi-diedeviceswheremultipleheatsourcesmayexistThermalcross-couplingassociatedwithmulti-chipdevicesLargerdeviceswhichmayexhibitsubstantialtemperaturegradientsduringnormalpoweredoperationMultiplesensechannelsalsopermitthecalibrationofupto8sensejunctionssimultaneou

23、slyforfastercalibrationthrough-put.BatchModeandBinSortingforPowerPulseTestingAccurateandrapidscreeningofdevicethermalcharacteristicscandramaticallyenhanceproduction-devicereliability.DieAttachmenttestingprovidesanexcellentgaugeofthechipattachment-qualityintermsofthedeviceimpedanee.ThePhase11ThermalA

24、nalyzerprovidesprogrammablerelaydriversforcontrollingexternaldevicesduringPowerPulseTesting.Thesedriversofferthefollowingcapabilities:switchingbetweentestpointsinhybridcircuittestfixturesformultiplesequeneedtestsmanualorautomatichandlercontrolsbinsortingbasedondieattachmenttestresultsThetestswitchin

25、gcapabilityoftheThermalAnalyzerallowsonetestfixturetocarryallthetestconnectionsortest-pointprobesforabatchoftestsrequiredfortestingcomplexhybrids.Thusallsignificantdieattachmentsonahybridcanbetestedwithoneinsertionandonetestinitiation.Binsortingisutilizedindieattachtestingtorapidlysortdevicesbasedon

26、die-attachmentquality.Thebinsortingcontrolcanbeusedwithmanualinsertiontestingorwithautomaticcomponenttransfersystemswhichwouldinsertdevicestobetestedintotestfixturesandsubsequentlyejectthetesteddeviceintooneofuptoeightbins,(seeDieAttachTestinginProductionEnvironments)AccessoryEquipmentControlPortsFr

27、equently,devicethermalperformancemustbeevaluatedoverarangeofexternalconditions.Suchconditionsmightincludecoolingairflow,ambientoperatingtemperature,coolantflowrate,ortheheatingsupplyvoltage.TheThermalanalyzercancontrolaccessorytestequipmentviaUSB,IEEE,orserialcommunicationtoachieveintegratedbatchtes

28、tingunderawiderangeofexternalconditions.TheAnalysisTechaccessoryBatchSwitchingModuleprovidesaconvenientmeanstoswitchthedevice-under-testsothatmanydevicescanbetestedsequentiallyinbatchmode.ThesimplesetupandcontrolproceduresoftheThermalAnalyzersallowthetestengineertoinitiateupto200testsinbatchmode.Tes

29、tsaresuccessivelyexecutedautomatically:asatestreachescompletion,theexternalconditionisincrementedandthetestcyclerepeateduntilthebatchoftestsiscompleted.Oncethesebatchtestshavebegun,datareportingandaccessoryequipmentcontrolareautomaticallycoordinated.TheAnalysisTechperformsavarietyofsemiconductorther

30、maltestscontrolledfromapowerfulWindowsbasedoperatingprogramandcontinuous-displayfrontpanelmeters.Theconvenientuser-interfacefacilitatescompletethermalcharacterizationforanytypeofsemiconductordeviceorpackagetypeaccordingtoMilStd750EandJEDEC51Seriesmethods.ThePhase11ThermalAnalyzercanbeeasilyconfigure

31、dtoperformtestsonawiderangeofdevicetypesincludingdigitaloranalogfunctionalintegratedcircuits,thermaltestdice,bipolartransistors,diodes,MOSFETS,IGBTS,thyristors,andASICs.Duringtesting,comprehensivegraphicdata-displaysoffersuperbdetailonalltestdata,thuspromotingconfideneeandunderstandingofthetestresul

32、ts.Allsemiconductorjunctiontemperaturesareaccuratelymeasuredusingtheelectricalmethod.Partscanbetestedbysimplyselectingthepart-specificSetupFilewhichincludesallofthenecessarytestparametersforthedesiredtestmethod.TestdataisstoredonthePCharddiskincludingfinalnumericaldatasuchasthermalresistanee,powerle

33、vels,refereneetemperatures,aswellasdataplots,andpass/failevaluations.TextandgraphicfilescanbestoredinvariousfileformatsasneededforexporttootherWindowsapplications.Anetworkconnection(NIC)isprovidedsothattestdatacanbearchivedtoyourLAN.TheAnalysisTechPhase11ThermalAnalyzerprovidesmanualorautomaticheati

34、ngpowercontrol.Threethermocouplesrefereneetemperaturesportsareprovidedformeasurementofexternalpackagetemperaturessuchcase,lead,etc.Thermalequilibriumisautomaticallydetectedbasedonavarietyofuser-selectablecriteria.Real-timedataplotsandtabulardisplaysarereadilyaccessibleastestingproceeds.BatchModetestingoffersautomaticsequencingoftestswithalternatepowerlevels,differenttest-devices,orvariedenvironmentalconditionssuchasambientairflowspeedortemperature.ThePhase10/11Calibratoroffersapowerfulandconvenientmethodforannualorbi